We present a numerical study of the transient multiphase flow of a liquid encapsulant in a microgap formed between parallel plates with special reference to electronics packaging. The surface tension and polarization forces are assumed to drive the fluid flow. The governing equations are solved using the volume of fluid model within the framework of the finite volume method in order to predict the free surface front of the encapsulant together with the time and spatial evolution of filler particle concentration during the underfill process. The numerical results are found to be in good agreement with available reported experimental data. The influence of the polarization force is found to reduce the encapsulant fill time, increase the flow length and distribute the filler particles to a larger flow length. The new process has practical implications, such as overcoming the partial curing of underfill epoxy before the flow is complete.