Electronic Product Manufacturers Research Articles

Has the rise of China’s domestic supply chain contributed to its GDP increases?

ABSTRACT This paper applies a structural decomposition of the input-output tables to investigate the sources of changes in the GDP of China, paying special attention to the import substitution of intermediate inputs. It is argued that the specific way GDP is decomposed in this paper sheds more light on the origin of growth than does the conventional decomposition of GDP by its final demand components. The results of the decomposition show that import substitution of intermediate products, which is an act of de-globalization of trade and a model of industrialization some Asian newly industrializing economies followed decades earlier, also became important in China, but only belatedly: in 2011–2012 and 2013–2014. The phenomenon is found to be significant in the manufacture of (i) computer, electronic and optical products, (ii) chemicals and chemical products, (iii) coke and refined petroleum products, and (iv) basic metals.

Labour Productivity as a Factor of Tangible Investment in Companies Producing Wind Energy Components and Its Impacts: Case of Lithuania

This paper aims at justifying the significance of investment in the improvement of labour productivity (LP) and importance of the latter on economic performance of companies manufacturing wind energy components (WEC) in Lithuania in terms of value added (VA) created, profitability and wage earned. The time period covered is 2000–2020. The following methods have been employed: analysis of legal acts, programmes, strategies, and business structure and finance indicators, interdependence (correlation and regression), trend, case analysis, logical economical reasoning and graphical representation. The research results of current status analysis showed that the business of WEC manufacturing is small in regard to their variety of products but increasing in terms of VA and employment in Lithuania. Investment has been found as a driver of improvement in LP. The calculated historical ratio of change in LP to investment showed that, on average, after 1000 EUR per employee has been invested in tangible assets (TA), the LP increased by 0.13 EUR/h. A higher than average ratio was found in the manufacture of other transport and repair and installation of machinery and equipment (1.41), such as rubber, plastic and other non-metallic mineral products (0.17), but lower in the manufacture of electronic and communication (0.12) and metal (0.06) products. Taking into account the linear curves of LP to investment in TA curve and the average volumes of investment in different manufacturing activities, it is estimated that LP could grow by 5.3% a year in the manufacture of electronic products, and communication equipment are expected to increase by two-fold to 33 EUR/h in 2030, but it could grow only by 2.0% a year in the manufacture of rubber, plastic and other non-metallic mineral products to reach 28 EUR/h in 2030. Due to investment related changes in LP, the VA created by WEC companies could increase by 5.9% a year and account to 2.9 billion EUR during 2021–2030. Net profitability and real wages (and salaries) could also increase in future. Seeking to use the potential of companies to manufacture WEC for domestic wind installations and exports, investment supporting programmes are of high importance in the fields of promotion of innovations, development of human capital and adaptation of new technologies.

P‐59: In‐Fab Raman Spectroscopy for Defect Analysis of Random Failures

Random defects, which account for more than 90% of electronic product manufacturing defects, are defects caused by foreign substances. Although the detection ability has been improved through various efforts using optical inspection and image features, the ultimate enhancement to improve quality and yield cannot be achieved just by detecting defects. In particular, there was a limit to classifying and specifying the failure source because the ingredients were not known, and it was often impossible to eliminate defects even after spending a lot of time. We developed a world first in‐fab Raman spectroscopy microscopy to be applied to the analysis of foreign substances in the entire area of the 8.5th generation glass substrate and applied it in real time between manufacturing. As a result, it is possible to detect defective sources in real time and to improve quality and yield through process control and ultimate improvement.

Balanced-YOLOv3: Addressing the Imbalance Problem of Object Detection in PCB Assembly Scene

The object detection algorithm of the PCB (Printed Circuit Board) assembly scene based on CNN (Convolutional Neural Network) can significantly improve the production capacity of intelligent manufacturing of electronic products. However, the object class imbalance in the PCB assembly scene, the multi-scale feature imbalance, and the positive/negative sample imbalance in the CNN have become critical problems restricting object detection performance. Based on YOLOv3, this paper proposes a class-balanced Train/Val (Training set/Validation set) split method for object class imbalance, an additional feature fusion strategy for multi-scale feature imbalance, and an efficient anchor concept for positive/negative sample imbalance. These three contributions are Balanced-YOLOv3. After experimental verification, compared with other YOLOv3 series algorithms, the mAP@.5 (Mean Average Precision at Intersection over Union threshold 0.5) and mAP@.5:.95 (average mAP over different Intersection over Union thresholds, from 0.5 to 0.95, step 0.05) of Balanced-YOLOv3 have achieved the best results and ranked third in the metrics of parameter and inference time. Compared with other current anchor-based object detection algorithms, Balanced-YOLOv3 has excellent detection performance and low computational complexity, which effectively solves the problem of imbalanced object detection in PCB assembly scenarios.

