To take advantage of Zn and Ti doping effects on improvement of diffusion behavior in the Sn–Cu mixing step and the Nb3Sn layer formation for the internal tin process, a diffusion couple configuration of Nb/Cu–Ti/Sn–Zn has been proposed. In this work, a fundamental study on the diffusion behavior of Sn–Zn/Cu–Ti, with different heat treatments, was conducted to aid in a better understanding of Nb3Sn phase formation, via internal tin diffusion. The first feature is that at 210∘C, the γ-CuZn phase forms at the reaction interface of Sn-20 wt%Zn and Cu, following which the β-CuZn and η-CuSn phases form at 400∘C. Compared with the Sn/Cu-12 wt%Zn system, Kirkendall voids appear to be suppressed, as few ε-CuSn phases, in which many voids grow, form in the Sn–Zn/Cu system. At 550∘C, a dendritic mixed phase of α-CuZn and δ-CuSn phases form. At this temperature, Sn appears to diffuse faster than in the case of the Sn/Cu–Zn system. It is observed that, after heat treatment at 550∘C, very fine compound particles of Sn–Ti are homogeneously distributed in the outer regions originally known to be the Cu–Ti sheath area. In the multifilamentary wires consisting of Nb/Cu–Ti/Sn–Zn diffusion couple configuration, no Ti rich compound layer was formed at the boundary of the Nb sub-elements, which overcomes the problem to suppress a smooth Sn and Ti diffusion into the Nb sub-element, when Ti is doped to Sn cores. Thus, no Ti-rich compound layer segregation, few void formations in the Sn–Cu mixing step and distributed fine Sn–Ti particles in the matrix accounts for the improved Jc characteristics in Nb/Cu–Ti/Sn–Zn wires. With regards to the mechanical properties, alloying of 20 wt% Zn to Sn cores increases the Vickers hardness of the Sn core to approximately 20kgf/mm2, almost double that of pure Sn or Sn-alloys with a small amount of Ti.
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