Material Removal Mode Research Articles

An investigation on the mechanical, thermal and tribological properties of newly developed polyester composites made with Pistachio shell particles for industrial applications

The drive for sustainability and addressing environmental concerns has led to the productive use of bio-waste. This research investigates the potential of pistachio (Pistacia vera) nut shell particles as a novel filler in polyester composites. The study explores the use of these nut shells as a reinforcing material in polyester-based composites to evaluate their mechanical and thermal properties. Pistachio shell particles (PSP) are mixed with polyester resin in varying weight fractions (0%, 1%, 3%, and 5%) to create a new type of composite. The impact of filler content, impingement angle and striking velocity on the erosive wear behavior of these composites are also studied. The mechanical results for the composites revealed that incorporating PSP filler resulted in the maximum rise in tensile (96.61%), impact strength (66.66%), micro-hardness (52.94%), under loading of 5 wt% of PSP filler. However, the composite with 3 wt% of PSP filler, resulted in the maximum rise of flexural strength (135.65%) and flexural modulus (45.28%). Results showed that, composites with 5 wt% of PSP filler exhibited superior erosive resistance. An optimal parameter setting is determined for minimum erosion rate and subsequently validated by conducting confirmation experiment as per Taguchi methodology. Different modes of material removal, wear craters and other qualitative attributes are examined by a scanning electron microscopy during erosion experiment of the samples. Thus, the utilization of agro/food wastes in the development of bio-based products holds significant potential and offers the possibility of replacing conventional materials in various industrial applications.

Effect of Laser Power and Diamond Tool Parameters for Micro Laser-Assisted Ductile Mode Material Removal on Fused Silica

Abstract Fused silica is an essential material used in various applications due to its excellent optical and mechanical properties. However, processing it can be challenging due to its high hardness and brittleness, leading to sub-surface damage during grinding and polishing operations. Micro laser-assisted ductile mode material removal is a promising technique for achieving high levels of precision and accuracy in material removal. This technique leads to controlled and precise removal of material without inducing cracks or fractures. Despite its advantages, there are several challenges associated with the process, such as selecting the appropriate laser power and diamond tool geometry. In this study, we employed a Universal Mechanical Tester equipped with modified OPTIMUS, a laser-assisted machining technology to investigate the impact of laser and diamond tool geometry on scratch cut quality. Introducing and increasing the laser power demonstrated an improvement of around 251.7% in cut ductility, leading to a decrease in the severity of sub-surface damage (SSD). Altering the rake angle from -25° to -45° resulted in a 45.3% reduction in the critical depth of cuts (DOCs). However, when laser was employed, the critical DOCs increased around 34.4% in ductile mode material removal on fused silica samples, which underscores the criticality of the laser in this process.

Study on the Critical Conditions for Ductile-brittle Transition in Ultrasonic-assisted Grinding of SiC Particle-reinforced Al-MMCs

High volume fraction (45 %) silicon carbide particle-reinforced aluminum matrix composites (SiCp/Al-MMCs) play a significant role in various engineering fields due to their outstanding performance. However, damages characterized by SiC particle fracture during machining lead to poor surface integrity, which severely affects the fatigue performance of SiCp/Al composite structural components. Ultrasonic-assisted grinding (UAG) is acknowledged as beneficial for promoting ductile grinding in hard and brittle materials. This study focuses on the critical conditions for ductile-brittle transition in ultrasonic-assisted grinding of SiCp/Al composites and develops a mechanism and data driven model of critical undeformed chip thickness (UCT) for ductile grinding to accurately predict the material removal mode. The model thoroughly integrates considerations of chip morphology, removal mode transition mechanism, and grinding surface damage characteristics. Response surface methodology (RSM) and genetic algorithms (GA) were utilized to correct the impact of processing parameters on the removal regime. Experiments on ultrasonic-assisted side and end grinding were conducted to thoroughly discuss the effects of different undeformed chip thicknesses, grinding speeds and ultrasonic vibration amplitude on surface damage and the critical conditions for the ductile-brittle transition. The findings corroborate the experimental data with the predicted values. Ultrasonic vibration can effectively reduce the brittle fracture of SiC particles in SiCp/Al composites. Appropriately increasing the grinding speed and reducing the chip thickness can enhance the critical chip thickness for ductile grinding and decrease the proportion of brittle surfaces, thereby achieving a balance between surface integrity and grinding efficiency. This research provides guidance for high-performance machining of SiCp/Al composites.

