O-cresol Novolac Epoxy Research Articles

Curing characteristics ofo-cresol novolac epoxy resin modified by bismaleimide

Curing characteristics of o-cresol novolac epoxy resin modified by 4,4-diaminodiphenylmethane bismaleimide (DDM-BMI) using FTIR were investigated and the glass transition temperature was measured. With the addition of DDM as hardener, the relative curing reaction conversion of DDM-BMI increased with equivalent weight ratio [R1 = (equiv wt summation of epoxy and DDM-BMI)/equiv wt of DDM] and weight ratio of epoxy and DDM-BMI (R2 = wt of epoxy resin/wt of DDM-BMI). Using phenol novolac resin (PN) as hardener, the curing reaction conversion of DDM-BMI was hardly changed, but the variation of that in the epoxy resin was observed with R2 change. © 1996 John Wiley & Sons, Inc.

Impurities of Epoxy Novolac Resins and their Influence on the Reliability of Encapsulated Semiconductors.

AbstractImpurities, especially chemically bonded impurities, of o-cresol novolac epoxy resins and their influence on the moisture resistance and other properties of the epoxy molding compounds have been investigated to clarify the influence of impurities of epoxy resins on the reliability of encapsulated semiconductor. As a result, the existence of hydrolyzable chlorine and hydroxyl group-containing impurities has been confirmed, and it was found that the impurity such as a hydrolyzable chlorine causes undesirable influence on both the moisture resistance and electrical properties at high temperatures. It was also found that the impurity such as a hydroxyl group causes undesirable influence on the moisture resistance, and that the lower hydroxyl content gives the higher heat resistance as a result of an increase in the epoxy content.