P-type Films Research Articles

Sputter-Deposited copper iodide thin film transistors with low Operating voltage

This paper reports on a back-gated p-type thin film transistor (TFT) with copper iodide (CuI) as the channel material, a HfO2 gate dielectric layer, and Al2O3 passivation. The γ-CuI channel was deposited from a CuI target using DC magnetron sputtering at room temperature. Our TFT can be fully shut off by VG = 4 V, with a field-effect channel hole mobility μh ∼ 1.5–2 cm2 V−1 s−1. An anneal in forming gas was performed twice, once at 200 °C, then at 250 °C to improve gate control, yielding a final Ion/Ioff current ratio of ∼ 250. The anneal served two purposes: to reduce the oxygen acceptor density in the CuI channel and reduce the concentration of interface states between the CuI, Al2O3 passivation, and HfO2. A model of the device was built in an industrial TCAD simulator, which reproduces the measured characteristics and allows an estimation of interface state densities and channel doping.

Substrate Induced p-n Transition for Inverted Perovskite Solar Cells.

The p- or n-type property of semiconductor materials directly determine the final performance of photoelectronic devices. Generally, perovskite deposited on p-type substrate tends to be p-type, while perovskite deposited on n-type substrate tends to be n-type. Motived by this, a substrate-induced re-growth strategy is reported to induce p- to n-transition of perovskite surface in inverted perovskite solar cells (PSCs). p-type perovskite film is obtained and crystallized on p-type substrate first. Then an n-type ITO/SnO2 substrate with saturated perovskite solution is pressed onto the perovskite film and annealed to induce the secondary re-growth of perovskite surface region. As a result, p- to n-type transition happens and induces an extra junction at perovskite surface region, thus enhancing the built-in potential and promoting carrier extraction in PSCs. Resulting inverted PSCs exhibit high efficiency of over 25% with good operational stability, retaining 90% of initial efficiency after maximum power point (MPP) tracking for 800h at 65°C with ISOS-L-2 protocol.

Performance evaluation of p-type Cr2O3 thin films grown by reactive DC magnetron sputtering for Schottky diode applications

Abstract In this study, we present a comprehensive investigation into the impact of combined oxygen and argon flow rates on the physical properties of Cr2O3 thin films produced via reactive DC magnetron sputtering. Additionally, we explore the influence of oxygen flow rate on various aspects, including structural, morphological, optical, chemical, and electrical characteristics of the sputtered Cr2O3 thin films. Our analysis, based on XRD results, reveals the polycrystalline nature of the films. Surface morphology was examined through scanning electron microscopy. Optical analysis indicates a band gap ranging from 2.70 eV to 2.99 eV for the films. X-ray photoelectron spectroscopy analysis shows the splitting of Cr 2p core spectra into Cr 2p3/2 and Cr 2p1/2 domains within the range of 573 eV to 585 eV, alongside the presence of satellite peaks. Moreover, extracted electrical properties reveal the p-type conductivity of the deposited Cr2O3 thin film under various oxygen flow rates. Furthermore, we fabricate and characterize an ITO/p-Cr2O3/Al Schottky diode to provide additional insights into p-Cr2O3/Al Schottky diodes. Overall, this study contributes valuable insights and enhances our understanding of Cr2O3 thin film properties, particularly in the context of semiconductor devices like Schottky diodes.

Structure and electrical properties of polysilicon films doped with ammonium tetraborate tetrahydrate

Here, p-type polysilicon films are fabricated by ex-situ doping method with ammonium tetraborate tetrahydrate (ATT) as the boron source, named ATT-pPoly. The effects of ATT on the properties of polysilicon films are comprehensively analyzed. The Raman spectra reveal that the ATT-pPoly film is composed of grain boundary and crystalline regions. The preferred orientation is the (111) direction. The grain size increases from 16−23 nm to 21−47 nm, by ~70% on average. Comparing with other reported films, Hall measurements reveal that the ATT-pPoly film has a higher carrier concentration (>1020 cm−3) and higher carrier mobility (>30 cm2/(V·s)). The superior properties of the ATT-pPoly film are attributed to the heavy doping and improved grain size. Heavy doping property is proved by the mean sheet resistance (R sheet,m) and distribution profile. The R sheet,m decreases by more than 30%, and it can be further decreased by 90% if the annealing temperature or duration is increased. The boron concentration of ATT-pPoly film annealed at 950 °C for 45 min is ~3 × 1020 cm−3, and the distribution is nearly the same, except near the surface. Besides, the standard deviation coefficient (σ) of R sheet,m is less than 5.0%, which verifies the excellent uniformity of ATT-pPoly film.

