Methylhexahydrophthalic Anhydride Research Articles

Effects of Chemical Composition and Cross-Linking Degree on the Thermo-Mechanical Properties of Bio-Based Thermosetting Resins: A Molecular Dynamics Simulation Study.

Bio-based epoxy resins have received significant attention in terms of concerns regarding carbon emission. Epoxidized soybean oil (ESO) derived from sustainable feedstock has been widely used to blend with traditional diglycidyl ether of bisphenol-A (DGEBA) to replace some of the petroleum-based components. In this work, molecular dynamics (MD) simulations were applied to track the network formation and predict the performance of methyl hexahydrophthalic anhydride (MHHPA)-cured ESO/DGEBA blend systems. The effects of ESO content and cross-linking degree on the mass density, volumetric shrinkage, glass transition temperature (Tg), coefficient of thermal expansion (CTE), Young's modulus, yield strength, and Poisson's ratio of the epoxy resin were systematically investigated. The results show that systems with high ESO content achieve gelation at low cross-linking degree. The Tg value, Young's modulus, and yield strength increase with the increase in cross-linking degree, but the CTE at the glassy state and Poisson's ratio decrease. The comparison results between the simulated and experimental data demonstrated that the MD simulations can accurately predict the thermal and mechanical properties of ESO-based thermosets. This study gains insight into the variation in thermo-mechanical properties of anhydride-cured ESO/DGEBA-based epoxy resins during the cross-linking process and provides a rational strategy for optimizing bio-based epoxy resins.

Accelerating effect of metal ionic liquids for epoxy-anhydride copolymerization

One of the main drawbacks of high-performance epoxy-anhydride thermosets is slow cross-link kinetics requiring high temperature and long curing cycle. Herein, the accelerating effect of imidazolium metal-based ionic liquids (MILs) bearing (FeCl4)-, (ZnCl4)2-, and (CoCl4)2- anions on epoxy-anhydride copolymerization was investigated. It was observed that MILs accelerated bisphenol diglycidyl ether (DGEBA) − methylhexahydrophthalic anhydride (MHHPA) cross-linking, better than the reference catalysts (1-methylimidazole and 1-butyl-3-methylimidazolium chloride), especially at low temperatures through their ability to activate a rapid anhydride ring opening and formation of carboxyl groups, which initiates polyesterification. A detailed investigation of the polymerization mechanism revealed the formation of alternating epoxy-anhydride copolymers although several MILs-induced initiation mechanisms were detected. Despite the multiple-initiation consisting of imidazole, counter anion, and polyesterification pathways, the cross-linking kinetics was successfully fitted up to vitrification by the Kamal-Sourour model. Finally, MILs-induced cross-linking leads to homogeneous network build-up enabling to produce thermosetting materials with an increased cross-link density, a glass transition temperature above 150 °C, and excellent thermal stability.

Effects of epoxy resin on the high‐temperature performance of desulfurized rubber modified asphalt

AbstractIn order to improve the performance of desulphurized rubber modified asphalt, especially the high‐temperature performance, epoxy resin was selected to modify the modified asphalt with three curing agent and accelerator components. The conventional properties, rheological properties, curing effect, process energy, and modification mechanism of epoxy resin—desulfurized rubber modified asphalt were analyzed. The experimental results show that the addition of epoxy resin to asphalt can all improve the high‐temperature performance of modified asphalt. The promoter component (PC) further improves the high‐temperature performance and reduces the viscosity. Among them, diaminodiphenyl sulfone and methylhexahydrophthalic anhydride in a 1:1 mass combination with epoxy resin modified asphalt not only had better high‐temperature performance, but also had excellent low‐temperature performance and ideal curing process. From the results, it can be seen that 5% epoxy resin with mixed curing agent with 3% PC had the best overall performance.

Recyclable epoxy resins with different silyl ether structures: structure–property relationships and applications in diverse functional composites

In this work, three liquid silyl ether-containing cycloaliphatic epoxides (CESI1, CESI2 and CESI3) with different numbers of pendent phenyl groups were synthesized and cured by methylhexahydrophthalic anhydride. The high glass transition temperatures of the cured epoxy resins range from 150 to 184 °C, which increase with the increasing number of pendent phenyl groups. However, the tensile strengths of the cured epoxy resins decrease as the number of pendent phenyl groups increase. Incorporating dynamic silyl ether bonds enables the cured epoxy resins to be reprocessable and degradable. It is demonstrated that the pendent phenyl groups have a significant impact on the dynamic behaviors and degradation rates of cured epoxy resins. The reprocessing efficiencies and degradation rates of the three epoxy resins monotonously decrease with increasing the number of pendent phenyl groups. Finally, the CESI1 resin with the lowest viscosity was used as the polymer matrix for carbon fiber reinforced composites, electromagnetic wave absorbing coatings and silver-filled conductive adhesives. Notably, non-destructive recovery of carbon fibers, ferromagnetic particles and silver flakes can be achieved through the degradation of the epoxy matrix.

