The ultimate aim of microand nanofluidics is to construct micro total-analysis systems (μTAS), in which complex analytic processes are performed on a chip for simplified application, decreased costs, and minimal sample volumes. To realize this goal, complex microand nanofluidic networks must be integrated into a single chip. Moreover, achieving appropriate interconnection among components and high device density usually require 3D geometries. Thus, the advantages of conventional 2D planar lithography-etch-bond processes are offset by the difficulty of achieving true 3D geometries. Laser machining using femtosecond pulses constitutes a promising method of 3D nanofabrication: far-field optical ablation allows true 3D (rather than multilayer) geometries, while submicron feature sizes are still attainable using tightly-focused laser pulses operating in the optics-in-critical-intensity regime. This takes advantage of the deterministic character of femtosecond laser machining4 to achieve precise and reproducible ablation of nanofeatures inside and on the surface of glass or other transparent materials. If machining is performed in liquids, it is possible to form long, open channels in a single step since debris is cleared from the channels by expanding bubbles produced during laser ablation.3, 5, 6 However, like other, more conventional microdrilling methods, optical machining is limited in terms of the attainable aspect ratio (AR) of subsurface channels: debris extrusion becomes difficult as the machining progresses far into the material.7 Similar to conventional microdrilling methods, femtosecond laser machining has been limited to AR < 100.8 By optimizing the machining protocols we were able to extend the AR somewhat, but found that the effectiveness drops precipitously at around AR = 300. This initially was ascribed to increased resistance to flow in longer channels, which predictably inhibits clearing of debris, and thus ultimately must limit reasonably attainable AR. However, repeated scans of the laser over AR = 300 abruptly and unexpectedly recovered machining effectiveness, thus enabling further lengthening of the channel. Moreover, even though the end of the channel resumed growing, the poor machining region around AR = 300 initially remained clogged with glass debris, and the channel appeared to be divided into two parts. With further scans of the laser, these two parts united, achieving a continuous longer channel. Closer examination shows the localized regions of poor machining to be associated with dramatically changed bubble dynamics. When the AR is smaller than 300, vigorous bubble expansion effectively extrudes water-entrained debris out of the channel. However, as AR approaches 300, machining becomes inefficient, with both bubble expansion and debris extrusion becoming severely attenuated. Interestingly, a second region of poor machining is encountered when the channel becomes twice as long, suggesting harmonic phenomena. And indeed, we find evidence for a (to the best of our knowledge) hitherto unidentified form of acoustic node that presents an alternative acoustic pathway for the dissipation of absorbed laser energy, and consequently decreases the energy available for bubble expansion. The acoustic AR barrier at 300 can be delayed either by using degassed water to assist femtosecond laser machining or by varying the ambient pressure during machining. This is predicted from a physical model in which acoustic nodes form when an internal two-phase (gas and water) flow forms a stable resonant structure. The impedance of the water and gas structures becomes matched, allowing deposited energy to readily dissipate across the fluid-gas interface, thus causing fluid circulation to fail due to a precipitous decrease in bubble expansion. The bubbles may even completely vanish, despite persisting for hundreds of milliseconds only a few microns away, where
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