Preparation and properties of p-coumaric acid epoxy resin co-cured by a novel fluorinated diamine curing agent based on bisphenol AF in electronic materials

Abstract

The epoxy resin based on p-coumaric acid and fluorine-containing diamine curing agent based on bisphenol AF were synthesized. The chemical structure was confirmed by FTIR, 1H NMR, 13C NMR and 19F NMR. Using HCA-EP as the epoxy resin matrix, methyl hexahydro phthalic anhydride as the curing agent and BAFFP as the co-curing agent, the performance differences were investigated for different curing systems, including HCA-EP-BAFFP-0/10/20/30. The results show that the increase of BAFFP content can improve the mechanical properties and dielectric properties of HCA-EP. In particular, HCA-EP-BAFFP-30 exhibited the highest impact and flexural strengths (7.14 KJ/m2 and 142 MPa), exceeding HCAP-EP-BAFFP-0 (2.9 KJ/m2 and 113 MPa) by 147% and 26%. In addition, HCA-EP-BAFFP-30 has the lowest dielectric constant and dielectric loss (Dk = 3.61 and Df = 0.00243 at 10 MHz). Therefore, we believe that HCA-EP cured with BAFFP has great potential for application in the field of electronic packaging materials.