Improving the Supply Chain Performance of an Electronic Product-Manufacturing Organisation Using DMAIC Approach

Improving the Supply Chain Performance of an Electronic Product-Manufacturing Organisation Using DMAIC Approach

Source apportionment and wet deposition of atmospheric poly- and per-fluoroalkyl substances in a metropolitan city centre of southwest China

Sixty rainwater samples were collected covering four seasons from July 2020 to April 2021 from the center of Chongqing, a metropolitan city of southwest China, using automatic deposition sampler. The samples were analysed for 17 targeted poly- and per-fluoroalkyl substances (PFASs) by HPLC-MS/MS. The concentration of PFASs ranged from 3.31 ng/L to 196.14 ng/L and dominated by perfluoro-n-octanoic acid (PFOA), perfluoro-n-hexanoic acid (PFHxA), perfluoro-n-butanoic acid (PFBA) and sodium perfluoro-1-octanesulfonate (PFOS). The seasonal variations of dissolved and particulate PFAS were distinct, with the highest level in summer and autumn, respectively. Positive matrix factorization (PMF) and a wet deposition model were performed to apportion the sources and estimate the wet deposition flux of the 17 PFASs, respectively. PMF analysis indicated that, based on yearly average, paper packaging production (37.4%) and aqueous film forming foam (AFFF) usage (29.8%) were the two major sources, followed by textile production (16.7%) and electronic product manufacturing (16.1%). The highest source contributor for PFASs in winter was AFFF usage (47.0%); while in the other three seasons, it was paper packaging production that contributed the most (50.1%, 39.8% and 34.8% respectively). Seasonal average wet deposition flux of PFASs was estimated to be 13.9 ng/m2/day. The dry deposition of PFASs was estimated to account for 15.8% of the total atmospheric deposition flux, suggesting a more important role for wet deposition. The results of this study provide important information for understanding of PFASs occurrence and atmospheric wet deposition in Chongqing, and other urban centers across China.

LPViT: A Transformer Based Model for PCB Image Classification and Defect Detection

PCB (printed circuit board) is an extremely important component of all electronic products, which has greatly facilitated human life. Meanwhile, tons of PCBs in the waste streams become a waste of resources, which puts the recycling and reuse of PCBs in urgent need. In the manufacturing and recycling of electronic products, the classification of PCBs, recognition of sub-components, and defect detection have been the key technology. Traditional manual detection and classification are subjective and rely on individuals’ experience. With the development of artificial intelligence, lots of research efforts have been dedicated to the automated detection and recognition of PCBs. In this paper, we propose a transformer-based model, LPViT, for defect detection and classification of PCBs. We conduct the defect detection task on the dataset DeepPCB, which consists of six different types of PCB defects. Defect detection benefits both manufacturing and recycling of PCBs. Among many electronic products, a group of affordable, general-purpose, and small-size PCBs is very popular, which are referred to as micro-PCBs. The classification and recognition of those PCBs will greatly facilitate the recycling and reuse process. We conduct the classification task on a dataset called <bold xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">micro-PCB</b> , which includes 12 types of popular, general-purpose, affordable, and small PCBs. Through comparative experiments, our system demonstrates its advantage in both classification and defect detection tasks.

BETA CONVERGENCE ANALYSIS OF GROSS VALUE ADDED IN THE HIGH-TECHNOLOGY MANUFACTURING INDUSTRIES

The paper examines the recent developments in the high-technology manufacturing sectors in the EU28 countries, focusing on the β-convergence of gross value added in the Manufacture of computers, electronic, and optical products, and the Manufacture of basic pharmaceutical products and pharmaceutical preparations. We employ two dynamic panel models estimated using the system of generalized method of moments (GMM) to address the risk of an endogeneity bias. The panel data analysis indicates a higher convergence for the Manufacture of computer, electronic, and optical products at 16.4% compared to 2.2% for the Manufacture of basic pharmaceutical products and pharmaceutical preparations, which is consistent with the existence of fewer barriers and higher exposure to competition in the case of the first analyzed sector. In the context of the role of the high-technology manufacturing industries as an engine of growth and the existing performance differences between the EU28 countries in terms of gross value added in the analyzed sectors, we investigated the β-convergence for two groupings EU15 and the new EU member states. We found that the new EU member states display a higher β-convergence rate than EU15, but also that they have a lower capital intensity. The result highlights the potential risk of some of the new EU member states becoming laggers in terms of the underlying factors behind gross value added as investment and labour force.

