Miniaturization Of Components Research Articles

Serial–parallel cooperative assembly approach for precision micro-assembly of axial holes

Abstract. The assembly of high-density axial holes represents a crucial step in integrating highly sophisticated components for electronic equipment. This process faces two primary challenges: stringent precision requirements and the need for robust control during delicate adjustments. Given the miniaturization of components, manual assembly becomes inefficient. To address these challenges, this study introduces a novel dual-robot assembly system. The system incorporates a serial robot for force-controlled compliant assembly of precision axial holes, leveraging joint force sensors for direct force-feedback control to ensure enhanced positional accuracy. Additionally, a parallel robot facilitates precise positional adjustments, with its positioning accuracy further refined through kinematic calibration techniques validated through rigorous simulations. Ultimately, the established dual-robot assembly experimental platform successfully demonstrated the precision assembly of high-density axial holes, offering robust technical support for the precise integration of highly integrated components in electronic equipment.

Study on nanosecond pulsed laser micro-milling of stainless steel miniature gears with intersecting-axes

The utilization rate of miniature gears has increased sharply with the widespread application of micro-pumps, electronic equipment, and measuring instruments, and therefore the design and processing of miniature gear has become a subject of intense research. Current research has predominantly focused on machining miniature parallel-axes gears, but well-established machining methods for miniature intersecting-axes gears are still lacking. This paper presented a nanosecond pulsed laser micro-milling technology for miniature intersecting-axes gear (MIAG). Firstly, the 3D models of driving MIAG and driven MIAG were established, and the machining schemes were proposed on the basis of the characteristics of the models. Then, the influences of processing parameters such as defocusing distance, pulse overlap, and scanning strategy on the output responses, including removal rate, surface roughness, and shape accuracy were analyzed. Afterward, some miniature structures, such as miniature grooves, cylinders and cones, were machined by combining these process parameters. Finally, the MIAGs were machined, and the accuracy evaluation and kinematics experiment were carried out. The diameter of driving MIAG was 1.21 mm, and the diameter of driven MIAG was 3.389 mm. The experimental results indicate that the proposed machining technology can process MIAG with relatively high precision and can also offer a valuable reference for the manufacturing of other miniature components.

Large room-temperature elastocaloric effect and enhanced specific adiabatic temperature change of Ni–Mn-based shape memory microwire

Continuous miniaturization of electronic components puts higher demands on the heat dissipation of the micro-systems, which requires environmental friendliness, good heat exchange capability, and high-performance micro-refrigeration materials. Here, we developed a Ni–Mn–Fe–In microwire fabricated by the Taylor–Ulitovsky method, showing ⟨001⟩A orientation close to the axial direction of microwire. Due to the large volume change ΔV/V (−1.24%), the large entropy change ΔStr of 43.6 J kg−1 K−1 was achieved in the microwire. Owing to the low driving force of the microwire with a single crystalline of ⟨001⟩A orientation close to the axial direction of microwire, large adiabatic temperature change of −5.7 K was achieved at room temperature after removing a low stress of 120 MPa. Thus, high specific adiabatic temperature change of 47.5 K/GPa was obtained in the microwire, which is the highest value among all the reported low-dimension elastocaloric materials, including thin films/foils, microwires/wires, and ribbons. The outstanding comprehensive properties give this microwire a great application potential in miniaturization and compactness of refrigeration devices.

Proposed checklist for the implementation of the SMT component assembly process

The manufacture of electronic products has evolved significantly over time: it began with Wire Assembly, passed through THT (Through Hole Technology) with the emergence of Printed Circuit Boards, and reached SMT (Surface Mount Technology), following the trend towards the miniaturization of electronic components. The complete SMT production process generally consists of three distinct stages: the application of solder paste, the positioning of components and solder reflow to electrically connect the components to the board. It is a process of assembling electronic components directly onto the surface of a printed circuit board (PCB), an automatic process that enables the production of electronic boards at high speed and precision. The manufacture of electronic boards using surface mount technology is the most up-to-date, even more so with the advent of Industry 4.0, which is increasingly raising the level of investment required to purchase the equipment/machines that make up a fully automated assembly line. However, it is common to find inefficient SMT lines, increasing manufacturing costs. In this context, this paper aims to present SMT equipment in the electronic board assembly sector, an efficient implementation system, considering everything from Design for Manufacturing (DFM) to Start Up, including Technical Information on the Board and the Components to be inserted into it, through the Programming of Assembly Equipment.