Cycloaliphatic epoxy-functionalized polydimethylsiloxanes for comprehensive modifications of epoxy thermosets

Polydimethylsiloxane (PDMS) are known as a class of efficient modifiers for epoxy thermosets, but the simultaneous improvement in thermal stability, thermomechanical and mechanical properties remain a challenge. Herein, we report a cycloaliphatic epoxy-functionalized polydimethylsiloxane (PDMS-CE) with a designed epoxy value for comprehensive modifications of diglycidyl ether of bisphenol A (DGEBA)/methylhexahydrophthalic anhydride (MeHHPA) thermosets. Compared to neat epoxy thermoset, the 4 wt% PDMS-CE modified epoxy thermoset showed a 79 %, 120 % and 503 % increase in flexural strength, impact strength and fracture toughness, respectively, as well as a slight increase in the initial thermal decomposition temperature (Td5%) and glass transition temperature (Tg), and a desirable decrease in the dielectric constant and water absorption rate. This comprehensive modification performance was caused by the combined effects of crosslinking density improvement, rigid cycloaliphatic structure, as well as the flexible PDMS chains.

Electrical Properties of Alicyclic Epoxy Resins for Application to Varnish of Rotating Machine Winding

Epoxy resins (EP) are commonly used to power apparatus due to their excellent electrical, thermal, and mechanical properties. Two types of EP resins were prepared to develop the varnishes for a rotating machine winding. A bifunctional alicyclic EP were used as an EP main resin, and an acid anhydride [mixture of hexahydro phthalic anhydride and methyl hexahydro phthalic anhydride (HHPA), or methyl nadic anhydride (NMA)] were used as a curing agent. The DC and impulse breakdown strengths of the EP‐HHPA were higher than that of EP‐NMA regardless of the applied voltage waveform and the temperature. The PDIV of the twisted pair sample coated with EP‐HHPA under the surge voltage application was also higher than that of twisted pair sample without the coating with EP resin and that with EP‐NMA. Furthermore, the transferred and/or accumulated charge amount of the EP‐HHAP on bulk and surface properties at high temperatures were superior to that of EP‐NMA. From these results, it is considered that EP‐HHPA may be preferable varnishes materials than EP‐NMA for a rotating machine winding. © 2023 Institute of Electrical Engineer of Japan and Wiley Periodicals LLC.

Design and synthesis of epoxy prepolymer containing aromatic imide structures for thermoset with excellent thermal, mechanical and dielectric properties

Recently, the development of epoxy thermosets with imide rings has received extensive attention due to their superior integrated properties, especially for thermal, mechanical and dielectric properties, compared to those of commercialized bisphenol A epoxy thermosets, yet remains substantial challenges, such as the high epoxy equivalent weight (EEW) of the epoxy prepolymers and the poor processibility of the epoxy systems. In this work, an imide-containing epoxy prepolymer (BAPT-EP) was facilely synthesized. It had a relatively low EEW of 340 g/equiv. and could be dissolved in hardener methylhexahydrophthalic anhydride (MHHPA) to give a homogeneous BAPT-EP/MHHPA system with good processibility. Thanks to the aromatic imide structures, the cured BAPT-EP/MHHPA showed improved overall properties. In particular, it had a 47.9 °C, 24.7 °C, 29.4%, 77.3% and 10.0% increase in the glass transition temperature, temperature at 5% mass loss, tensile strength, Young’s modulus and tensile toughness, respectively, compared to those of bisphenol A epoxy prepolymer (DGEBA)/MHHPA thermoset. Meanwhile, BAPT-EP/MHHPA thermoset featured good charring ability with a high char yield of 26.4% (800 °C/N2), remarkable dimensional stability with a low coefficient of thermal expansion of 52.5 ppm/°C and good dielectric properties with a low dielectric constant of 3.24 at 100 MHz. This work provides an elegant strategy to prepare high-performance epoxy thermosets with imide structures, which have promising applications in electronics.

