Silicon carbide (SiC) metal oxide semiconductor field effect transistors (MOSFETs) is gradually replacing silicon-based insulated gate bipolar transistor (IGBT) as the switching devices in electric vehicle power inverters due to its higher operating temperatures, switching speeds, and frequencyies. However, the high switching frequency of SiC MOSFETs can increase the losses of the power inverter, resulting in an increase in the temperature, which will limit the performance of power inverters. The improvement of power module performance is mainly controlled by optimizing its control methods during operation and improving its cooling system. Currently, the liquid-cooled heatsink used in power modules have disadvantages such as large flow resistance and poor heat dissipation performance. In order to enhance the performance of the heatsink, this study first established a three-dimensional finite element model of SiC MOSFETs power module based on a pin fin heatsink. The accuracy of the model was verified by numerical and experimental methods. Secondly, based on numerical analysis, a multi-objective topology optimization method for the power module liquid-cooled heatsink is proposed. This method takes heat exchange and fluid dissipation energy as the objective function and uses weight factors to adjust the influence of each on the objective functions. Additionally, the temperature distribution of the heatsink is considered to optimize its performance. Finally, the numerical results show that the topology-optimized heatsink exhibits better performance at high coolant volumetric flow rates. When the coolant volumetric flow rate is 14 L/min, the pressure drops of topology-optimized heatsink is reduced by 63.94 % and the junction temperature of the power module is reduced by 0.24 % compared with the pin fin heatsink. This topologically optimized heatsink could be helpful to improve the performance of existing power module heatsinks.
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