Abstract Surface topography and roughness characteristics were studied based on the analysis of three dimensional atomic force microscopy images of several multilayer ultrathin-film samples. TiN, CrN and NbN (200 nm thick) were deposited on single crystal n-type silicon without or with a 200 nm thick underlayer of silicon dioxide or silicon nitride. The nitride films were deposited by physical vapour deposition technique and the underlayer films by plasma-enhanced chemical vapour deposition. Nanomechanical studies and nanotribological tests were also conducted to investigate the properties of such films as possible candidates for protective layers on rubbing elements of microelectromechanical systems. The effect of the underlayer on the surface properties and the mechanical/tribological behaviour was evaluated as well.
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