Next-generation Computing Research Articles

On virtual environments and agents in next-generation computer games

AbstractThis paper holds the material presented at our keynote at the Intelligent Virtual Environments and Virtual Agents Conference, where we analyzed future trends in virtual agent and environment technologies, as applied to the fields of videogames and interactive multimedia. We begin by observing current tendencies in game development projects, both in the market and in the academia, outlining their respective strengths and weaknesses. We follow by describing the aspects of game development that will come to shape the next generation of games, and discuss the requirements for academic projects to achieve the level of quality required to be competitive in this field. In the rest of the paper we analyze the roles, importance, challenges, and research opportunities that a new generation of virtual characters and environments will bring to the world of interactive entertainment.

SC08 broader engagement offers mentoring and travel assistance grants

Austin, TX Interested in understanding what supercomputing means? Want to learn how next-generation computing, networking and storage technologies help to solve our worlds challenges and problems? Do you want to be in a place that brings together scientists, engineers, researchers, educators, programmers, system administrators and managers to discuss, discover and innovate the path forward for computing? If so, the SC08 Broader Engagement initiative might just be for you.

MATERIALS IN MOTION

RETURN TO ISSUEPREVNewsNEXTMATERIALS IN MOTIONThe electronics industry's move to NEXT-GENERATION computer chips is challenging the ingenuity of chemical suppliersMICHAEL MCCOYView Author Information C&EN NORTHEAST NEWS BUREAUCite this: Chem. Eng. News 2007, 85, 28, 10–16Publication Date (Print):July 8, 2007Publication History Published online29 October 2010Published inissue 8 July 2007https://doi.org/10.1021/cen-v085n028.p010Copyright © 2007 AMERICAN CHEMICAL SOCIETYArticle Views13Altmetric-Citations-LEARN ABOUT THESE METRICSArticle Views are the COUNTER-compliant sum of full text article downloads since November 2008 (both PDF and HTML) across all institutions and individuals. These metrics are regularly updated to reflect usage leading up to the last few days.Citations are the number of other articles citing this article, calculated by Crossref and updated daily. Find more information about Crossref citation counts.The Altmetric Attention Score is a quantitative measure of the attention that a research article has received online. Clicking on the donut icon will load a page at altmetric.com with additional details about the score and the social media presence for the given article. Find more information on the Altmetric Attention Score and how the score is calculated. Share Add toView InAdd Full Text with ReferenceAdd Description ExportRISCitationCitation and abstractCitation and referencesMore Options Share onFacebookTwitterWechatLinked InReddit PDF (4 MB) SUBJECTS:Circuits,Insulators,Lithography,Manufacturing,Semiconductors Get e-Alerts

Silicon photonics and next-generation computation and communication

Silicon photonics and next-generation computation and communication

SweetBait: Zero-hour worm detection and containment using low- and high-interaction honeypots

As next-generation computer worms may spread within minutes to millions of hosts, protection via human intervention is no longer an option. We discuss the implementation of SweetBait, an automated protection system that employs low- and high-interaction honeypots to recognise and capture suspicious traffic. After discarding whitelisted patterns, it automatically generates worm signatures. To provide a low response time, the signatures may be immediately distributed to network intrusion detection and prevention systems. At the same time the signatures are continuously refined for increased accuracy and lower false identification rates. By monitoring signature activity and predicting ascending or descending trends in worm virulence, we are able to sort signatures in order of urgency. As a result, the set of signatures to be monitored or filtered is managed in such a way that new and very active worms are always included in the set, while the size of the set is bounded. SweetBait is deployed on medium sized academic networks across the world and is able to react to zero-day worms within minutes. Furthermore, we demonstrate how globally sharing signatures can help immunise parts of the Internet.

Development of Au reflection film with high adhesion for high-density optical interconnection between LSI chips

We have developed a new multilayered reflection film structure containing Au for achieving slab waveguide based optical transmission interconnections between large-scale integration chips for next-generation high speed computers. The noble metals, especially Au, have outstanding characteristic as a high reflection film in a slab waveguide. However, when these metals are combined with optically transparent films of a SiO/sub 2/ system, there are severe problems with poor adhesion and poor thermal stability. In this work, we have solved these problems by inserting Cr films above and below the Au film resulting in the development of a new multilayered reflection film structure with superior reflectivity and adhesion characteristics.

