When the gate region of a MOSFET is implanted in order to adjust, the threshold voltage, the sensitivity of the threshold voltage to fluctuations in substrate doping will be affected. It is shown here that when the implanted ion is of the Same impurity type as the substrate, this sensitivity is lower than for a similar, unimplanted structure. However, the converse is found to he true when the implanted ion is of opposite type and the device is operating in a deep-depletion mode. The latter result has obvious importance in view of substrate–doping fluctuations over the surface of a single silicon wafer, and more so between many different wafers. The effect on the threshold voltage of oxide thickness variations is also investigated, and it is found there is a range of implant energy and dose over which the sensitivity can be very small. This is associated, however, with a sharp rise in the sensitivity outside this range.