Oligosiloxane Resin Research Articles

Highly Condensed Fluorinated Methacrylate Hybrid Material for Transparent Low-k Passivation Layer in LCD-TFT

Photocurable and highly condensed fluorinated methacrylate oligosiloxane, with a low dielectric constant (kappa = 2.54), was prepared by a nonhydrolytic sol-gel condensation reaction. The oligosiloxane resin was then spin-coated, photocured, and thermally baked in order to fabricate a fluorinated methacrylate hybrid material (FM hybrimer) thin film. This study investigated the application of this FM hybrimer film as a low-kappa passivation layer in LCD-based thin film transistors (TFT). It was found that a dielectric constant as low as kappa = 2.54 could be obtained, without introducing pores in the dense FM hybrimer films. This study compares FM hybrimer film characteristics with those required for passivation layers in LCD-TFTs, including thermal stability, optical transmittance, hydrophobicity, gap fill, and planarization effects as well as electrical insulation.

Thermal stability of sol–gel derived methacrylate oligosiloxane-based hybrids for LED encapsulants

Methacrylate oligosiloxane-based hybrid materials (methacrylate hybrimers) were fabricated by curing the methacrylate oligosiloxane resins synthesized by sol–gel condensation reaction of 3-(trimethoxysilyl)propyl methacrylate (MPTS) and diphenylsilanediol (DPSD) for the LED encapsulant application. The fabricated hybrimers are optically transparent and have a high refractive index up to 1.565 depending on the precursor composition. The lower DPSD content hybrimer, which is the more polymerized and heated in a vacuum to remove the non-polymerized methacrylate groups, produces higher optical transmittance and thermal stability. This behavior is interpreted by thermal degradation of methacylate groups in the hybrimers.

Highly Condensed Epoxy−Oligosiloxane-Based Hybrid Material for Transparent Low-k Dielectric Coatings

A highly condensed epoxy-oligosiloxane resin was synthesized using a sol-gel condensation reaction of (3-glycidoxypropyl)trimethoxysilane and diphenylsilanediol in the presence of solvent. A higher degree of condensation and a larger molecular size of oligosiloxanes were achieved compared to a condensation reaction without the addition of a solvent. The epoxy-hybrimer coating film was fabricated by the spin coating and thermal curing of the synthesized oligosiloxane resin. The leakage current density and the dielectric constant decreased from 25.9 to 7.6 nA cm(-2) and from 3.16 to 3.03, respectively, by using the solvent in the preparation. The hybrimer coating film of a highly condensed oligosiloxane resin had a high transmittance of over 90% in a wavelength between 300 and 800 nm. Thus, the epoxy-hybrimer coating film can be utilized as the passivation layer in the thin-film transistor.

Synthesis and characterization of photopatternable epoxy hybrid materials for the fabrication of thick and thermally stable microstructures with a high aspect ratio

AbstractPhotosensitive cycloaliphatic‐epoxy oligosiloxane was synthesized using a nonhydrolytic sol–gel reaction for the fabrication of thick and thermally stable microstructures with high aspect ratios. Its formation was confirmed by 29Si and 1H nuclear magnetic resonance spectroscopy, small‐angle neutron scattering, and Fourier transform infrared spectroscopy. Photocuring of cycloaliphatic‐epoxy oligosiloxane resin resulted in a thermally stable epoxy hybrid material (epoxy hybrimer). Micropatterns with a high aspect ratio (>5), an excellent sidewall shape, and low shrinkage were fabricated directly from these materials using a simple photolithographic process. The fabricated micropattern sustained temperatures of up to 250°C. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008