Enhancement-mode amorphous indium gallium zinc oxide (α-IGZO) channel thin film transistors (TFTs) with a 6μm gate length and a 100μm gate width were fabricated on glass substrates by rf magnetron sputtering near room temperature. The resistivities of the α-IGZO films were controlled from 10−1to103Ωcm by varying the deposition power of 75–300W. The n-type carrier concentration in the channel was 6.5×1017cm−3. The gate oxide was 90-nm-thick SiNx, deposited by plasma enhanced chemical vapor deposition at 70°C. The bottom-gate TFTs had saturation mobility of ∼17cm2V−1s−1 and the drain current on-to-off ratio of ∼>105, a subthreshold gate-voltage swing of ∼0.5Vdecade−1, and a threshold voltage of 2.1V. In the TFT with a gate length of 6μm and a gate width of 100μm, the relative change of saturation mobility and threshold voltage was less than ±1.5% after 500h aging time at room temperature. This demonstrates that α-IGZO films are promising semiconductor materials for long-term-stable transparent TFT applications.