3D-SoftChip: A Novel Architecture for Next-Generation Adaptive Computing Systems

This paper introduces a novel architecture for next-generation adaptive computing systems, which we term 3D-SoftChip. The 3D-SoftChip is a 3-dimensional (3D) vertically integrated adaptive computing system combining state-of-the-art processing and 3D interconnection technology. It comprises the vertical integration of two chips (a configurable array processor and an intelligent configurable switch) through an indium bump interconnection array (IBIA). The configurable array processor (CAP) is an array of heterogeneous processing elements (PEs), while the intelligent configurable switch (ICS) comprises a switch block, 32-bit dedicated RISC processor for control, on-chip program/data memory, data frame buffer, along with a direct memory access (DMA) controller. This paper introduces the novel 3D-SoftChip architecture for real-time communication and multimedia signal processing as a next-generation computing system. The paper further describes the advanced HW/SW codesign and verification methodology, including high-level system modeling of the 3D-SoftChip using SystemC, being used to determine the optimum hardware specification in the early design stage.

Globally controlled artificial semiconducting molecules as quantum computers

Quantum computers are expected to be considerably more efficient than classical computers for the execution of some specific tasks. The difficulty in the practical implementation of those computers is to build a microscopic quantum system that can be controlled at a larger macroscopic scale. Here I show that vertical lines of donor atoms embedded in an appropriate Zinc Oxide semiconductor structure can constitute artificial molecules that are as many copy of the same quantum computer. In this scalable architecture, each unit of information is encoded onto the electronic spin of a donor. Contrary to most existing practical proposals, here the logical operations only require a global control of the spins by electromagnetic pulses. Ensemble measurements simplify the readout. With appropriate improvement of its growth and doping methods, Zinc Oxide could be a good semiconductor for the next generation of computers.

Making CNC machine tools more open, interoperable and intelligent—a review of the technologies

The aim of the next generation of computer numerically controlled (CNC) machines is to be portable, interoperable and adaptable. Over the years, G-codes (ISO 6983) have been extensively used by the CNC machine tools for part programming and are now considered as a bottleneck for developing next generation of CNC machines. A new standard known as STEP-NC is being developed as the data model for a new breed of CNC machine tools. The data model represents a common standard specifically aimed at the intelligent CNC manufacturing workstation, making the goal of a standardised CNC controller and NC code generation facility a reality. It is believed that CNC machines implementing STEP-NC will be the basis for a more open and adaptable architecture. This paper outlines a futuristic view of STEP-NC to support distributed interoperable intelligent manufacturing through global networking with autonomous manufacturing workstations with STEP compliant data interpretation, intelligent part program generation, diagnostics and maintenance, monitoring and job production scheduling.

STEP-compliant NC research: the search for intelligent CAD/CAPP/CAM/CNC integration

Since the first generation of Numerically Controlled (NC) machine tools was developed in the 1950s, there have been many developments which make today's NC machines completely unrecognizable from their early ancestors. Further developments, however, are now being significantly limited by the current programming language (ISO6983 or RS274D) that has been supporting NC manufacture since day one. Today a new standard, informally known as STEP-NC, is being used as the basis for development of the next generation of Computer Numerically Controlled (CNC) controller. This new standard is ISO 14649 and ISO 10303 AP 238. This standard gives CAM and CNC vendors the opportunity to integrate the capabilities of CAD/CAM systems with a new breed of intelligent CNC controllers, which have bi-directional communication of information representing standardized geometric and manufacturing data. This paper presents a comprehensive review of STEP-NC developments for a range of CNC processes. These developments include some major projects collaborated at the international level as well as those carried out by different groups of researchers in countries such as Germany, Switzerland, UK, Korea, USA and New Zealand. This paper also tries to portray a futuristic view of STEP-NC applications for CAD, CAPP, CAM and CNC integration, identifies the issues and challenges for STEP-NC, and provides a vision of a STEP-NC-compliant process chain supported by a product and manufacturing model.

Teaching about natural systems, the next generation of computers, and the generation after that?

No abstract available.

Nurturing next-generation computer scientists

The origin of the University of Florida's Digital Arts and Sciences (DAS) curriculum is steeped in myth and adventure. Through DAS, CISE seeks to produce the next-generation computer scientist. To justify this statement, we need look no further than recent computing history and how this trend in fast hardware and immersive environments will transform foundational computer science in areas such as program and data structures, software engineering, machine organization, database methodology, and discrete mathematical structures. We are experiencing a fundamental branching of computer science into areas that more closely examine the relationship between humans and their computing hardware. While human computer interaction has always focused on these areas, a plethora of new areas have opened to us. Ubiquitous, tangible, pervasive, and human-centered computing add new dimensions to virtual and augmented reality.