Nonlinear dynamic analysis of high-speed precision grinding considering multi-effect coupling

The aerostatic spindle is widely used in the field of precision grinding because of its excellent machining stability and machining accuracy. The spindle is jointly affected by multiple excitation effects in the high-speed grinding process. In order to study the dynamic characteristics of the aerostatic spindle under high-speed precision machining, it is necessary to analyse the nonlinear response of the aerostatic spindle with multi-physical field coupling. In this paper, the nonlinear dynamic model of the aerostatic spindle system under multi-effect coupling is established by considering three aspects: fluid-structure coupling, mass eccentricity excitation coupling, and vibration-grinding force coupling. Firstly, the instantaneous nonlinear air film force excitation is calculated by the derivation of the dynamic air film thickness model with multi-degree-of-freedom vibration responses coupling. The mass eccentricity excitation considering dynamic deflection angle is derived through the eccentric-load relationship. Afterwards, the dynamic precision grinding force model under the full surface of the tool is established based on judging the material removal mode, which considers the grain-workpiece interaction relationship under the influence of the nonlinear vibration. Finally, the accuracy and effectiveness of the coupled model is verified by high-speed precision grinding experiments, and the nonlinear dynamic behaviour under different operating parameters is analysed.

Modeling and analysis of surface integrity transition in cutting of Sip/Al composites based on coordination deformation effect of particle-matrix

With the wide application of Sip/Al composites in key fields, it is critical to understand the material removal behavior and surface integrity evolution mechanism of Sip/Al composites. In this paper, based on the nanoindentation and scratching experiments, the coordination deformation behavior of Si particles and the Al matrix were investigated at the micro-scale, and the mechanism and conditions of surface integrity transition (SIT) of Sip/Al composites were elucidated. Then, taking into account the feature of particle fragmentation and detachment caused by interfacial failure, an analytical model of specific cutting energy for Sip/Al composites cutting under different material removal modes was established. The competitive relationship between ductile deformation and surface defect formation was investigated, and a quantitative prediction model for the critical depth of SIT was proposed. The results show that the evolution of the material removal behavior of Sip/Al composites is a consequence of the coordination deformation the Al matrix and Si particles. The material removal mode of Sip/Al composites transitions from ductile removal to quasi-brittle removal with particle fragmentation and detachment, and there is an obvious SIT characteristic. The prediction results of critical depth are in agreement with the experimental results, with an average error of less than 9.8 %. Moreover, an appropriate increase in cutting speed can effectively enhance the surface integrity of Sip/Al composites. This research contributes to a deeper understanding of the low-damage machining mechanism of Sip/Al composites.

Scanning Electrochemical Probe Lithography for Ultra-Precision Machining of Micro-Optical Elements with Freeform Curved Surface.

Two challenges should be overcome for the ultra-precision machining of micro-optical element with freeform curved surface: one is the intricate geometry, the other is the hard-to-machining optical materials due to their hardness, brittleness or flexibility. Here scanning electrochemical probe lithography (SECPL) is developed, not only to meet the machining need of intricate geometry by 3D direct writing, but also to overcome the above mentioned mechanical properties by an electrochemical material removal mode. Through the electrochemical probe a localized anodic voltage is applied to drive the localized corrosion of GaAs. The material removal rate is obtained as a function of applied voltage, motion rate, scan segment, etc. Based on the material removal function, an arbitrary geometry can be converted to a spatially distributed voltage. Thus, a series of micro-optical element are fabricated with a machining accuracy in the scale of 100 s of nanometers. Notably, the spiral phase plate shows an excellent performance to transfer parallel light to vortex beam. SECPL demonstrates its excellent controllability and accuracy for the ultra-precision machining of micro-optical devices with freeform curved surface, providing an alternative chemical approach besides the physical and mechanical techniques.

Novel full-scale model verified by atomic surface and developed composite microfiber and slurry polishing system

