Nickel Electroplating Research Articles

Electrochemical Determination of Porosity in Nickel Electroplates on a Uranium Alloy

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Measurement of Cyclic Stresses in High Temperature Range Using a Nickel Electroplating : 2nd Report, Examination of Applicable Temperature and Accuracy of Measured Values

Measurement of Cyclic Stresses in High Temperature Range Using a Nickel Electroplating : 2nd Report, Examination of Applicable Temperature and Accuracy of Measured Values

Measurement of Cyclic Stresses in High Temperature Range Using a Nickel Electroplating : 1st Report, Plating Conditions and Calibration Tests

Measurement of Cyclic Stresses in High Temperature Range Using a Nickel Electroplating : 1st Report, Plating Conditions and Calibration Tests

Chemical vapor deposition of titanium diboride

The formation of titanium dibordie on a heated substrate by chemical vapor deposition was studied using BCl 3, TiCl 4 and H 2 as reactants. In order to determine the optimum temperature and related factors, the deposition rates were measured thermogravimetrically. The deposition was observed at temperatures above 800°C, and the deposition rate increased rapidly with temperature. When graphite was used as substrate, the amount of deposit increased in a linear fashion with time. This indicated that the growth rate was constant. At high BCl 3 partial pressures, high deposition rates were observed, but the layers obtained under these atmospheres were porous and poorly adherent. On the other hand, under high TiCl 4 partial pressure conditions, the resulting deposits were dense and showed preferred orientation. When using low carbon steel as a substrate in place of graphite, the growth rate was not constant, and the coating layer obtained was poor in adhesiveness. To obtaining adhesive titanium diboride coatings, a preliminary electroplating of cobalt or nickel on steel was found to be effective.

気相メッキ法による鉄ベースチタンメッキ

This paper describes a new process to obtain a coating having very high titanium content and high corrosion resistance on iron substrate.The process was to conduct electroplating of nickel or copper on the iron substrate previous to the titanium vapor-plating. The intermediate layer acted as a barrier to prevent iron from diffusing into the titanium layer so that the purity of titanium in the surface layer was kept at a very high level.The concentration of titanium in the vapor-plated layer was confirmed to be above 95% by measurement with an X-ray microanalyzer. Whereas, the concentration in the conventional vaporplatings with no intermediate layer was 30-70%.Corrosion resistance of the specimens treated by this process showed excellent results by testing in various corrosive solutions.

The influence of ultrasonic agitation on porosity of nickel electroplates: Hickman, R.G.Plating, 52, No. 6, 540 (1965)

<dm:abstracts xmlns:dm="http://www.elsevier.com/xml/dm/dtd"><ce:abstract xmlns:ce="http://www.elsevier.com/xml/common/dtd" view="all" class="author" id="aep-abstract-id1"><ce:section-title>Publisher Summary</ce:section-title><ce:abstract-sec view="all" id="aep-abstract-sec-id2"><ce:simple-para id="fsabs043" view="all">This chapter reviews some basic principles in ultrasonics that are required to appreciate the ultrasonic adhesive bond inspection process. As an ultrasonic wave impinges onto an interface between two materials, a portion of the energy is transmitted and a portion is reflected. The chapter presents the idealized reflection factor formula. To go beyond the normal incidence ultrasonic technique, it is necessary to consider the refraction principle that is illustrated in the chapter. As an ultrasonic wave impinges onto an interface between two materials at some oblique incident angle, a portion of the energy is reflected and some is refracted. The refraction process is governed by Snell's Law. The most common ultrasonic bond inspection procedures and oblique incidence ultrasonic test techniques are also illustrated in the chapter. It has been found in earlier studies that the normal beam shear wave incidence technique is often more sensitive to subtle interfacial weakness problems than a normal beam longitudinal incident wave. The chapter also discusses the basic approach to ultrasonic microscopy..</ce:simple-para></ce:abstract-sec></ce:abstract></dm:abstracts>

Electroplating of Nickel from the Pyrophosphate Bath

The pyrophosphate bath has been found to be satisfactory for the plating of nickel. It gives good quality deposits over a wide range of operating conditions and has some advantages over the Watts bath.

Rapid Quantitative Methods for the Determination of Brighteners, Levellers and Anti-Pitting Agents in Nickel Electroplating Baths

The rapid determination of addition agents in bright nickel plating baths has been achieved experimentally. Metal-ion additions can often be determined rapidly and accurately enough from the bath b...

Organic Finishes on Electroplated Coatings with Special Reference to Adhesion

SynopsisOrganic finishes on zinc, cadmium, copper, tin, nickel, chromium, silver and gold electroplates are discussed with special reference to their adhesion and their ageing properties. The use of chemical pre-treatments, such as phosphating and chromating, of the electroplate before the application of cellulose or stoving enamels is discussed. The great improvement that can be effected in many cases by the use of etch primers, based on mixtures of vinyl-butyral resins and phosphoric acid in alcoholic solvents, is emphasized.

An X‐Ray Study of the Effect of Organic Compounds on the Crystal Growth of Nickel during Electrodeposition

X‐ray diffraction analyses were made of nickel electrodeposits prepared in the presence of organic compounds. The compounds varied in their ability to alter the grain size and the degree and/or type of preferred orientation. Compounds most effective in increasing the cathode potential during deposition both decreased the grain size and changed the type of preferred orientation to a type other than (100) or to a random distribution of the crystals. Compounds of lesser effectiveness in increasing the cathode potential reduced the grain size, but had no effect on the preferred orientation. Brittle deposits were characterized by an orientation other than (100), and the ductile deposits were characterized by a (100) preferred orientation. The results of this study and the work of other authors indicate that a major fraction of mirror‐bright nickel electroplates exhibit no preferred orientation.

(218)アルミニウム上へのニッケル電鍍に関する研究(第1報)アルミニウム表面の前処理及び電鍍後に於ける表面処理效果に就て

(218)アルミニウム上へのニッケル電鍍に関する研究(第1報)アルミニウム表面の前処理及び電鍍後に於ける表面処理效果に就て