Indium phosphide is one of the most promising candidates among the available III-V semiconducting compounds for the development of MIS technology. This is based on the availability of InP substrates and the relatively large band gap. Before the deposition of the insulator, the InP surface must be treated and well passivated (Surf Interface Anal 20 (1993) 803; J Appl Phys 67 (1990) 4173). We have shown that a InSb buffer layer can reduce the phosphorus atom migration and the concentration of defects at the interface. We have studied and characterized electrically two series of substrates using p-type InP, the first one with thin and the second with thick insulator films. The results obtained show clearly the reduction of the defects in the thicker structures protected by the InSb buffer layer.