Study on the suppression of secondary electron emission characteristics based on TiN

Abstract With the continuous development of satellite communications, the problem of high-frequency high-power multipactor caused by the miniaturization of microwave passive components in the aerospace field has become more and more serious. In this paper, for the problem of multipactor suppression of load passive devices, we carried out research on the preparation of TiN thin films based on PEALD and put forward a new method for suppressing SEE with good suppression effect, high consistency, low surface resistance, and other aspects of the unity of the multipactor effect. The use of 20nm TiN coating can make the silver-plated surface secondary electron emission coefficient down to 1.59. The RF surface resistance change rate is less than 3%. In the field of communication, satellite and navigation and other fields have a wide range of application prospects.

Line-Via-Patch Structure and Its Applications in Miniaturization of Microwave Components

Line-Via-Patch Structure and Its Applications in Miniaturization of Microwave Components

Fast machine-learning-enabled size reduction of microwave components using response features

Achieving compact size has emerged as a key consideration in modern microwave design. While structural miniaturization can be accomplished through judicious circuit architecture selection, precise parameter tuning is equally vital to minimize physical dimensions while meeting stringent performance requirements for electrical characteristics. Due to the intricate nature of compact structures, global optimization is recommended, yet hindered by the excessive expenses associated with system evaluation, typically conducted through electromagnetic (EM) simulation. This challenge is further compounded by the fact that size reduction is a constrained problem entailing expensive constraints. This paper introduces an innovative method for cost-effective explicit miniaturization of microwave components on a global scale. Our approach leverages response feature technology, formulating the optimization problem based on a set of characteristic points derived from EM-analyzed responses, combined with an implicit constraint handling approach. Both elements facilitate handling size reduction by transforming it into an unconstrained problem and regularizing the objective function. The core search engine employs a machine-learning framework with kriging-based surrogates refined using the predicted improvement in the objective function as the infill criterion. Our algorithm is demonstrated using two miniaturized couplers and is shown superior over several benchmark routines, encompassing both conventional (gradient-based) and population-based procedures, alongside a machine learning technique. The primary strengths of the proposed framework lie in its reliability, computational efficiency (with a typical optimization cost ranging from 100 to 150 EM circuit analyses), and straightforward setup.

Multiband and bidirectional multiplexing asymmetric optical transmission empowered by nanograting-coupled defective multilayer photonic crystal

Asymmetric optical transmission (AOT) has been an enduring hot topic of interest in various fields, including optical communication, information processing, and so on. Particularly, the development of reciprocal micro-nanostructures achieving AOT further facilitates and accelerates the miniaturization and integration of traditional optical components. However, most of these optical components merely consider a single AOT band and transmission in a specified direction, limiting the development of their versatile functions. In this paper, we theoretically propose an all-dielectric metamaterial consisting of a nanograting and a defective multilayer photonic crystal, exhibiting multi-band and bidirectional multiplexing AOT. More specifically, the proposed metamaterial demonstrates both narrowband and wideband AOT for incidence from the nanograting to the photonic crystal, and a completely different narrowband AOT for the opposite incidence, namely, from the photonic crystal to the nanograting. These distinctive AOT spectral features are achieved by matching the diffraction effect of the nanograting with the special energy band of the defective multilayer photonic crystal. Remarkably, the device exhibits a transmittance difference of up to 0.974 and a contrast ratio of up to 0.997 (transmittance ratio of up to 673), with a transmission bandwidth of 62.7 nm for incident light with a wavelength of 624 nm illuminating from the nanograting to the defective multilayer photonic crystal. Furthermore, the bandwidth and number of transmission bands can be flexibly tuned by changing the polarization angle of the incident light, showcasing its excellent polarization multiplexing characteristics. The designed metamaterial provides an effective strategy for the realization of versatile AOT devices and is conducive to expanding the application scenarios of AOT devices.

