Chemical reductions of Cu(OH)2/Cu(O,S) and Cu(O,S)/Cu(O,S) bilayers fabricated on glass substrates by chemical bath deposition (CBD) was investigated through electrochemical measurements, X-ray diffraction, and evaluations of the electrical properties and adhesion strength by a tape-peeling test. The potential change during the chemical reduction in NaBH4 aqueous solutions was measured and discussed based on a mixed potential theory using the equilibrium potential calculated with chemical thermodynamics. The sheet resistance decreased from over 1 × 108 W/□ to 0.24 W/□, mainly due to the increase in the thickness, with the resistivity estimated to be 4.8 × 10–6 W cm. The metallic Cu layer showed adhesion strengths of 6.4 and 4.4 N cm−1 for maximum and average values respectively by tape-peeling test, without any detachment, but the Cu sheet peeled off from the glass substrate after the complete chemical reduction of the Cu(OH)2/Cu(O,S) bilayer. The Cu fragments formed by the chemical reduction of the Cu(O,S)/Cu(O,S) bilayer peeled off from the glass substrate, but the Cu(O,S)/Cu(O,S) bilayer showed the adhesion strengths of 6.7 and 4.0 N cm−1 for maximum and average values, respectively, by the tape-peeling test. Both the Cu(OH)2 and Cu(O,S) layers were indispensable to secure the Cu layer on the glass substrate.
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