BEING STRONGER IN NEW GLOBAL SUPPLY CHAIN AFTER THE PANDEMIC: SEEKING TO INCREASE FOREIGN TRADE VOLUME AND EMPLOYMENT SIMULTANEOUSLY IN TURKEY ECONOMY

This study is intended to discuss turning a broken global supply chain into an opportunity by Turkey in post-COVID-19 period and the possibility to be an alternative to China in the sectors in which Turkey is more advantageous and solution seeking to repair the employment structure which has been damaged in pandemic process. Partial direct backward linkages coefficients of both countries were calculated and Leontief similarity test and Spearman correlation test were applied to the obtained coefficients, and the results of both tests were evaluated together. As a result of the analysis, sectors having the advantage of Turkey's foreign trade is as follows: “manufacture of food products”, “manufacture of textiles”, "manufacture of other non-metalic mineral products", "construction" “manufacture of articles of straw and plaiting materials” and “manufacture of computer, electronic and optical products, manufacture of electrical equipment”. The activities of the first 4 of these sectors are among the 6 activities which were published by TOBB and they were most affected by the Covid-19 outbreak and closed down.electronic and optical products, manufacture of electrical equipment”.

Research Progress of Microtransfer Printing Technology for Flexible Electronic Integrated Manufacturing.

In recent years, with the rapid development of the flexible electronics industry, there is an urgent need for a large-area, multilayer, and high-production integrated manufacturing technology for scalable and flexible electronic products. To solve this technical demand, researchers have proposed and developed microtransfer printing technology, which picks up and prints inks in various material forms from the donor substrate to the target substrate, successfully realizing the integrated manufacturing of flexible electronic products. This review retrospects the representative research progress of microtransfer printing technology for the production of flexible electronic products and emphasizes the summary of seal materials, the basic principles of various transfer technology and fracture mechanics models, and the influence of different factors on the transfer effect. In the end, the unique functions, technical features, and related printing examples of each technology are concluded and compared, and the prospects of further research work on microtransfer printing technology is finally presented.

Influence of Structure and Composition of Woven Fabrics on the Conductivity of Flexography Printed Electronics.

The work is framed within Printed Electronics, an emerging technology for the manufacture of electronic products. Among the different printing methods, the roll-to-roll flexography technique is used because it allows continuous manufacturing and high productivity at low cost. Nevertheless, the incorporation of the flexography printing technique in the textile field is still very recent due to technical barriers such as the porosity of the surface, the durability and the ability to withstand washing. By using the flexography printing technique and conductive inks, different printings were performed onto woven fabrics. Specifically, the study is focused on investigating the influence of the structure of the woven fabric with different weave construction, interlacing coefficient, yarn number and fabric density on the conductivity of the printing. In the same way, the influence of the weft composition was studied by a comparison of different materials (cotton, polyester, and wool). Optical, SEM, color fastness to wash, color measurement using reflection spectrophotometer and multi-meter analyses concluded that woven fabrics have a lower conductivity due to the ink expansion through the inner part of the textile. Regarding weft composition, cotton performs worse due to the moisture absorption capacity of cellulosic fiber. A solution for improving conductivity on printed electronic textiles would be pre-treatment of the surface substrates by applying different chemical compounds that increase the adhesion of the ink, avoiding its absorption.

Method of multi-layer near-field electrohydraulic printing and sintering of nano-silver ink prepared by liquid phase reduction

The liquid phase reduction method has a wide application prospect because of its simple equipment and low cost. However, the disadvantages, such as uneven particle size distribution and easy agglomeration of particles, make it difficult to prepare high-concentration nanoparticle ink by this method, which limits its application in the manufacture of high-resolution electronic products. This paper presents a printing and sintering process for low-concentration ink prepared by the liquid reduction method. First, the set pattern is printed by the near-field electrohydraulic printing method. At the same time as multi-layer printing, the substrate is heated by the collecting plate to accelerate the evaporation of the solvent in the printed pattern. Then, the printed multi-layer micro-conductive pattern is solidified by a hot/pressure sintering machine. This method can overcome the edge diffusion effect caused by poor ink viscosity effectively and obtain printing patterns with high thickness, high conductivity, and high resolution. The drying time of different ink layers, the pressure and temperature of hot/pressure sintering, and other parameters were studied in this paper. The electrical conductivity and reliability of the pattern with different printing layers are also analyzed, which provides a reference for the printing and sintering of low-concentration ink in the future.