A wideband flexible antenna utilizing PMMA/PVDF‐HFP/PZT polymer composite film and silver‐based conductive ink for wearable applications

AbstractThe relentless drive towards miniaturization and seamless integration of electronic components in wireless communications and wearable devices has significantly increased the demand for flexible, cost‐effective composites with high dielectric constants and low losses. This study presents a wideband, low‐profile, and flexible antenna with excellent on body radiation performance for wearable applications. The antenna is designed using a low‐loss composite film based on PMMA‐PVDF‐HFP‐PZT and silver‐based ink. The proposed flexible antenna exhibits a wide bandwidth of 132.16% with a voltage standing wave ratio (VSWR) of less than two. It achieves a peak gain of 2.76 dBi at 2.92 GHz and maintains a maximum radiation efficiency of 80% across the 1.26–6.17 GHz frequency range. These characteristics demonstrate that the antenna is an effective solution for achieving high data rates and reliable communication links. The antenna's suitability for wearable applications is assessed by testing it on a simulated human body and analyzing its behavior under physical deformation. The results under bending showed only a minimal frequency detuning, which is negligible given the antenna's wide operational bandwidth. The specific absorption rate (SAR) analysis shows values of approximately 1.88 W/kg at 3.5 GHz with an input power of 0.5 W, and 0.279 W/kg at 5.8 GHz with an input power of 0.45 W, which complies with established safety limits for exposure. Overall, these results suggest that the proposed antenna is a viable solution for integration into wearable medical devices, such as a doctor's chest badge, enabling noncontact interactions and reducing the risk of bacterial contamination.

High-Yield Production of High-κ/Metal Gate Nanopattern Array for 2D Devices via Oxidation-Assisted Etching Approach.

2D materials with atomically thin nature are promising to develop scaled transistors and enable the extreme miniaturization of electronic components. However, batch manufacturing of top-gate 2D transistors remains a challenge since gate dielectrics or gate electrodes transferred from 2D material easily peel away as gate pitch decreases to the nanometer scale during lift-off processes. In this study, an oxidation-assisted etching technique is developed for batch manufacturing of nanopatterned high-κ/metal gate (HKMG) stacks on 2D materials. This strategy produces nano-pitch self-oxidized Al2O3/Al patterns with a resolution of 150nm on 2D channel material, including graphene, MoS2, and WS2 without introducing any additional damage. Through a gate-first technology in which the Al2O3/Al gate stacks are used as a mask for the formation of source and drain, a short-channel HKMG MoS2 transistor with a nearly ideal subthreshold swing (SS) of 61mVdec-1, and HKMG graphene transistor with a cut-off frequency of 150GHz are achieved. Moreover, both graphene and MoS2 HKMG transistor arrays exhibit high uniformity. The study may bring the potential for the massive production of large-scale integrated circuits using 2D materials.

All-optical nanoscale thermometry with silicon carbide color centers

All-optical thermometry plays a crucial role in precision temperature measurement across diverse fields. Quantum defects in solids are one of the most promising sensors due to their excellent sensitivity, stability, and biocompatibility. Yet, it faces limitations, such as the microwave heating effect and the complexity of spectral analysis. Addressing these challenges, we introduce a novel approach to nanoscale optical thermometry using quantum defects in silicon carbide (SiC), a material compatible with complementary metal-oxide-semiconductor (CMOS) processes. This method leverages the intensity ratio between anti-Stokes and Stokes emissions from SiC color centers, overcoming the drawbacks of traditional techniques such as optically detected magnetic resonance (ODMR) and zero-phonon line (ZPL) analysis. Our technique provides a real-time, highly sensitive (1.06% K−1), and diffraction-limited temperature sensing protocol, which potentially helps enhance thermal management in the future miniaturization of electronic components.

Вимоги до вибору значень параметрів радарів із синтезованою апертурою на базі малих космічних апаратів дистанційного зондування Землі