Construction of a copper hydroxystannate functionalized graphene oxide for rigid polyvinyl chloride foam toward improved fire safety

AbstractA copper hydroxystannate (CHS) functionalized graphene oxide (GO) (CHS@GO) was feasibly prepared through an in‐situ method, and well characterized by TEM, XRD, FTIR and XPS. Rigid poly vinyl chloride (RPVC) foams containing CHS@GO were prepared by utilizing methyl hexahydrophthalic anhydride and isocyanate as coupling agents, azodiisobutyronitrile and azodicarbonamide as blowing agents. The fire safety, mechanical properties and thermal decomposition behavior of the RPVC foams were studied. The RPVC foam containing 2 wt% CHS@GO (RPVC/2CHS@GO) achieved a limiting oxygen index (LOI) of 35.5% and a V0 rating in the UL‐94 tests. The cone calorimetric tests (CCT) results demonstrated the peak heat release rate (pHRR) and total heat release (THR) of RPVC/2CHS@GO were reduced by 40.6% and 36.8%, respectively, compared with those of pure RPVC foam (pure RPVC). The compressive strength and flexural strength of RPVC/2CHS@GO were increased by 47.3% and 34.6%, respectively, in contrast with those of Pure RPVC. The thermogravimetry results showed that CHS@GO endowed the RPVC foams with improved char residue.

Enhancing mechanical and electrical properties of phthalic anhydride‐based unsaturated polyester resin by structural modification using methylhexahydrophthalic anhydride

AbstractThis work investigates the influence of methylhexahydrophthalic anhydride (MHHPA) on the properties of phthalic anhydride‐based unsaturated polyester resin (PA‐based UPR) when PA is replaced by MHHPA with different PA/MHHPA mole ratios, ranging from 100/0 to 0/100. Fourier transform infrared spectroscopy (FTIR), differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA) are used to study the chemical structure, curing process and mechanical properties of the resins, showing the successful incorporation of MHHPA into the structure of UPRs with superior properties, compare to PA‐based UPRs. In particular, the addition of MHHPA significantly lowers the acidity by up to 28% and promotes the curing reaction, reducing the enthalpy of the reaction by 2.5 times, and shortens the curing time by up to 40%. This incorporation also increases the gel content up to 99.9%, thereby increasing the crosslinking between the polyester chains and improving the rigidity of UPRs. In addition, the glass‐transition temperature of the polymer increases approximately 78%, which can improve the working temperature of the MHHPA‐modified UPRs. The electrical properties of the resins containing MHHPA reveal better insulating performance in comparison with the PA‐based UPR. These findings demonstrate great potentials of the MHHPA‐modified UPRs for various applications, especially in outdoor environments.

Preparation and properties of p-coumaric acid epoxy resin co-cured by a novel fluorinated diamine curing agent based on bisphenol AF in electronic materials

The epoxy resin based on p-coumaric acid and fluorine-containing diamine curing agent based on bisphenol AF were synthesized. The chemical structure was confirmed by FTIR, 1H NMR, 13C NMR and 19F NMR. Using HCA-EP as the epoxy resin matrix, methyl hexahydro phthalic anhydride as the curing agent and BAFFP as the co-curing agent, the performance differences were investigated for different curing systems, including HCA-EP-BAFFP-0/10/20/30. The results show that the increase of BAFFP content can improve the mechanical properties and dielectric properties of HCA-EP. In particular, HCA-EP-BAFFP-30 exhibited the highest impact and flexural strengths (7.14 KJ/m2 and 142 MPa), exceeding HCAP-EP-BAFFP-0 (2.9 KJ/m2 and 113 MPa) by 147% and 26%. In addition, HCA-EP-BAFFP-30 has the lowest dielectric constant and dielectric loss (Dk = 3.61 and Df = 0.00243 at 10 MHz). Therefore, we believe that HCA-EP cured with BAFFP has great potential for application in the field of electronic packaging materials.