Polishing mechanisms between fibers of a polishing pad and slurry are elusive, rising a challenge to develop high-performance composite polishing system. To solve this challenge, a novel full-scale model is proposed from mm to nm, consisting of macro, meso, micro and nanoscale. The model is verified by atomic surface and developed composite microfiber and slurry polishing system. Prior to chemical mechanical polishing, fused silica was polished by ceria slurry. A novel polishing pad was prepared using microfibers with a diameter of 2.5 μm, and a novel green slurry contained silica abrasives, hydrogen peroxide, sodium carbonate, sorbitol and xanthan gum. After CMP, an atomic surface with Ra of 0.108 nm was achieved, and the thickness of damaged layer is 1.95 nm. In terms of the macroscale model suggested, the maximum stress on the microfiber pad decreased 417.7 %, and the direct contact area increased 41.23 % compared with those of a commercial nonwoven pad. The peak stress exceeded 1 MPa on the commercial pad, while it reduced to about one fourth on the developed microfiber pad, according to the mesoscale fiber-slurry model proposed. Reactive force field molecular dynamics simulations, i.e. nanoscale model, reveal that a slurry layer existing at interface effectively impedes direct contact between abrasives and fused silica. With increasing the polishing load, material removal mode transformed from an atom to atomic chains. The constructed full-scale model and developed composite polishing system provide new insights to analyze, design and manufacture high-performance polishing pads, slurry and system.

Material removal modes and processing mechanism in microultrasonic machining of ball ceramic tool

Microelectrochemical systems (MEMSs) have important applications in electronic information, aerospace, national defense and other fields. The microhemispherical concave die is the manufacturing foundation for the MEMS system. To clarify the forming mechanism of microhemispherical concave dies machined by microultrasonic machining with ceramic whole ball tools, a material removal model was presented. Furthermore, the kinetic energy model of a spherical abrasive under the action of microultrasonic and whole ball ceramic tools was also established. The model of the brittle-plastic transition removal mode is correlated with the kinetic energy of the abrasive model. The surface morphology of miniature molds exhibits significant variations attributed to the altered material removal mode, the removal mechanism was analyzed. The theoretical model is verified by experiments. Experiments were performed with lower and higher viscosity polishing fluids. The surface roughness of the plastic removal area in each group was 96.4 and 60.1 nm. Due to the high viscosity polishing fluid eliminating some of the cavitation phenomena, the overall surface quality is improved; hence, the surface roughness decreases by 37.6% under the same processing conditions. In the low-viscosity experimental group, the surface roughness was 113.61, 302.28 and 367.24 nm, respectively. The experimental verification confirmed that variations in surface morphology occur, even with the same removal mode applied at different locations on the microconcave die. The reasons for the surface roughness variation in different areas of the microconcave die are analyzed and reveal the influence of ultrasonic cavitation on the material removal mode in microultrasonic machining.

Diamond machining of additively manufactured Ti6Al4V ELI: Newer mode of material removal challenging the current simulation tools

Single point diamond machining (SPDM) produces smooth machined surfaces that other production methods cannot match. While the mechanics of machining of cast alloys with SPDM is well-explored, the realm of SPDM for additively manufactured parts remains largely uncharted. This work reveals new insights into the surface generation process of an additively manufactured titanium alloy, specifically, a Ti6Al4V Extra Low Interstitials (ELI) alloy workpiece. Our examination of the chip morphology unveiled a distinct mode of chip removal, previously unrecorded in existing literature. During SPDM of additively made Ti6Al4V ELI workpiece, identification of numerous pores and discontinuities in the chips flowing on the tool rake face, indicating periodic intermittent cracking during the material's plastic flow was seen. To examine this phenomenon, a finite element analysis (FEA) model was developed. While the FEA model can well explain the machining mechanics and chip morphology of SPDM of cast Ti6Al4V ELI reported in the literature, it failed to describe the chip morphology that are obtained during machining of additively made workpiece in this work. This disparity underscores the need for innovative simulation approaches tailored for additively manufactured components. The experimental observations in this study highlight a unique form of chip formation in contrast to conventional Ti6Al4V alloy machining processes. At lower feeds, there was a presence of short, discontinuous chip formation with tearing at the outer periphery. Conversely, at higher feeds, a long, continuous ribbon-like chip formation was observed. In addition, some typical additive manufacturing defects appear on the machined surface and chips. Through optimisation of the SPDT parameters, a surface roughness (Ra) value of about 11.8 nm was achieved on additively manufactured Ti6Al4V ELI workpiece. This work provides a fresh perspective on the mechanics of SPDM for additively manufactured components, offering a stepping stone for subsequent studies.

