A novel magnetron assembly based on a combination of permanent magnet and adjustable electromagnetic coil is proposed for improved uniformity of the magnetron sputtering deposition process. The design of the magnetron sputtering system containing a rotating substrate and an off-axis arranged magnetron. A numerical framework has been developed to describe the evolution of the plasma density and distribution of sputtered particles. Specifically, the finite element method (FEM) was used to calculate the magnetic field and to model the magnetron sputtering discharge, and binary-collision Monte Carlo method was used to determine the transport of sputtered atoms to the substrate. Through parametric analyses, it was found that increasing the substrate-to-target distance, gas pressure, and coil current intensity benefits the uniform distribution of particles. The condition where the off-axis displacement of the magnetron effectively enhances uniformity. A strategy for optimizing deposition uniformity by combining adjustable current with an off-axis magnetron arrangement was proposed, which reduce the non-uniformity of film thickness by 77.6 % compared to the traditional fixed magnetic field model.