AbstractA 2π equivalent circuit model of serpentine interconnect fabricated by transfer printing technology is proposed considering the stretching deformation of the interconnect. The S parameters are measured, and the RLC parameters are extracted by quasi‐linearization method at various elongations. A V‐shaped model is built to illustrate the change of Lc increasing by 9.7% due to elongation. A branch of Rf and Lf in parallel is utilized to model the impact of high‐frequency effects, Rf decreases by 56.7%, and Lf remains ~0.65 nH. A branch of Rsub and Csub characterizing the electrical loss of substrate increases due to substrate thinning with elongation, Rsub increases by 87.1%, and Csub remains 100 fF. S parameters are measured and compared to verify the accuracy of the model and study the effect of elongation on the transmission characteristics; it is found that the amplitude at S11 minimum decreases from −7 to −10 dB during stretching, and the corresponding frequency points also decrease.