Deviceization of high-performance and flexible Ag2Se films for electronic skin and servo rotation angle control

Ag2Se shows significant potential for near-room-temperature thermoelectric applications, but its performance and device design are still evolving. In this work, we design a novel flexible Ag2Se thin-film-based thermoelectric device with optimized electrode materials and structure, achieving a high output power density of over 65 W m−2 and a normalized power density up to 3.68 μW cm−2 K−2 at a temperature difference of 42 K. By fine-tuning vapor selenization time, we strengthen the (013) orientation and carrier mobility of Ag2Se films, reducing excessive Ag interstitials and achieving a power factor of over 29 μW cm−1 K−2 at 393 K. A protective layer boosts flexibility of the thin film, retaining 90% performance after 1000 bends at 60°. Coupled with p-type Sb2Te3 thin films and rational simulations, the device shows rapid human motion response and precise servo motor control, highlighting the potential of high-performance Ag2Se thin films in advanced applications.

Electrical properties and evaluation of band tail states in Mg doped p-type multilayer hBN

A series of Mg doped p-type multi-layered hBN films were prepared by atmospheric pressure chemical vapor deposition. Temperature dependent conductivity measurements were performed from 0.1 Hz to 10 MHz to analyze the characteristics of tail states close to the valence band edge. Jonscher's power law (Aωs) is successfully applied to understand charge carrier transport through these states. In this work, exponent S increases from 0.6 → 0.8, 0.8 → 0.995, and 1.4 → 1.6 for samples B (precursor temperature, 750 °C), D (850 °C), and E (900 °C), indicating that non-overlapping small polaron tunneling dominates to 548 K. Polaron binding energies of 0.2–0.40 eV and tunneling distances <4.9 Å are calculated, confirming transport through localized states. The density of states near the Fermi level N(EF) was extracted from a fit to the AC conductivity data, yielding values of 1015 and 1017eV−1cm−3 as the precursor temperature increases. Singular Mg acceptor levels of 74, 30, and 17 meV are identified for each sample. A hole concentration from 6.5 × 1017 to 1 × 1018 cm−3 and carrier mobility from 18 to 25 cm2/V s is measured at 300 K. From RC fitting, carrier recombination lifetimes of 1.2, 0.4, and 0.35 μs are determined. Fermi's golden rule is used to determine an optical joint density of states of 1.1 × 1021 eV−1 cm−3 at a band edge. Overall, we show that AC conductivity is an effective method to evaluate midgap states in 2D (two-dimensional) materials at EF and p-type hBN possesses sufficient electrical properties to be integrated into a wide range of semiconductor applications.

Near stoichiometric-ratio Mg3Sb2 thermoelectric thin films fabricated via multi-step annealing strategies

Recently, Zintl Mg3Sb2-based compounds have attracted attention due to high thermoelectric performance, but most studies are concentrated on bulk materials with few on films and devices, limiting their applications for microelectronics. Here, p-type Mg3Sb2 films near stoichiometric-ratio are successfully fabricated using the multi-step experimental strategies based on the magnetron sputtering method. By tuning the energy structure and carrier transport, their thermoelectric performance is significantly improved, with a power factor up to 258.64 μW m−1 K−2 at ∼623 K. A Mg3Sb2-based generator is fabricated using these films, representing the first report of such a device. The output performance of this generator is evaluated and its power density is found to reach 9.4 μW cm−2 at ΔT of 40 K, showing good potential for powering electronics. Furthermore, the generator shows good stability with no significant change in output properties after storage in air for 40 days or over periodic cycles of high- and room-temperature operation.

Ion migration in p-type perovskite MAPbI3 films under an electric field and thin-film transistor device failure.

This study demonstrated a dynamic analysis to investigate the ion migration in p-type perovskite MAPbI3 films under an electric field, revealing its detrimental effects on the electrical performance of MAPbI3-based devices. An additive strategy was proposed to suppress ion migration, thereby facilitating the fabrication of high-performance MAPbI3-based devices.

