Mid-infrared (MIR) optoelectronic devices are of utmost importance to a plethora of applications such as night vision, thermal sensing, autonomous vehicles, free-space communication, and spectroscopy. To this end, leveraging the ubiquitous silicon-based processing has emerged as a powerful strategy that can be accomplished through the use of group IV germanium-tin (GeSn) alloys. Indeed, due to their compatibility with silicon and their tunable bandgap energy covering the entire MWIR range, GeSn semiconductors are frontrunner platforms for compact and scalable MIR technologies. However, the GeSn large lattice parameter has been a major hurdle limiting the quality of GeSn epitaxy on silicon wafers. These limitations are further exacerbated as Ge1−xSnx layers and heterostructures with Sn contents at least one order of magnitude higher than the solubility are needed for device structures relevant to MWIR applications. In this regime, the as-grown layers are typically under a significant compressive strain, which impacts the bandgap directness and increases its energy at the Γ point, thus hindering the device performance and limiting the covered range of the MIR spectrum. This compressive strain build-up not only affects the band structure but also limits the incorporation of Sn atoms in the growing layer, making the control of Sn content a daunting task.In this presentation, we will show and discuss how sub-20 nm Ge nanowires provide effective compliant substrates to grow Ge1−xSnx alloys with a composition uniformity over several micrometers with a very limited build-up of the compressive strain. Ge/Ge1−xSnx structures with Sn content spanning the 6 to 18 at.% range are achieved. We will also demonstrate the integration of the obtained materials in optoelectronic device processing leading to tunable detectors and emitters [1,2]. For instance, photodetectors based on these materials were found to exhibit a high signal-to-noise ratio at room temperature and provide a tunable cutoff wavelength covering the 2.0 µm to 3.9 µm range. Additionally, the processed detectors were also integrated in uncooled imagers enabling the acquisition of high-quality images under both broadband and laser illuminations without the use of the lock-in amplifier technique. Finally, progress towards achieving nanoscale GeSn lasers will also be discussed [2].
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