A simulation study of the impact of interface traps on the performance of the Epitaxial Layer Tunnel Field Effect Transistor (ETLTFET) having Si(1-x)Gex as source material is investigated in terms of interface Trap distribution, energies, random trap fluctuation (RTF), and temperature in comparison with FinFET. The study revealed a similar trend of Vth shift for ETLTFET and FinFET for a given trap type. For both ETLTFET and FinFET, the donor interface trap with energy above the semiconductor mid band gap can cause a shift in ION as well as IOFF, while the acceptor interface trap has a comparatively wider energy range. Again, trap induced SS degradation is minor in ETLTFET than its counterparts. In the case of RTF in nano-scaled devices, the fluctuations in ION and Vth induced by interface traps are found to vary with the position of the trap, and the variations at ETLTFET are relatively more minor than the FinFET. Furthermore, the presence of interface trap charges alters the device's temperature sensitivity which could be detrimental for the device to be utilized in sensor applications.
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