Realizing high power factor in p-type BiSbTe flexible thin films via carrier engineering

Realizing high power factor in p-type BiSbTe flexible thin films via carrier engineering

Facile synthesis and characterization of Cu2Se thin films and self-powered p-Cu2Se/n-Si heterojunction with high-performance photoresponse

A facile, cost-effective, and scalable chemical vapor deposition technique was used to synthesize p-type Cu2Se thin films on glass and n-type Si substrates. Thorough characterization confirmed the films’ β-phase structure with the correct stoichiometric ratio and exceptional crystalline quality, exhibiting behavior akin to a degenerate semiconductor. Measurements unveiled a work function of 4.83 eV and a bandgap of 2.13 eV for Cu2Se. The fabrication of a p-Cu2Se/n-Si heterojunction was achieved by depositing the p-type Cu2Se thin film onto the n-type Si substrate. The resulting heterostructure displayed rectification behavior, and its energy band diagram resembled a Schottky diode. Further exploration into its photoelectric properties showcased the p-Cu2Se/n-Si heterostructure’s favorable self-powered attribute, characterized by fast, steady, reproducible, sensitive, and robust photoresponsive performance. Consequently, it proves highly suitable for applications in high-frequency photodetectors. Additionally, the p-Cu2Se/n-Si heterojunction’s photovoltaic power conversion efficiency exceeded the reported values of the CuO/Si and Cu2O/Si systems. Here, this study contributes significantly to the pivotal evaluation of p-Cu2Se/n-Si heterostructures for promising optoelectronic applications.

Enhanced Performance of P-Channel CuIBr Thin-Film Transistor by ITO Surface Charge-Transfer Doping.

The process development and optimization of p-type semiconductors and p-channel thin-film transistors (TFTs) are essential for the development of high-performance circuits. In this study, the Br-doped CuI (CuIBr) TFTs are proposed by the solution process to control copper vacancy generation and suppress excess holes formation in p-type CuI films and improve current modulation capabilities for CuI TFTs. The CuIBr films exhibit a uniform surface morphology and good crystalline quality. The on/off current (ION/IOFF) ratio of CuIBr TFTs increased from 103 to 106 with an increase in the Br doping ratio from 0 to 15%. Furthermore, the performance and operational stability of CuIBr TFTs are significantly enhanced by indium tin oxide (ITO) surface charge-transfer doping. The results obtained from the first-principles calculations well explain the electron-doping effect of ITO overlayer in CuIBr TFT. Eventually, the CuIBr TFT with 15% Br content exhibits a high ION/IOFF ratio of 3 × 106 and a high hole field-effect mobility (μFE) of 7.0 cm2 V-1 s-1. The band-like charge transport in CuIBr TFT is confirmed by the temperature-dependent measurement. This study paves the way for the realization of transparent complementary circuits and wearable electronics.

Annealing of bismuth telluride-based thick films by laser irradiation

Interest towards fabrication and post-processing of thermoelectric micro-sized devices has increased in recent years. The coupling of inexpensive deposition technologies and fast laser treatments on “as-deposited” films is an attractive solution for industrial scalability. In this work, we propose an approach never reported before in literature: the utilization of a ns-pulsed active fibre laser to directly densify p-type bismuth telluride-based thick films deposited on silicon. A feasibility study was conducted on the material to determine optimal laser parameters: the treated products were characterized, and it was concluded that a value of laser fluence as low as 4.5 mJ cm−2 is sufficient for densification. The material resulted cracked after the laser treatment, and it was demonstrated by SEM and profilometric analyses that shrinking occurs and sintering necks are formed; further, the arising of second phases after annealing was excluded by means of XRD analysis. Envisioning an industrial large area process with linear diode arrays source, a prediction of the laser power requirements to irradiate 1 mm2 films in selected conditions is presented. More extensive studies will be performed to determine a narrower parameters window and determine a relationship between the film thickness and laser parameters for future applications to as-deposited films.

High-resolution dynamic thermal programming platform based on micro thermoelectric device assisted by laser integrated manufacturing

Thermoelectric devices (TEDs) exhibit much application potential in thermal camouflage and encrypted display recently, requiring that TEDs possess large responsivity, high resolution and rapid response with flexible configuration design, which are hardly realized by the traditional complex fabrication process. In this work, an innovative laser integrated manufacturing technology including double-side-printing selective laser melting (D-SLM) and selective laser ablation (SLA) is developed for the construction of the dynamic thermal platform based on micro TEDs. Through experimentally determining the laser process window assisted by external temperature field regulation, a flat p-type film can be directly transformed from n-type Bi2Te3 film by D-SLM. Thus, high-precision p-n patterns without metal joints are obtained from a single locally modified film, whose thermoelectric properties are further boosted by increasing energy density and introducing a post-annealing process. Then, a dynamic thermal platform with designable shapes and small dimensions can be fabricated rapidly whose working principle is also demonstrated. The thermal platform with 4*4 arrays exhibits imaging function with a pixel size of 2 mm×2 mm, a temperature difference of ∼3 K, and a fast response time of 0.143 s. This work offers an exciting yet effective approach to fabricating TEDs for dynamic thermal programmable information displays.