Present-day small satellites for Earth remote sensing have found wide practical application in solving different problems in the socio-economic and defense areas. The use of small satellites is justified as a basis for the formation both of large constellations and constellations of several spacecraft or single spacecraft with the aim to reduce the cost of Earth remote sensing information. The miniaturization of electron components and the latest technological advances have made radar systems compatible with small satellites. The goal of this paper is to present, based on small satellites, expressions for calculating the key parameters of radar systems and their analysis and to calculate possible values of the parameters considered. Possibilities in principle of using synthetic aperture radars (SARs) are considered. The paper presents an overview of Internet sources that give broad information on the recent trends, technologies, and use SAR-equipped satellites. Particular attention is paid to the development of mini- and microspacecraft with X-band SARs operating, in particular, in the stripmap and spotlight modes. The key parameters that have an effect on the SAR possibility of producing high-quality images are presented. By the example of the ICEYE constellation of small satellites, important technical characteristics and parameters of modern radar systems equipped with an active phased array antenna are presented. A model of SAR imaging in the stripmap mode is considered. In the approximation of a rectangular antenna aperture, expressions are given to estimate the slant and the horizontal range resolution and the azimuthal resolution. The available range of the small-satellite SAR pulse repetition frequency is estimated. Relationships between the maximum swath width and the minimum SAR pulse repetition frequency are presented. Expressions are given to estimate the antenna dimensions, the SAR sensitivity, and the signal-to-noise ratio. The presented expressions allow one to analyze the effect of the main technical characteristics and parameters of minisatellite SARs on the design and power characteristics of small satellites and the orbit parameters. The obtained results make it possible to develop recommendations on the design of imaging equipment for home low-orbit satellites and their constellations.

Computer Vision Implementation in Computerized Telescope as a Fine Pointing Mechanism

Abstract Optical satellite communication researches have been increasing in recent years. The continuous miniaturization of components, as well as the need for higher bandwidths, has led to higher frequency applications and narrower beams. For these technologies to work properly, it is needed to achieve a precise line-of-sight between transmitters and receivers, thus a strict pointing system. This research shows the use of computer vision as a microradian fine pointing mechanism to achieve the tracking and detection of objects in distances of around 300 m. As a demonstration of the computer vision algorithm, a drone is tracked and correctly detected by a computer, using a computerized telescope as the optical ground station.

In–Sn–Cu co-doped yttrium iron garnet ferrite: Magnetic and dielectric properties

With the miniaturization and integration of electronic components, there has been widespread attention on yttrium iron garnet ferrite (YIG) with high saturation magnetization, high dielectric constant, and low ferromagnetic resonance linewidth. In this work, In–Sn–Cu co-doped YIG ferrite with the chemical formula Y3Fe4.8-xCu0.1Sn0.1InxO12 (x = 0.05, 0.10, 0.20, 0.30) was prepared. The properties of the samples, including their microstructure, crystal structure, magnetic attributes, and dielectric properties, were adjusted through the regulation of the indium doping levels. The microscopic and crystal structures confirm the effective doping of ions in YIG, resulting in an expansion of the lattice parameters. Both the saturation magnetization (Ms) and the ferromagnetic resonance linewidth (ΔH) are influenced by the level of doping. The maximum value of Ms is observed at x = 0.10 (30.86 emu/g), whereas the minimum value of ΔH occurs at x = 0.20 (35 Oe). Additionally, increasing doping concentration also leads to an upward trend in both resistivity and dielectric constant, with the lowest dielectric loss occurring at x = 0.15. This study will provide an effective approach for developing high-performance YIG ferrite that meets the requirements of miniaturization and integration.

State of the art of micro vapour-compression systems

Thermal management is becoming more challenging due to the increasing compactness and computational power of appliances. Affordable and efficient solutions include active liquid cooling methods, thermoelectric cooling, and the use of heat pipes. From these, vapour-compression technologies achieve the highest power density. However, the downscaling of vapour-compression for cooling of personal computers or workstations is rather problematic from several different reasons. The first problem concerns the low second law efficiency of miniature vapour-compression systems. The second problem concerns the available space occupation of such a cooling system. Moreover, miniature and high-power density condensers and evaporators have not yet been adequately researched and developed to date. In this review, we present several vapour-compression refrigeration systems that are based in some way on the miniaturisation of systems or individual components – evaporators, condensers, and compressors. These are presented and compared in terms of cooling power, COP, and the second law efficiency. At the end of the manuscript, guidelines for future improvements and the implementation of miniature vapour-compression systems are presented.

Scaling photonic integrated circuits with InP technology: A perspective

The number of photonic components integrated into the same circuit is approaching one million, but so far, this has been without the large-scale integration of active components: lasers, amplifiers, and high-speed modulators. Emerging applications in communication, sensing, and computing sectors will benefit from the functionality gained with high-density active–passive integration. Indium phosphide offers the richest possible combinations of active components, but in the past decade, their pace of integration scaling has not kept up with passive components realized in silicon. In this work, we offer a perspective for functional scaling of photonic integrated circuits with actives and passives on InP platforms, in the axes of component miniaturization, areal optimization, and wafer size scaling.