Curing Kinetics and Dielectric Properties of Anhydride Cured Epoxy Resin With Different Accelerator Contents

The addition of accelerator reduces the curing reaction temperature, changes the curing reaction process, and affects the morphology of the crosslinking structure, which would lead to the difference in the dielectric properties of the epoxy resin. In this study, the curing behaviors and dielectric properties of diglycidyl ether of bisphenol A (DGEBA)/methyl hexahydrophthalic anhydride (MHHPA) were investigated with respect to the contents of the curing accelerator, Tris-(dimethylaminomethyl) phenol (DMP-30). The curing behavior of epoxy resin was studied by differential scanning calorimetry (DSC), and it was found that the system conforms to the Sestak–Berggren kinetic model [SB ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${m},{n}{)}$ </tex-math></inline-formula> ]. The accelerator content has a saturation effect on the dielectric properties of the epoxy resin curing sample, and excessive content can lead to the increase of dielectric constant and loss and decrease of breakdown strength. The cured sample with 0.5% accelerator addition has the best dielectric properties and the highest breakdown strength. The analysis concludes that the optimum accelerator content allows for a more rational curing crosslinking network.

Plant-derived p-hydroxyphenylacrylic acid-derived epoxy resins exhibit excellent flame retardancy, hydrophobicity, degradability, and low dielectric loss after curing with bio-based fluorinated Schiff bases

Epoxy resins are designed to achieve high flame retardancy, hydrophobicity, and dielectric properties. However, the search for sustainable bio-based epoxy resin precursors that do not require additional flame retardants is still underway. Herein, we report a p-hydroxycinnamic acid-derived epoxy resin monomer (HCA-EP) obtained via a simple one-step reaction. HCA-EP can be combined with 4,4′-((2,2′-bis(trifluoromethyl)-[1,1′-biphenyl]-4,4′-dial)bis(azanylylidene))bis(methanylylidene))bis(2,6-dimethoxyphenol) (SA-BTB) and cured to prepare epoxy resins(HCA-EP/SA-BTB). In comparison to HCA-EP cured with a common petroleum-based curing agent(HCA-EP/MeHHPA), such as methylhexahydrophthalic anhydride (MeHHPA), HCA-EP/SA-BTB exhibited a significantly high glass transition temperature (170 °C), excellent hydrophobic properties, and lower dielectric loss. In addition, HCA-EP/SA-BTB passed the V-0 flame rating of the UL-94 test and exhibited an ultimate oxygen index of 43.3%. Notably, it demonstrated a coke yield of 42.3% under N2 conditions, whereas that of HCA-EP/MeHHPA was 18%. Moreover, its flame-retardant index was found to be 19.8, indicating its excellent flame-retardant properties. Further, it could be degraded under acidic conditions. These findings indicate that the proposed method can be used to develop high-performance bio-based thermoset materials.

Curing Degree Dependence of Dielectric Properties of Bisphenol-A-Based Epoxy Resin Cured With Methyl Hexahydrophthalic Anhydride

The dielectric properties of epoxy resin mainly depend on its microstructures, especially the curing degree. In this article, the reaction process of diglycidyl ether of bisphenol A (DGEBA)/methyl hexahydrophthalic anhydride (MHHPA) system is studied by differential scanning calorimetry, and samples with different curing degrees are prepared by regulating the curing temperature and time. The evolution of microstructure during epoxy resin crosslinking is simulated by molecular dynamics simulation. It is found that the effect of the curing degree on dielectric properties can be attributed to the distribution of polar groups and the mobility of chain segments, while the contribution of free volume is insignificant. With the increase of the curing degree, the epoxy group at the chain end is transformed into an ester group with weaker polarity, as well as the epoxy molecular segments are combined more closely and the mobility of molecules decreases, resulting in an improvement in the dielectric properties of the epoxy resin.

Preparation of degradable bio-based silicone/epoxy hybrid resins towards low dielectric composites

Epoxy resins are well-known adhesive materials, however, the high dielectric constant (Dk) limited their application in microelectronic devices. Additionally, non-degradability is a bottleneck for all thermosetting resins, and the discarded resins posed the great threat to environment. Herein, a bio-based eugenol epoxy was grafted onto the polymethylhydrosiloxane (PMHS-x) main chain via a hydrosilylation reaction to simultaneously lower the Dk and enable degradability. The curing kinetics of bio-based silicone/epoxy hybrid resins with methyl hexahydrophthalic anhydride (MHHPA) or 4,4′-diaminodiphenylmethane (DDM) were studied. The cured resins exhibited low Dk and hydrophobicity by taking advantage of the low polarity, large molecular volume and high dissociation energy of the siloxane segments. The polysiloxane degradation process took place under alkaline conditions, allowing the retrieval of reinforced fibers from the composites. To better illustrate the superiority of the bio-based silicone/epoxy hybrid resins, quartz fiber reinforced composites were prepared. Compared to the commercial epoxy based composite, the impact strength of the PMHS-x with a silicon hydrogen content of 0.8 × 10-2 mol·g−1 was increased by 26.5 %, meanwhile, the Dk was decreased by 16.7 %. The bio-based silicone/epoxy hybrid resins not only alleviated the environmental pollution but also provided a reliable approach for fiber recycling from epoxy composites. The low polarity and degradability were integrated into bio-based silicone/epoxy hybrid resins, which provided a novel way to prepare environment-friendly materials suitable for microelectronic devices.