High performance Al/WSe2/CuO/ITO structure based broadband photodetector

This letter reports a Al/WSe2/CuO/ITO structure based broadband photodetector. The low cost spin coating technique is utilized to deposit, p-type WSe2 film and n-type CuO film. The Al contacts were deposited over WSe2 film using thermal evaporation unit. The suggested photodetector gives the broad photo response with maximum Responsivity RS (A/W) and External Quantum Efficiency (EQE) value of 3099 A/W, 3680 A/W, and 493 A/W; 1.20 × 106%, 1.52× 106% and 2.04 × 105% at 350 nm (UV), 500 nm (visible) and 950 nm (IR) under application of −2 V bias. The EQE value beyond 100% are attributed to trap assisted photomultiplication mechanism.

High-performance flexible p-type Ce-filled Fe3CoSb12 skutterudite thin film for medium-to-high-temperature applications

P-type Fe3CoSb12-based skutterudite thin films are successfully fabricated, exhibiting high thermoelectric performance, stability, and flexibility at medium-to-high temperatures, based on preparing custom target materials and employing advanced pulsed laser deposition techniques to address the bonding challenge between the thin films and high-temperature flexible polyimide substrates. Through the optimization of fabrication processing and nominal doping concentration of Ce, the thin films show a power factor of >100 μW m−1 K−2 and a ZT close to 0.6 at 653 K. After >2000 bending cycle tests at a radius of 4 mm, only a 6 % change in resistivity can be observed. Additionally, the assembled p-type Fe3CoSb12-based flexible device exhibits a power density of 135.7 µW cm−2 under a temperature difference of 100 K with the hot side at 623 K. This work fills a gap in the realization of flexible thermoelectric devices in the medium-to-high-temperature range and holds significant practical application value.

Fabrication of Bi2Te3 and Sb2Te3 Thermoelectric Thin Films using Radio Frequency Magnetron Sputtering Technique.

Through various studies on thermoelectric (TE) materials, thin film configuration gives superior advantages over conventional bulk TEs, including adaptability to curved and flexible substrates. Several different thin film deposition methods have been explored, yet magnetron sputtering is still favorable due to its high deposition efficiency and scalability. Therefore, this study aims to fabricate a bismuth telluride (Bi2Te3) and antimony telluride (Sb2Te3) thin film via the radio frequency (RF) magnetron sputtering method. The thin films were deposited on soda lime glass substrates at ambient temperature. The substrates were first washed using water and soap, ultrasonically cleaned with methanol, acetone, ethanol, and deionized water for 10 min, dried with nitrogen gas and hot plate, and finally treated under UV ozone for 10 min to remove residues before the coating process. A sputter target of Bi2Te3 and Sb2Te3 with Argon gas was used, and pre-sputtering was done to clean the target's surface. Then, a few clean substrates were loaded into the sputtering chamber, and the chamber was vacuumed until the pressure reached 2 x 10-5 Torr. The thin films were deposited for 60 min with Argon flow of 4 sccm and RF power at 75 W and 30 W for Bi2Te3 and Sb2Te3, respectively. This method resulted in highly uniform n-type Bi2Te3 and p-type Sb2Te3 thin films.

Gate-Tunable Positive and Negative Photoconductance in Near-Infrared Organic Heterostructures for In-Sensor Computing.

The rapid growth of sensor data in the artificial intelligence often causes significant reductions in processing speed and power efficiency. Addressing this challenge, in-sensor computing is introduced as an advanced sensor architecture that simultaneously senses, memorizes, and processes images at the sensor level. However, this is rarely reported for organic semiconductors that possess inherent flexibility and tunable bandgap. Herein, an organic heterostructure that exhibits a robust photoresponse to near-infrared (NIR) light is introduced, making it ideal for in-sensor computing applications. This heterostructure, consisting of partially overlapping p-type and n-type organic thin films, is compatible with conventional photolithography techniques, allowing for high integration density of up to 520 devices cm-2 with a 5µm channel length. Importantly, by modulating gate voltage, both positive and negative photoresponses to NIR light (1050nm) are attained, which establishes a linear correlation between responsivity and gate voltage and consequently enables real-time matrix multiplication within the sensor. As a result, this organic heterostructure facilitates efficient and precise NIR in-sensor computing, including image processing and nondestructive reading and classification, achieving a recognition accuracy of 97.06%. This work serves as a foundation for the development of reconfigurable and multifunctional NIR neuromorphic vision systems.

