The range of sensor technologies for structural health monitoring (SHM) systems is expanding as the need for ongoing structural monitoring increases. In such a case, damage to the monitored structure elements is detected using an integrated network of sensors operating in real-time or periodically in frequent time stamps. This paper briefly introduces a new type of sensor, called a Customized Crack Propagation Sensor (CCPS), which is an alternative for crack gauges, but with enhanced functional features and customizability. Due to those characteristics, it is necessary to develop a family of computer-aided supporting models for rapid prototyping and analysis of the new designs of sensors of various shapes and configurations, which this paper presents by use of simulation tools. For a prototyping of the sensor lay out, an algorithm is elaborated, based on an application created in LabVIEW 2022 software, which generates two spreadsheets formatted by the requirements of Autodesk Inventor 2014 and COMSOL Multiphysics 5.6 software, based on data entered by the user. As a result, a tailored-in-shape CCPS layout is prepared. A parametric model of the sensor is prepared in Autodesk Inventor software, which automatically changes its geometric dimensions after changing data in an MS Excel spreadsheet. Then, the generated layout is analyzed to obtain electromechanical characteristics for defined CCPS geometry and materials used in the COMSOL Multiphysics software. Another application is devoted to purely mechanical analysis. The graphical user interface (GUI) add-on based on the Abaqus 2018 software engine is prepared for advanced mechanical analysis simulations of sensor materials in selected loading scenarios. The GUI is used for entering material libraries and the selection of loading conditions and a type of specimen, while the results of the numerical analysis are delivered through Abaqus. The main advantage of the developed GUI is the capacity for personnel inexperienced in using the Abaqus environment to perform analysis. Some results of simulation tests carried out in both COMSOL Multiphysics as well as Abaqus software are delivered in this paper, using a predefined parametric sensor model. For example, using a rigid epoxy resin for an insulating layer shows a negligible difference in the level of strain compared to the structure during a simulated tensile test, specifically in the tested layer thickness range of up to 0.3 mm. However, during bending tests, an approx. 17% change in principal strain level can be observed through the top to bottom edge of the epoxy resin layer. The adopted methodology for carrying out simulation studies assumes the parallel use of a set of various computer-aided tools. This approach allows for taking advantage of individual software environments, which allows for expanding the scope of analyses and using the developed models and applications in further research activities.
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