Dropwise condensation occurs on hydrophobic and superhydrophobic surfaces. The rate of heat transfer depends mostly on the preparing process of hydrophobic surface. Two main features of hydrophobic surfaces are existing micro-nanostructures and their low surface energy. In this paper, a one-step electrodeposition process is used to produce the necessary micro-nanostructures on copper surfaces and a self-assembled mono-layer of 1-Octaecanethiol as surface energy reducing agent. Effects of different electrochemical cell parameters such as electrical current and time of process on the dropwisecondensation heat transfer are investigated. The heat transfer experiments are performed in a device fabricated for this purpose. The surface of the specimens is analyzed using scanning electron microscopy images and X-ray diffraction analysis. The results show that some microstructures made from copper grow on the surface. The results show that current and process time have positive effects on the dropwise condensation heat transfer. It has been seen that surfaces fabricated at low electrodeposition time (15 and 45 sec) have a worse dropwise heat transfer rate than filmwise condensation heat transfer. On the other hand, higher electrodeposition times (135 sec) give 2-4 times higher heat transfer than filmwise heattransfer in the sub-cooling range lower than 10 Kelvin.