A thin cubic-GaN epitaxial layer was grown by plasma-assisted molecular-beam epitaxy directly on a (100) cubic-boron-nitride nucleation layer that was previously deposited on a (100)-oriented, type IIA, single-crystal chemical-vapor deposition diamond substrate. X-ray diffraction measurements verified that (100)-plane zincblende is the dominant crystal structure of the GaN layer, with a small contribution from the wurtzite phase in some sample regions. Detailed atomic force microscopy and Raman scattering measurements confirmed the XRD findings. Low temperature photoluminescence spectra show a dominant emission line near 3.12 eV and a weaker emission line near 3.21 eV. The former is assigned to a recombination process involving electrons bound to shallow donors with holes bound to shallow acceptors (donor–acceptor pair recombination process). The latter, which becomes dominant at temperatures above 50 K, is assigned to a recombination process involving the annihilation of excitons bound to shallow impurities. Room temperature transmission measurements yielded a direct bandgap of 3.23 eV, which is close to the reported values for c-GaN. These results confirm that cubic-GaN was successfully deposited on a high thermal-conductivity diamond substrate. This opens the door to exploring the potential of cubic-GaN devices for high-power applications, given that large area diamond substrates are becoming available.
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