With the rapid development of high speed and high frequency communication, organic low dielectric (low-k) materials with both ultra-low dielectric constant (Dk) and ultra-low dielectric loss (Df) are urgently required to ensure signal transmission speed and reliability. 1,2-polybutadiene (1,2-PB) is renowned for its excellent dielectric properties, making it used in high-frequency printed circuit boards (PCBs). However, its poor thermal stability and mechanical properties hinder its application which requires persistent stability. To address this issue, a series of thermal-crosslinkable benzocyclobutene (BCB)-modified PBs were synthesized through a hydrosilylation reaction. These cured PBs exhibited significantly enhanced thermal stability with the glass transition temperature (Tg) exceeding 400 °C. In particular, they displayed ultra-low Dk (2.32–2.41) and ultra-low Df (<0.001). It was found that the properties of cured PBs were related to BCB loadings. Among the cured polymers, PB-g-B30 demonstrated the optimal dielectric properties with a Dk of 2.34 and a Df of 3.6 × 10−4. Subsequently, a PB-g-B30/glass fiber laminate was fabricated, exhibiting superior dielectric and comprehensive properties when compared to commercial low-k laminates. This study provides a facile method to develop PBs with ultra-low Dk and Df and enhanced thermal stability. The outstanding comprehensive properties indicate their potential as low-k materials in high-frequency communication applications.
Read full abstract