Economic and Environmental Changes in Shenzhen—A Technology Hub in Southern China

Shenzhen has been established as the technology and innovation center in China. The study reviews its economic development and environmental change over the past four decades. Specifically, it tests whether environmental Kuznets curve relationship between haze as a proxy indicator of environmental condition and gross domestic product (GDP) per capita holds in Shenzhen. The study also examines the contribution of Shenzhen’s secondary sector to its GDP and highlights some changes in the computer, communication and electronic product manufacturing industries over the years. We collected the official data from the Shenzhen Municipal Government. Economic, social and environmental changes in Shenzhen were identified using tables and stacked graphs. Environmental Kuznets curve revealed that the worst environmental condition appeared in Shenzhen during the period 2003–2004. Environmental analysis showed that Shenzhen’s computer, communication and electronic product manufacturing industries consumed 52,595 TJ of energy and produced 10.1 million tons CO2-eq in 2019. As gross output value of the industries was USD 336 billion in 2019, the industries had an energy efficiency of 156,716 MJ/million USD and an emission efficiency of 30.6 tons CO2-eq/million USD, improving by 74% and 65%, respectively, since 2008. Nevertheless, the industries should focus more on high value-added and low energy-intensive technologies and innovations. Additionally, the Shenzhen Government shall increase the use of clean energy sources such as nuclear, wind and solar power in order to sustain the continual improvement of energy and emission efficiencies for all industries.

Research and Discussion on Welding Mechanism of Reflow Furnace

The flexible grasp of automatic welding technology is very important for the production of electronic products such as integrated circuit board, and the most critical step is to accurately control the temperature of the welding area. This paper will establish the mechanism model of the influence of the temperature of each temperature zone of the reflow furnace and the speed of the conveyor belt on the temperature of the welding area through the relevant thermodynamic theory, so as to help the relevant electronic product manufacturers to accurately control the temperature of the welding area. The mechanism model of temperature change in the center of welding area is established, and the heat transfer process is divided into three steps. Firstly, according to the temperature field of the air in the furnace, the air temperature corresponding to the gap in the small temperature zone is determined, and then the heat convection process between the air temperature in the furnace and the surface of the welding area is described by using Newton’s cooling law. Finally, Fourier law is used to study the heat conduction process in the welding area.

A preliminary study of printed electronics through flexography impression on flexible substrates

The work is framed within Printed Electronics, an emerging technology for the manufacture of electronic products. Among the different printing methods, the roll-to-roll flexography technique is used because it allows continuous manufacturing and high productivity at low cost. Apart from the process parameters, the ink and the substrate properties are some of the variables associated with the flexographic printing. Specifically, this study investigates the ink penetration, the print uniformity, the adhesion, the fastness, and the electrical behaviour of the same conductive silver ink printed on different flexible substrates through the flexography process. In addition to polymeric and siliconized paper substrates, which are typical used in printed electronics, two substrates were also chosen for the study: woven and nonwoven fabric. Optical, scanning electronic microscope (SEM), 4-point Kelvin and colour fastness to wash and rubbing analyses have been performed. The results concluded that, regarding the conductivity behaviour, porous substrates like textiles and nonwoven fabrics without pre and post treatments do not present acceptable results, whereas polymers or silicone papers do. Nevertheless, woven and nonwoven fabrics are a suitable early option regarding colour fastness to wash instead of thin polymeric and paper substrates that tear at the wash machine. A solution for an optimal printing on textiles would be the surface substrates pre-treatment by applying different chemical compounds that increase the adhesion of the ink on the fabric

RETRACTED ARTICLE: A Multi-Stakeholder Involved Effective E-Waste Management in Manufacturing Recycled Electronic Products Using Game Theory

Globally, electronic waste (E-Waste) has grown as a severe concern owing to the increasing quantity of waste and the toxic it. E-Waste includes plastics and metals, which are highly recyclable but which, if not adequately managed, are concerned about the health and the environment by plastic waste and heavy metal traces of additives and chemicals. This article investigates the modeling of game theory for E-Waste. It presents a framework to analyze various stakeholders' behavior in the manufacture of electronic products using recycled (ERM) and non-recycled (ENRM) materials, understanding the importance of the actual cost variation. This study suggested a framework to decide which Game Plan is best-suited to gain each stakeholder's leading company's profit allocation. Data demonstrate that ERM can be the best choice for manufacturers and customers and recommend applying return schemes to consumers with specific incentives and penalties to those who do not comply with the agreed E-Waste management process could be of great help to discourage computer waste disposal on land.

