In this study, a non-thermal atmospheric argon plasma jet (NTAPJ) was designed and used to treat the porous silicon layer, prepared by photoelectrochemical etching (PECE). The porous silicon layers were distinguished before and after the cold plasma treatment utilized by X-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microscopy (SEM), photoluminescence (PL), and dark and photo current-voltage characteristics. The results confirmed the nanostructure of the formed porous silicon. After the treatment with argon plasma, the intensity of the XRD peak increased, and the porosity decreased from 93% to 62%. Additionally, porous silicon's average roughness (Sa) and root mean square (Sq) were reduced from 60.10 to 12.31nm and 73.70 to 16.53nm, respectively. The current-voltage characteristic indicated the increase in photocurrent and the ideality factor, as well as a decrease in dynamic resistance. The photoluminescence results showed a change in PL peaks, represented by a blue shift, an increase in intensity, and a vanishing of another peak.
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