Analysis of mechanisms of bubble characteristics and molten pool dynamics in EDM based on a three-phase flow model

Bubble characteristics and bubble volume fraction have significant effects on crater morphology and machining efficiency during electrical discharge machining (EDM) in liquid. Therefore, there is a need to elucidate the mechanism of bubble characteristics in EDM and analyze the mechanism of crater formation based on these bubble characteristics. However, since EDM is a transient multiphysics process, it is extremely difficult to understand bubble characteristics using experimental methods. Therefore, the generation, expansion, explosion, and disappearance of bubbles during EDM were simulated based on a three-phase flow model in this study. The model used the phase field method to track the boundary motion, judged the existence mode of each phase according to the order parameter gradient function, and analyzed the formation of crater morphology by the gradient of surface tension in the molten pool. The motion process of bubbles, the material removal mode, and the formation mechanism of crater morphology during the pulsed discharge were analyzed using the model. The results revealed that the periodic motion of the plasma channel would drive the molten pool to produce the corresponding periodic motion, and the bubbles would grow following the periodic motion of the molten pool. The material was removed in different ways in different periods, among which the removal mode of molten splash was predominant. The surface tension gradient inside the molten pool, the periodic motion of the molten pool, and the hydrostatic pressure in the molten region had a combined effect on bubble motion, the flow of the molten pool, and the formation of the crater morphology.

Effects of the deflection angle of the indenter on the material removal and damage evolution of fused silica during scratching

Fused silica is widely used as key optical components and window materials due to its excellent optical and thermal properties. However, surface and subsurface damages occur in fused silica during the machining and usage process. This study aims to investigate the influence of the deflection angle of Vickers indenter on the damage evolution and removal mechanism of fused silica during scratching. Scratch tests with a linearly increasing axial load were conducted under four typical deflection angles (0°, 15°, 30°, and 45°). The resultant surface morphologies of scratch grooves were analyzed. It was seen that as the axial load increased, the scratch groove transformed from ductile deformation to brittle breaking. The asymmetric placement of the indenter led to asymmetric crack expansion. As the deflection angle increased, it became increasingly difficult to form a stable groove on the material surface. Among the four deflection angles, the groove at 0° was symmetrical, with long and good quality ductile area. For the deflection angle of 30°, the widest range of chips was observed; for 45°, the contact area of the indenter with the material was minimized, and specifically, there was a situation where the bottom of the groove was higher than the reference plane. Furthermore, statistical analysis of the loads during the scratching process was carried out. As the axial load increased, the lateral load increased approximately linearly at first and then fluctuated dramatically. Furthermore, under relatively small axial loads, the coefficient of friction (COF) is lower when the deflection angle is small; while, under relatively high axial loads, the COF is larger when the deflection angle is small. This transition could be related to the change in material removal mode from completely ductile removal to the brittle dominated removal.

Investigation on machining performance of soft-brittle KDP crystals with surface micro-defects in the ball-end milling repairing process

Micro ball-end milling technology is an excellent repair strategy for economically removing surface micro-defects of large-scale KDP optics in the high-power laser devices. However, it is an urgent challenge for defective KDP crystals to achieve ultra-smooth repaired surface in ductile mode cutting, because pre-existing surface defects with different geometry and dimensions can affect machining performance during the reparative process by changing the uncut chip thickness (UCT). Therefore, the influence of various surface micro-defects on the machining performance is systematically investigated from the perspectives of the UCT, tensile stress, cutting force, and surface quality in this work. Interestingly, the plastic scratches and fracture pits could transform the brittle mode cutting into a ductile removal process by increasing the UCT, showing a decrease in the brittle fractures, the maximum tensile stress and the fluctuation of cutting force, indicating that the ductile removal ability can be improved. While, the effect of the surface protuberances on the repair quality is opposite. Besides, although the convex scratches and the cracks could cause a slight increase in the UCT, it has almost no impact effect on the material removal mode. More interestingly, for the fracture pits with specific dimensions, when it is not completely removed, the growth behavior of defect dimensions occurs during the reparative process due to the action of mechanical forces, reducing the surface quality. Consequently, the above work provides significant theoretical importance and engineering application value to formulate corresponding repair strategies for various surface defects to obtain the ultra-smooth surface of optical components.

