InAs nanowires have been used as selectors and electrodes in a one‐transistor one‐resistor resistive random‐access memory (RRAM) configuration for increased memory scalability. Such oxide‐based memories not only show promise both in conventional memory technology but also as analog memories for neural networks. The small areas of the oxide elements, however, result in challenges for electrical characterization of the oxide–semiconductor interface. By analyzing larger test structures, it is possible to perform impedance spectroscopy on the oxide–InAs interface. In this article, HfO2‐based RRAMs on InAs are fabricated using plasma‐enhanced atomic layer deposition. The effect of the plasma‐length is investigated using capacitance–voltage and DC measurements. It is found that an increased plasma‐length results not only in a higher total electron trapping but also in the formation of a more stable interfacial oxide, possibly related to the stoichiometry of the complex InAs oxide. The findings give us a better understanding of the noise‐ and switching‐performance of scaled nanowire devices.
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