The wide bandgap wurtzite Al1-xScxN ferroelectric material is compatible with semiconductor processes and offers advantages such as high remanent polarization (Pr) and high-temperature stability. To clear the relationship between the structure zone model (SZM), abnormally oriented grains (AOGs) and the ferroelectric properties, the Al0.65Sc0.35N films were prepared at various sputtering pressures (0.32–0.90 Pa) and substrate temperatures (200–500 ℃) on low resistance n+-(111) Si substrate by the radio frequency dual-source reactive magnetron sputtering method using Al and Sc targets under pure N2 gas. The introduction of AOGs facilitates compressive stress reduction and promotes ferroelectric switching. However, excessive AOGs will damage the (002) orientation, leading to loss of ferroelectricity. The Al0.65Sc0.35N films synthesized under a sputtering pressure of 0.52 Pa and a substrate temperature of 400 ℃ exhibited a lower leakage current at high electric field, with a Pr value of 154.3 μC/cm2 and a negative coercive field (Ec-) of 3.1 MV/cm at a testing frequency of 1 kHz. The outstanding comprehensive properties support the large potential of Al1-xScxN ferroelectric material for high-performance FeRAM devices.