Study of side burr formation in steady-state nano-polishing of Si-wafer using molecular dynamics simulation

With advancements in the semiconductor industry, it is required to have angstrom level surface finish on silicon wafers which is achieved by nano-polishing. However, side burr is formed due to material pile-up from material removal due to abrasive which becomes detrimental to achieving the high surface finish. This study employs molecular dynamics simulations to explore the mechanism underlying side burr formation during nano-polishing of mono-crystalline silicon (Si)-wafer. The study utilizes a diamond nano-abrasive grit to scratch the surface of the Si-wafer and investigates the formation of pile-ups during the steady-state process. It was observed that increasing the depth of cut by four times led to a 6.3-fold increase in the number of amorphous atoms, indicating greater bond breakage in the direction of scratching. As a result, the cutting force exceeds the thrust force at larger depths of the cut. The correlation between the side burr height and the depth of cut is also studied. Results show that the side burr height ratio increases with the depth of cut, indicating a higher sensitivity of side burr height to the depth of cut. The study suggests that to achieve a ductile mode of material removal and minimize the height of the side burr during nano-polishing of Si-wafers, it is crucial to maintain the depth of cut at or below half (≤0.5) of the abrasive radius and ensure an average friction coefficient below 0.6. The outcome of this study can be useful for the actual manufacturing of miniaturized sensors, actuators, and microsystems for microelectromechanical system devices where a high surface finish is crucial.

Two material removal modes in chemical mechanical polishing: mechanical plowing vs. chemical bonding

AbstractWith the rapid development of semiconductors, the number of materials needed to be polished sharply increases. The material properties vary significantly, posing challenges to chemical mechanical polishing (CMP). Accordingly, the study aimed to classify the material removal mechanism. Based on the CMP and atomic force microscopy results, the six representative metals can be preliminarily classified into two groups, presumably due to different material removal modes. From the tribology perspective, the first group of Cu, Co, and Ni may mainly rely on the mechanical plowing effect. After adding H2O2, corrosion can be first enhanced and then suppressed, affecting the surface mechanical strength. Consequently, the material removal rate (MRR) and the surface roughness increase and decrease. By comparison, the second group of Ta, Ru, and Ti may primarily depend on the chemical bonding effect. Adding H2O2 can promote oxidation, increasing interfacial chemical bonds. Therefore, the MRR increases, and the surface roughness decreases and levels off. In addition, CMP can be regulated by tuning the synergistic effect of oxidation, complexation, and dissolution for mechanical plowing, while tuning the synergistic effect of oxidation and ionic strength for chemical bonding. The findings provide mechanistic insight into the material removal mechanism in CMP.

Performance of HVAF sprayed WC-10Co-4Cr coating onto cast 21-4N steel for slurry erosion: Characterization and erosion rate studies

In this study, 86WC-10Co-4Cr powder was thermally sprayed onto cast 21-4N steel using High Velocity Air-Fuel (HVAF) technology. The deposited coating exhibited a dense structure with minimal porosity (1.0 ± 0.3%) and excellent fracture toughness (5.1 ± 0.3 MPa m1/2). Slurry erosion tests had shown that the HVAF-coated steel had significantly improved erosion resistance compared to uncoated steel, attributed to its high hardness, fracture toughness, and dense microstructure. Statistical analysis revealed that slurry velocity and impact angle were the most influential parameters. Further, Field emission scanning electron microscope (FE-SEM) image analysis showed that the coated steel exhibited a brittle mode of material removal, while the bare steel displayed a ductile mode. Overall, the study highlights the effectiveness of HVAF-sprayed 86WC-10Co-4Cr coatings in enhancing erosion resistance, providing valuable insights into the coating’s microstructure and performance under different erosion conditions.

Evolution mechanism of flip-fold removal behaviour through crossed scratching of glass-ceramics

In this study, a novel flip-fold removal model was established to reveal the ductile–brittle mixed removal phenomenon in the grinding process of glass-ceramics. This flip-fold model proposed for the ductile–brittle mixed removal mode differs from conventional brittle or ductile removal mechanisms. Using the theoretical exploration method, a theoretical model of flip-fold removal is established based on the analysis of different scenarios of the relationship between the depth of the stagnation region and pile-up height of the interference zone. Through an experimental verification method, the approach of crossing double scratches with a continuously variable scratch distance is proposed to observe the evolution progression and verify the flip-fold removal model. Using the analytical analysis method, the amplitude and direction cosine distributions of the interference stress field were analysed to reveal the internal mechanism of the flip-fold removal model. The results of the three scientific research methods were in good agreement with those of the proposed model. The flip-fold material removal model supports the comprehension of the ductile–brittle mixed removal mode during the grinding of hard-brittle materials. This model provides an approach to controlling the material removal mode from the perspective of regulating the flip-fold behaviour by adjusting the scratch distance.