The curing characteristics and properties of bisphenol A epoxy resin/maleopimaric acid curing system

Epoxy resins are widely used as insulation materials for power systems and are mainly prepared from petrochemical materials, which have the disadvantage of being non-recyclable and environmentally harmful. In this paper, the maleopimaric acid (MPAc) curing agent was prepared from a renewable resource, rosin, and blended with a petroleum-based curing agent (methylhexahydrophthalic anhydride) to cure bisphenol A epoxy resin. The effects of the blending ratio on the curing characteristics as well as on the thermal, mechanical, and electrical properties of the epoxy resins were examined. From the results obtained, as for thermal properties, the introduction of MPAc enhanced the rigidity, glass transition temperature, and thermal decomposition temperature. As for mechanical properties, the brittleness was increased while the tensile strength and bending strength were weakened. When the mass fraction of MPAc was 20–30 wt%, the electrical properties reached the optimum, meeting the application requirements of electrical equipment. This study shows that using rosin-based curing agent maleicpine acid (MPAc) as a partial replacement for petroleum-based curing agents can make electrical equipment environmentally friendly, demonstrating the potential application prospects of rosin-based epoxy resins.

Cyclotriphosphazene-based epoxy resins with excellent mechanical and flame retardant properties

The design, synthesis, and characterization of a novel epoxy monomer, CP-EP, which consists of nontoxic eugenol and nonflammable cyclotriphosphazene has been carried out in this work. Chemical structure of CP-EP was confirmed by nuclear magnetic resonance (NMR) spectroscopy and mass spectrometry (MS). Using 4,4′-diaminodiphenylmethane + diethyltoluenediamine (DDM + DETDA), succinic anhydride (SA), or methylhexahydrophthalic anhydride (MeHHPA) as curing agent, three cyclotriphosphazene-based thermosets (CPTs) were produced, and non-isothermal curing behaviors were investigated by using dynamic differential scanning calorimetry. In comparison to the bisphenol-A epoxy resin, CPTs exhibit higher glass transition temperature, enhanced tensile/flexural strengths, and significantly improved nonflammability. UL-94 rating and limiting oxygen index (LOI) for CPTs were V-0 and 28% respectively. These observations suggest an effective approach for the preparation of a halogen-free epoxy thermosetting system. This approach may be used for the generation of high-performance fire-safe epoxy thermosets. Both environment and human health can benefit from the use of such materials.

Electrical Tree Characteristics of Bisphenol A Epoxy Resin/Maleopimaric Anhydride Curing System.

Epoxy resin insulation materials are mainly derived from petrochemical materials which have the disadvantages of resource consumption and environmental pollution. In order to cure bisphenol A epoxy resin, a maleopimaric anhydride (MPA) curing agent was prepared from rosin, a renewable resource, and blended with a petroleum-based curing agent (methylhexahy-drophthalic anhydride). The influence of maleopimaric anhydride content on the initiation and growth characteristics of electrical trees was studied and analyzed in this paper using molecular dynamics simulation (MD) and electrical tree tests at an 18-kilovolt power frequency voltage. When the MPA content used was ≤10%, the free volume percentage of the curing system increased with MPA content, and thus the initiation voltage became lower; when the MPA content was ≥20%, the hydrogenated phenanthrene ring structure content increased significantly with increasing MPA content, and the rigidity of the curing system increased significantly; thus, the initiation voltage gradually increased. MPA4 had an 11.11% higher initiation voltage than the petroleum-based control group. The effect of the polar rigid structure within the curing system significantly inhibited the growth rate and length of electrical trees as MPA content increased. Electrical trees developed into light-colored, thin, and narrow dendritic structures when the MPA content reached 40%. The results show that curing epoxy resin with the rosin-based curing agent maleopimaric anhydride (MPA), in place of a petroleum-based curing agent, can produce environmentally friendly resins with excellent electrical tree resistance and potential application prospects.