Numerical Study of the Thermal and Hydraulic Characteristics of Plate-Fin Heat Sinks

One of the main trends in the development of the modern electronics industry is the miniaturization of electronic devices and components. Miniature electronic devices require compact cooling systems that can dissipate large amounts of heat in a small space. Researchers are exploring ways to improve the design of the heat sink of the cooling system in such a way that it increases the heat flow while at the same time reducing the size of the heat sink. Researchers have previously proposed different designs for heat sinks with altered fin shapes, perforations, and configurations. However, this approach to optimizing the design of the heat sink results in an increase in the labor intensity of its production. Our goal is to optimize the heat sink design to reduce its size, reduce metal consumption, and increase heat flow. This goal is achieved by changing the number of fins and the distance between them. In this case, there is no significant difference in the geometry of a conventional plate-fin heat sink, and a low labor intensity of production is ensured. A numerical investigation of heat flow and pressure drop in models of plate-fin heat sinks of various sizes and metal volumes was conducted using the ANSYS Fluent software package (v. 19.2) and computational fluid dynamics employing the control volume method. We used the SST k-ω turbulence model for the calculations. The research results showed that by changing the number of fins and the distance between them, it is possible to increase the heat flow from the heat sink to 24.44%, reduce its metal consumption to 6.95%, and reduce its size to 30%. The results of this study may be useful to manufacturers of cooling systems who seek to achieve a balance between the compactness of the heat sink and its ability to remove large amounts of heat.

Miniaturized time-correlated single-photon counting module for time-of-flight non-line-of-sight imaging applications.

Single-photon time-of-flight (TOF) non-line-of-sight (NLOS) imaging enables the high-resolution reconstruction of objects outside the field of view. The compactness of TOF NLOS imaging systems, entailing the miniaturization of key components within such systems, is crucial for practical applications. Here, we present a miniaturized four-channel time-correlated single-photon counting module dedicated to TOF NLOS imaging applications. The module achieves excellent performance with a 10ps bin size and 27.4ps minimum root-mean-square time resolution. We present the results of the TOF NLOS imaging experiment using an InGaAs/InP single-photon detector and the time-correlated single-photon counting module and show that a 6.3cm lateral resolution and 2.3cm depth resolution can be achieved under the conditions of 5m imaging distance and 1ms pixel dwell time.

Analysis of a Graphene FET-Based Frequency Doubler for Combined Sensing and Modulation through Compact Model Simulation

The ambipolar conduction property of graphene field-effect transistors (GFETs) and the inherent square-like dependence of the drain current on the gate voltage, enable the development of single-device architectures for analog nonlinear radiofrequency (RF) circuits. The use of GFETs in novel RF component topologies allows leveraging graphene’s attractive thermal and mechanical properties to improve the miniaturization and weight reduction of electronic components. These features are specifically appealing for integrated sensing, modulation, and transmission systems. However, given the innovative nature of emerging graphene-based technology, a complete performance analysis of any novel electronic component is essential for customizing the operating conditions accordingly. This paper presents a comprehensive circuital analysis of a GFET-based frequency doubler, exploiting a compact model for GFET circuit simulation to assess the device’s performance parameters, including power conversion gain bandwidth and saturation. The performed analysis proposes to support the design of GFET-based harmonic transponders, offering integrated sensing and signal manipulation capabilities.

The simulation study of high-performance micro-inductors Based on MEMS 3D coils

With the development of flexible electronics and microsystems, the demand for the miniaturization of electronic components is becoming increasingly urgent. Due to the advantages of miniaturization, low power consumption, and easy integration, the micro-inductors fabricated by microfabrication technology get more and more attention. However, the traditional two-dimensional inductors are no longer able to meet the growing needs of today’s society in terms of occupied areas, inductance values, and packaging costs. So, this paper proposes a three-dimensional structure thin film solenoid micro-inductor based on MEMS and analyzes it by using finite element method (FEM). The simulation focuses on recording the inductance values and quality factors of the micro-inductors with varying parameters in the frequency range of 0-2, 000 MHz. Additionally, the maximum current values corresponding to the micro-inductors with different parameters are recorded at the operating temperature of polyimide, specifically addressing the current-carrying capacity. The simulation result has certain theoretical guidance for high-performance micro-inductors design.