Assembly adhesives play a critical role in microelectronic packaging and contribute significant value for circuit assembly interconnection, protection, and thermal management. Of particular interest with today’s more powerful systems is thermal management of high-power density electronic systems, including power modules, power amplifiers, communication systems, and directed energy systems. As requirements for performance and functionality increase, heat generated from these devices increases exponentially. For example, local heat flux can easily exceed 50 W/cm2 for IGBT power modules while it may reach several hundred Watts/cm2 at active areas for Gallium Nitride (GaN) power amplifiers. Simultaneously, many of these systems demand a higher level of electrical insulation to eliminate or minimize current leakage to ensure high reliability over a long service life. Effectively and safely dissipating the high heat and ensuring excellent electrical insulation has become an increasingly critical and challenging task in the microelectronics packaging technology for aerospace and defense systems. This paper presents integration of thermally conductive adhesives with an electrically insulative polyimide film into a carefully engineered laminate, which enables high thermal transfer and robust electrical insulation. This new film adhesive provides outstanding compliance and augmented tolerance to large topographical features and warpage (5-7 mils). This film adhesive is one of the potential solutions to addresses the evolving needs of the electronics assembly industry in the areas of management of high-power systems