We report high quality nanolaminate films consisting of five Al 2O 3–HfTiO layers with a dielectric constant of about 29. The dielectric stack was deposited on unheated p-Si substrate from Al 2O 3 and 1HfO 2/1TiO 2 targets using an electron beam gun evaporation system without addition of oxygen. A dielectric constant for a thick HfTiO film of about 83 was also demonstrated. The electrical characteristics of as deposited structures and ones which were annealed for 5–10 min in an O 2 atmosphere at up to 950 °C were investigated. Two types of gate electrodes: Pt and Ti were compared. The dielectric stack which was annealed up to 500 °C exhibits a leakage current density as small as ∼ 1 × 10 − 4 A/cm 2 at an electric of field 1.5 MV/cm for a quantum mechanical corrected equivalent oxide thickness of ∼ 0.76 nm. These values change to ∼ 1 × 10 − 8 A/cm 2 and 1.82 nm respectively, after annealing at 950 °C for 5 min.