Technique for optimizing the technological process of manufacturing electrical radio products in the context of digital transformation of production

The article discusses the process of optimization of production processes for the manufacture of electronic products in the context of the implementation of the concept of digital transformation of industrial enterprises. One of the elements of digitalization used to improve the effectiveness of electronics manufacturing technology in industry is Design for Manufacturing (DFM) in the MatLab computer mathematics environment. The technological production cycle is illustrated in the form of a graph diagram using the apparatus of Markov chains. The application of the developed methodology, as well as the use of graph theory in the technological process of a modern industrial enterprise, allows achieving the required performance indicators, due to the optimal reflection and fixation in the database of non-stationary influences that cause deviations, which are leveled due to adaptive control actions.

Antecedents and consequences of green supply chain management in Taiwan's electric and electronic industry

PurposeEnvironmental sustainability is one of the most pressing issues faced by the electric and electronics industry today. Industries are being challenged to incorporate environmental initiatives in their corporate strategies. Thus, this study aims to investigate the impact of stakeholder pressures (regulatory, internal and market) on green supply chain management and green corporate resources as well as their effects on the economic and environmental performance of Taiwan's electric and electronic industry.Design/methodology/approachA total of 194 valid questionnaires were collected out of the 1,000 questionnaires distributed to Taiwan's electric and electronic product manufacturers. A structural equation modeling, using Amos 22.0, was used to test the hypotheses.FindingsThe results of the analyses show that stakeholder pressure has a significant positive impact on corporate green resources and green supply chain management practices while green supply chain management practices have a significant and positive impact on organizational performance. Moreover, corporate green resources provide a mediation between organizational stakeholder pressure and green supply chain management.Practical implicationsThe results may be of value and interest to supply chain managers and policymakers on the push factors for implementing green supply chain management practices and their consequences.Originality/valueThis paper shows the complementarity of stakeholder and resource-based theories in influencing organizational performance in the electric and electronic industry in the context of sustainable development. This also enhances the understanding of the antecedents and consequences of green supply chain management and provides robust findings on the relationship between environmental and economic performance.

Reliability analysis of SnAgCu lead-free solder thermal interface materials in microelectronics

Purpose In microelectronics industry, the reliability of its components is a major area of concern for engineers. Therefore, it is imperative that such concerns are addressed by using the most reliable materials available. Thermal interface materials (TIMs) are used in electronic devices to bridge the topologies that exists between a heat sink and the flip chip assembly. Therefore, this study aims to investigate the reliability of SAC405 and SAC396 in a microelectronics assembly. Design/methodology/approach In this paper, SnAgCu solder alloys (SAC405 and SAC396) were used as the TIMs. The model, which comprises the chip, TIM and heat sink base, was developed with ANSYS finite element analysis software and simulated under a thermal cycling load of between −40°C and 85°C. Findings The results obtained from this paper were based on the total deformation, stress, strain and fatigue life of the lead-free solder materials. The analyses of the results showed that SAC405 is more reliable than SAC396. This was evident in the fatigue life analysis where it was predicted that it took about 85 days for SAC405 to fail, whereas it took about 13 days for SAC396 to fail. Therefore, SAC405 is recommended as the TIM of choice compared to SAC396 based upon the findings of this investigation. Originality/value This paper is centred on SnAgCu solders used as TIMs. This paper demonstrated that SAC405 is a reliable solder TIM. This can guide manufacturers of electronic products in deciding which SAC solder to apply as TIM during the assembly process.

A Systematic Review on e-Wastage Frameworks

The electronic devices that are targeted to the end users have become day to day essential parts. Traditional methodologies have changed drastically resulting in efficient mode of communication and fast information retrieval. As the demand and the production are exponentially growing, patterns of sales, storage and their destruction and then again, their collection have also been changed. This paper analyses many such behaviors of (electronic) waste management and recommends solutions like recycling management, different directives and policies required to be followed. Authors have emphasized on providing substantial information that can be useful to the regulating authorities responsible for waste management or the manufacturers of various electronic products and then the policy makers. With an extensive review of electronic wastages, authors have emphasized three variables (sales, stock and lifespan) for replacing/upgrading the older products with advanced versions. The root causes of electronic wastages are found in industrializing countries like India, China, Vietnam, Pakistan, the Philippines, Ghana and Nigeria whereas industrialized countries also play equally important role for its generation. This paper signifies the importance of e-waste management practice to reduce the emerging electronic waste hazards. Authors focus on today’s demand of electronic devices, importance of e-waste management and management practices. The paper recommends key findings based on surveying data regarding the lack of regulation to manage the e-waste. The review concludes that the lack of regulation and improper awareness are the basic factors responsible for e-wastage and requires major focus to manage the e-waste.