β-Ga2O3 van der Waals p-n homojunction

The van der Waals (vdW) p-n junctions are crucial to develop multifunctional and high-performance electronic and optoelectronic devices. The asymmetric doping effect in wide-bandgap (WBG) semiconductors poses a fundamental obstacle for fabricating the vdW p-n homojunction and impedes the development of full WBG semiconductors-based bipolar devices. In this study, we demonstrate the β-Ga2O3 vdW p-n homojunctions with 2.0 nm-thick vdW gap, 2.6 eV built-in potential and 1.5 μm-wide depletion region, via combining quasi-two-dimensional n-type β-Ga2O3 nanosheets with p-type β-Ga2O3 films. Various tunneling transports including direct tunneling, Fowler-Nordheim tunneling, and exciton-assisted tunnelling are observed and explored in detail. The β-Ga2O3 vdW p-n homojunction diodes possess high forward current density (3.0 × 10−3 A/cm2), extremely-low reverse leakage current density (3.0 × 10−9 A/cm2), high rectification ratio (106 under dark and 107 under illumination), high photoresponsivity (13.4 A/W) and detectivity (9.38 × 1013 Jones) at 10 V bias under 250 nm illumination, and narrowband detection for the deep-ultraviolet solar-blind spectral region. This work lays the foundation for β-Ga2O3 homogeneous bipolar vdW devices and paves the way to advance the next-generation electronic and optoelectronic multifunctional devices based on the vdW integration.

Stencil-Printed Scalable Radial Thermoelectric Device Using Sustainable Manufacturing Methods

In this study, we used n-chitosan-Bi2Te2.7Se0.3 and p-chitosan-Bi0.5Sb1.5Te3 composite inks to print a circular thermoelectric generator (TEG) device using a low-energy-input curing method. Thermoelectric (TE) composite films were fabricated using varying sizes of thermoelectric particles and a small chitosan binder (0.05 wt. %). The particles and binder were hot pressed at an applied pressure of 200 MPa and cured at 200 °C for 30 min. We achieved ZT of 0.35 for the n-type and 0.7 for the p-type TE composite films measured at room temperature. A radial TEG was fabricated using the best-performing n-type and p-type composite inks and achieved a power output of 87 µW and a power density of 727 µW/cm2 at a temperature difference of 35 K; these are among the best-reported values for printed TEG devices. Using a low-energy-input fabrication method, we eliminated the need for high-temperature and long-duration curing processes to fabricate printing devices. Thus, we envisage that the low-energy-input curing process and cost-effective printable strategy presented in this work pave the way for sustainable manufacturing of large-scale energy harvesting TEG devices.

Trap-assisted tunneling in type II Ag2O/β-Ga2O3 self-powered solar blind photodetector

This study investigates a high-performance Ag2O/β-Ga2O3 self-powered photodiode through experimental and modeling approaches. Initially, a p-type Ag2O film, with a bandgap close to 4 eV and a hole density of approximately 6.35×1018 cm−3, was fabricated using faced two-target sputtering. The conduction and valence band offsets between Ag2O and β-Ga2O3 were determined via X-ray photoelectron spectroscopy, confirming a type II heterojunction. The device had a low on-voltage of 1.50 V and a low on-resistance of 5.40 mΩ.cm² in the dark. Subsequent illumination at 254 nm resulted in a notably high photocurrent, responsivity, and detectivity. To confirm the role of trap-assisted tunneling in the type II Ag2O/β-Ga2O3 heterojunction, Silvaco simulations were employed to model both the dark current and photocurrent. These simulations confirmed the prevalence of the trap-assisted tunneling mechanism, particularly through energy levels situated above the equilibrium Fermi level at the Ag2O/β-Ga2O3 interface, as described by the Danielsson model. Understanding the transport mechanism is paramount for the development of high-performance photodetectors. By comprehending how charge carriers navigate through the device and the influence of traps on their behavior, researchers can optimize device design and fabrication processes to enhance performance.