Employing quantum sensors in field or in space implies demanding requirements on the used components and integration technologies. Within our work on compact atomic sensors, we develop miniaturized, ultra-stable optical setups for optical cooling and trapping of cold atomic gases on atom chips. Besides challenging demands on alignment precision and thermo-mechanical durability, we specifically address ultra-high vacuum (UHV) compatibility of our adhesive integration technology and the assembled optical components. A prototype of an UHV-compatible, crossed beam optical dipole trap at 1064 nm for application within a cold rubidium atomic quantum sensor currently in development at the Joint Lab Integrated Quantum Sensors at Ferdinand-Braun-Institut, Leibniz-Institut fur Hochstfrequenztechnik is described. We describe the design and first qualification efforts on adhesive micro-integration technologies. These tests are conducted in application-relevant geometries and material combinations common for micro-integrated optical setups. Adhesive aging will be investigated by thermal cycling and radiation exposure. For vacuum compatibility testing, a versatile UHV testing system for samples up to $$65\times 65\,\text{mm}^2$$ footprint is currently being set up, enabling residual gas analysis, temperature cycling up to $$200\,^{\circ }\text{C}$$ and measurement of total gas rates down to expected $$5\times 10^{-10}\,\text{mbar}\,\text{l/s}$$ at a base pressure of $$10^{-11}\,\text{mbar}$$, exceeding the common ASTM E595 test.