Conductive polymer interconnections for three-dimensional computing structures

Research into 3D nanocomputing structures is important for the development of the next generation of computers. The main task in constructing a 3D chip stack is to vertically connect existing 2D chips. Hence we have developed molecular wiring technology which allows for high-density interconnections, and which will be appropriate for nanoelectronics. First we solve the problem of making wires between contact pads on two chips, but with no cross-talk between the pads. The chosen interconnect materials are conductive organic polymers, grown in the pores of insulating membranes. The growth of polymer in the membrane pores is investigated with the aim of achieving good conductivity through the pores, but with small cross-talk between them.

LOW K GETS A DELAY

THE RACE TO BE THE NEW INSUlating material for next-generation computer chips is over. And the winner is—the old insulating material. Competitors are now in a second heated race over yet another next generation of chips, but so far the outcome is unclear. That's the picture that emerged late last month at the Semicon trade show in San Francisco, sponsored by the industry association Semiconductor Equipment & Materials International, or SEMI. The failure of the new insulating materials— known as low-k dielectrics—to be widely accepted comes against a backdrop of hard times for the materials industry According to SEMI, global consumption of semiconductor fabrication materials such as silicon, electronics-grade gases and chemicals, and photoresists fell from $15.9 billion in 2000 to $15.0 billion in 2001. Consumption is expected to fall further in 2002 to $13.6 billion before recovering in 2003 to $16.0 billion. Low-k dielectrics weren't a victim of the downturn, however. Rather, for the ...

EDUCATION: Next-Generation Computing?

EDUCATION: Next-Generation Computing?

A Model for the Flow of Design Information in Product Development

The complexity of modern products and design tools has made the exchange of design information more complex. It is widely recognised that the seamless capture, storage, and retrieval of design information is one of the major challenges for the next generation of computer aided design tools. This paper presents a model for the flow of design information that is sufficiently formal to eventually support a semantics-based approach for developing information exchange standards. The model classifies design information into various types, organises these types into information states and levels of abstraction, and identifies the various transformations that operate within and between the information states. The model’s ability to support a variety of design process models is illustrated by applying it to the Systems Integration of Manufacturing Applications (SIMA) design process model, and the model is then applied to a design example.

Investigating the application of web-based simulation principles within the architecture for a next-generation computer generated forces model

With a heavy emphasis on distribution and reuse, web-based simulation portends a dramatic shift in the application of simulation as a problem-solving technique and decision-support tool. Next-generation simulation systems of all kinds should be evaluated and constructed with an appreciation of the potential paradigm shift that web-based simulation represents. Fiscal constraints indicate that next-generation computer generated forces (CGF) models will be used to support a wide range of missions, unifying — and replacing — a variety of CGF systems currently in existence. We describe the evolution of web-based simulation and derive a collection of modeling principles that characterize our vision of the web-based simulation future. We examine these principles in terms of their implications for next-generation CGF systems.

Communication: computer aided engineering in the next millennium

The next generation of computer aided tools should address the traditional role of engineering within a manufacturing organization, i.e. accurate communication of manufacturing specifications. Communication is the business of manufacturing engineering: translating design specifications into process plans and information such as estimating time and cost, process geometry creation and tolerance charting, determining tooling, and the recording of best practices. The integration of the product and process geometry with manufacturing knowledge is evolving through the use of computer aided process modeling and best practice sharing, to better serve production, which in turn delivers quality product at the right cost and tempo. These computer aided systems will have easy accessibility, inherent configuration control, and a “manufacturing language.”

Light Construction: Nanostructured dielectrics good candidates for next-generation computer chips

Light Construction: Nanostructured dielectrics good candidates for next-generation computer chips

Next-Generation Computing realized by Java. Electronic Commerce System using JavaCard.

Sun Microsystemsが開発したJavaは単に新しいプログラミング言語ではなく，ネットワークコンピューティングを実現するキーワードでもある。また，常時携帯できる最小のJava実行環境としてJavaCardがあり，このカードを使用すれば複数のプログラムを１枚のカードに安全に格納・実行することができる。CTC J-KIOSK開発チームは，Java・JavaCardの特徴を取り入れたインターネット上での電子決済システムのデモを作成し，Javaの実用性と可能性を証明した。