A novel dealloying assisted machining method to improve the machinability of NiTi alloy as a typical high toughness difficult-to-machine material

High quality and high efficiency cutting process is of great significance to the components manufacturing related to machinability of workpiece materials. As a typical difficult-to-machine material induced mainly by high toughness, NiTi alloy faces challenges such as high cutting force and difficult chip breaking during the cutting process. To solve these problems, this paper presents a novel surface dealloying assisted machining method, i.e., the preparation of nanoporous structures on the workpiece surface with dealloying treatment, to improve the machinability of NiTi alloy. Based on high speed in-situ imaging of material removal process, the presence of dealloyed layer leads to a segmented flow mode instead of homogeneous severe plastic deformation without dealloying treatment. The change in material removal mode is beneficial to decrease the cutting force and energy and improve the machined surface quality. The embrittlement effect of dealloyed layer inhibits material plastic flow and promotes periodic crack nucleation and propagation. An analytical model is developed to characterize the brittle crack propagation, which provides theoretical basis for explaining embrittlement effect of dealloyed layer. This work verifies the feasibility and effectiveness of the proposed method to modify the machinability of NiTi alloy and provides new ideas for the development of manufacturing processes.

Surface damage characteristics and identification based on acoustic emission in diamond point grinding carbon/carbon ceramic matrix composites

This study mainly investigated the effect of machining parameters on acoustic emission (AE) characteristics in grinding three-dimensional carbon/carbon ceramic matrix composites with superabrasive diamond grinding points. Signal processing techniques including fast Fourier transform (FFT) and short-time Fourier transform (SWFT) were applied to evaluate frequency features of AE signals. The RMS values were used as an indicator to detect grinding energy releasing characteristics. Results indicated that grinding speed and grinding depth were the main influencing factors on RMS values, while feed speed presented limited effects. The maximum undeformed chip thickness hmax and active grits number were two key factors affecting RMS variation of the AE signals, which corresponded to the intensity of single AE source and the number of total AE ones, respectively. The material removal mechanisms were studied via detailed SEM micrographs of machined surfaces, revealing that fiber fracture and debonding were the main material removal modes in point grinding carbon/carbon composites. The material removal mode can be possibly identified from the frequency of AE signal, as the band of 12–35 kHz mainly corresponded to fiber fracture, 35–70 kHz referred to debonding between the fiber and matrix, 70–90 kHz indicated the frictions, and the fourth band (90–120 kHz) was related to the matrix cracks.

Experimental Investigation of Ultrasonic Vibration-Assisted Grinding of HVOF-Sprayed WC-10Co-4Cr Coating

WC-10Co-4Cr coating is highly valued for its corrosion resistance and wear resistance when applied using the high-velocity oxy-fuel (HVOF) spraying method. However, conventional grinding (CG) of this coating presents challenges, including substantial grinding forces and elevated surface temperatures. To address these concerns, our study proposed the utilization of ultrasonic vibration-assisted grinding (UVAG) as a means to enhance the machining properties of HVOF-sprayed WC-10Co-4Cr coatings. Comparative experiments were conducted to analyze the impacts of various factors on the grinding forces and surface roughness in UVAG and CG processes. Additionally, the topography of the ground surfaces was examined to gain insights into the material removal mechanism in UVAG. The experimental outcomes reveal significant reductions in tangential and normal grinding forces, amounting to 15.47% and 22.23%, respectively, in UVAG when compared with CG. Furthermore, UVAG led to a roughly 29.14% decrease in ground surface roughness compared with CG. Microscopic analysis of the ground surfaces using scanning electron microscopy (SEM) indicated that ductile removal was the predominant material removal mode in UVAG. Overall, UVAG was found to be effective in diminishing grinding forces, improving ground surface roughness, and enhancing surface integrity when contrasted with CG. These findings introduce a novel approach for processing WC-10Co-4Cr coatings.

An analytical dynamic force model for sawing force prediction considering the material removal mode

Diamond circular saw blades are indispensable tools in the industry of granite processing. Accurate prediction of sawing force is essential for optimizing the processing in advance. In this study, the calculation method for uncut chip thickness and instantaneous chip thickness was improved based on granite sawing characteristics. Furthermore, an analytical prediction force model was proposed in view of deep and intermittent grinding, which comprehensively considers the characteristics of diamond grits (including grit size, location distribution, and protrusion height) and material removal mode. The error between the predicted results and the experimental results is <12 %, indicating that the model can accurately predict the cutting force. The proposed analytical model provides a method to optimize the sawing parameters without the need for extensive experiments. This model can also extend to calculate parameters such as energy consumption and carbon emissions in the stone processing industry.