Simultaneous aging of DGEBA/MeHHPA epoxy resin under thermal heating and gamma irradiation up to 1000 kGy

Although epoxy resins in nuclear facilities may be exposed to elevated temperatures and gamma irradiation, changes in the chemical structures and mechanical properties of a diglycidyl ether of bisphenol-A (DGEBA)/methyl hexahydrophthalic anhydride (MeHHPA) epoxy resin under these conditions have not been reported yet. In this study, we aim to understand the accelerated aging of the DGEBA/MeHHPA epoxy resin under simultaneous thermal heating and gamma irradiation. Samples were irradiated at ambient temperature and 70 °C with a dose rate of 2 kGy/h and a total dose of up to 1000 kGy. Various characterizations were performed to investigate the changes in their chemical structures and mechanical properties. The results showed that the relative oxygen content of the resin increased near the surface owing to the degradation of the main macromolecular chains, which was accompanied by a decrease in the thermal stability and glass transition temperature (Tg). Under gamma irradiation at room temperature, the tensile strength increased with the absorbed dose up to 500 kGy and then decreased with higher doses. This trend indicated that thermal heating at 70 °C significantly enhanced the degradation of the DGEBA/MeHHPA epoxy resin upon gamma irradiation.

Fluorinated anhydride-terminated imide oligomers toward high-performance epoxy thermosets enabled by hydroxyl elimination and low dielectric polarizability strategy

In this paper, for the first time, a novel fluorinated anhydride-terminated imide oligomer 6FDA-ODA was prepared with a facile and one-step route, and used as the multifunctional co-curing agent of methylhexahydrophthalic anhydride (MHHPA) for commercial bisphenol A epoxy resin (DGEBA). For the epoxy thermoset containing 30 phr of 6FDA-ODA, 6FDA-ODA-30 exhibited a high glass transition temperature (Tg) of 151.6 ℃ and an initial degradation temperature of 382.5 ℃, and also showed a 211%, 134% and 11.8% increase in impact strength (20.5 kJ/m2 vs. 6.6 kJ/m2), char yield (in N2) (15.2% vs. 6.5%) and tensile strength (71.3 MPa vs. 63.8 MPa), respectively, compared with the pure epoxy thermoset (6FDA-ODA-0). Moreover, 6FDA-ODA-30 possessed a low dielectric constant of 3.23 at 1 MHz and high water resistance (water absorption = 0.52%) due to the introduction of bulky trifluoromethyl (-CF3) and imide moieties. This paper provides a facile design strategy and new opportunity for synthesizing anhydride-terminated imide oligomer, possessing high potential for the utilization in advanced matrix materials for microelectronic and aerospace industries.

Low‐dielectric constant and viscosity tetrafunctional bio‐based epoxy resin containing cyclic siloxane blocks

AbstractBio‐based epoxy resins with low‐dielectric constant, low viscosity and excellent mechanical properties have great significance for the future of advanced electronic and microelectronic industries. Cyclosiloxane segment possesses low polarity, high‐dissociation energy, and elevated molecular volume, thereby making it useful for the synthesis of materials with low dielectric constant and viscosity. Herein, a tetrafunctional eugenol‐based epoxy resin (DEP) based on a cyclosiloxane structure was designed and prepared through a hydrosilylation reaction. Allyl glycidyl ether (AGE) was selected as a reference compound and generated a silylation epoxy resin (AGDEP). The viscosity of these silicone‐containing tetrafunctional epoxy monomers (&lt; 0.315 Pa·s) was significantly lower than that of the conventional oil‐based epoxy resin (14.320 Pa·s). After curing with methyl hexahydrophthalic anhydride (MHHPA), the dielectric constant of DEP‐MHHPA was as low as 2.8 (10 MHz), which was superior to that of EP‐MHHPA. Notably, the glass transition temperature (Tg) of DEP‐MHHPA was as high as 100.3°C. The tensile strength and elongation at break of DEP‐MHHPA were estimated to be 66.1 MPa and 6.0%, respectively. Multifunctional eugenol‐based epoxy monomers with low‐dielectric constant and viscosity provide an efficient guideline for building epoxy‐based materials to better design future‐oriented engineering materials.