Manifold Microchannel Heat Sink Research Articles

Self-driven manifold microchannel heat sink for cooling electronics

The advancement of passive, compact, and lightweight thermal management technology for high-power chips is essential for the stable and efficient operation of the next generation of electronic devices. A novel self-driven heat sink based on embedded manifold microchannel heat dissipation technology is proposed, which uses capillary force as the driving force to replace the pump, and minimize pressure drop and thermal resistance between the heat sink and heat source. This design of the embedded self-driven manifold microchannel heat sink allows for the integration and miniaturization of the heat sink and the chip heat source. Through Micro Electromechanical Systems technology, an experimental sink with microchannels with a high aspect ratio was fabricated. A theoretical model is constructed to analyze the influence of the width and depth of the microchannel on the limit heat flux, and the correctness of the model is verified by experiments. The results indicate that the width has a more significant impact on the limit heat flux compared to the depth. An optimal width of 6.5 μm is identified. As the depth increases, the influence of depth on the limit heat flux diminishes. By conducting theoretical calculations on the embedded self-driven manifold microchannel heat sink, it was determined that the device using HFE7100 as the working fluid demonstrates a wider heat load range than ethanol and acetone, and the limit heat flux can reach 41.5W/cm2.

Optimization of Manifold Microchannel Heat Sink Based on Design of Experiment Method

Abstract The manifold microchannel heat sink (MMCHS) shows high potential to cope with the rapidly increasing power density of electronic devices. It is of significance to search for an optimization method to comprehensively consider multiparameter effects on the performance of microchannel. Here, we have studied the temperature and flow characteristics of the MMCHS via experimental method. Then, the effect of geometric parameters including microchannel aspect ratio (α), hydraulic diameter (Dh), and manifold block numbers (Nm) on the performance of a MMCHS were studied by numerical method. Subsequently, the design of experiment (DOE) method was proposed to optimize the geometric parameters of the MMCHS. The relation of friction coefficient and heat transfer coefficient with respect to the three geometric parameters was gained by the mathematical regression model. The statistically optimized manifold microchannel achieved a 10.0% reduction in temperature rise, 59.9% enhanced in the heat transfer coefficient, and the figure of merit (FOM) of 1.6. Our work shows a novel method to consider the effect of structure parameters on the performance of the manifold microchannel and provides a novel optimization design method for the manifold microchannel.

Liquid metal manifold microchannel heat sink for ultra-high heat flux cooling

Advanced heat dissipation technology is crucial for chip operation and performance utilization. Room temperature liquid metal convection cooling technology has demonstrated its efficacy as a viable approach for addressing high heat flux heat dissipation. However, the smaller specific heat capacity of liquid metal leads to a large temperature rise, hindering the advancement of its cooling technology. To address this, a liquid metal manifold channel structure is proposed to convert the continuous long-range flow into a segmented short-range flow. The good matching between liquid metal and manifold structures is adequately demonstrated through a comparison with alternative coolant and channel structure. The simulation results demonstrate the effectiveness of liquid metal manifold channel cooling in dealing with a heat flux of 1000 W/cm2, ensuring that the maximum temperature of the chip remains below 351.7 K. Moreover, the convective heat transfer coefficient even reaches 106 W/(m2·K), which is ten times larger than that of water conventional microchannel heat sink. Orthogonal experiments analyzed the impact of structural parameters on dissipation performance, including the height of the microchannel, ratio of manifold length to fin length, length of fin in manifold, width of channel, and ratio of fin with to channel width. The height of the microchannel has been identified as the most critical factor. This manifold structure mitigates the inherent limitation of liquid metal's lower specific heat capacity, enabling efficient thermal management for electronic devices under ultra-high heat flux conditions.

Performance Improvement of Z-Type Manifold Microchannel Heat Sink with Novel Fin-Arrangements

The Z-type manifold microchannel heat sinks are mostly used by researchers due to the simple structure and considerable heat transfer performance. In this study, a novel Z-type manifold microchannel heat sink with fins arranged at intervals in an arithmetic sequence is proposed to improve the thermo-hydraulic performance of the conventional Z-type manifold microchannel. The novel feature of the proposed design is the channel widths being in an arithmetic sequence with a negative common difference, which contributes to equalize the flow distribution among the channels. Various fin arrangements with different common differences under the same heat transfer area are numerically investigated to determine the thermo-hydraulic performance. The results show that the fins arranged at intervals in an arithmetic sequence have a great potential in mitigating the flow maldistribution. Compared to the conventional manifold microchannel, the proposed manifold microchannel has better thermal performance without a significant increase in pressure drop.

Experimental study of embedded manifold staggered pin-fin microchannel heat sink

High-heat-flux thermal management of high-power chips in electronic devices is becoming more and more critical. Manifold microchannel heat sink is one of the effective choices. In order to improve the heat dissipation capacity of manifold microchannel heat sink, a silicon-based thermal test chip including staggered pin-fin microchannels is designed and fabricated. Staggered pin-fin microchannels and rectangular microchannels with the same area size are embedded on the opposite side of the silicon-based thermal test chip for liquid-cooled heat dissipation. The experiments are conducted using HFE7100 as the working fluid. The heat transfer performance and the flow characteristic of two distinct microchannel structures are evaluated. It is found that the differences in temperature, convection heat transfer coefficient and pressure drop caused by different microchannel structures are greatly related to the mass flow rate. The heat transfer performance of the staggered pin-fin microchannel heat sink is better than that of the rectangular microchannel heat sink at a larger mass flow rate, but it also brings greater flow pressure drop. The bubble effect caused by the transition from single-phase to two-phase flow in microchannels makes the monotonicity of the convection heat transfer coefficient decrease significantly and the monotonicity of the pressure drop increase significantly. Compared to rectangular microchannel heat sinks, staggered pin-fin microchannel heat sinks reach the two-phase flow at higher heat flux. At the mass flow rate of 5 mL/s and the heat flux of 700 W/cm2, the staggered pin-fin microchannel heat sink can reduce the chip surface temperature by 8 K compared with the chip surface temperature of the rectangular microchannel heat sink.

Topologically optimized manifold microchannel heat sink with extreme cooling performance for high heat flux cooling of electronics

The manifold microchannel heat sink (MMCHS) has become one of the most promising cooling solutions for high heat flux electronics due to its lower pressure drop and higher temperature uniformity compared to the traditional microchannel heat sink (MCHS). However, the microchannel configurations in previous MMCHS are dominated by parallel, straight microchannels, which would limit their further enhancement in cooling performance. In this work, we designed the microchannel configuration in the MMCHS using a topology optimization method and proposed a manifold microchannel heat sink with a topologically optimized microchannel substrate (MMCHS-TOMS). The thermohydraulic performance of the MMCHS-TOMS was experimentally and numerically studied. The results showed that the microchannel configuration with optimal cooling performance is achieved at a width ratio of inlet to outlet (Win/Wout) = 0.5 and inlet pressure (Pin) = 10 Pa. The MMCHS-TOMS demonstrates a uniform flow distribution in adjacent arrays, and the discrepancies of volumetric flow rate (V̇d) among all inlets are less than 6 %. The MMCHS-TOMS is capable of removing 1570 W/cm2 heat flux under a footprint area of 42 × 10.5 mm2 with a pressure drop of 11.9 kPa, in which the volumetric flow rate and inlet temperature are 3 L/min and 293 K, respectively. With a volumetric flow rate of 1 L/min and a heat flux of 687 W/cm2, the MMCHS-TOMS achieved a maximum cooling coefficient of performance (COP) of 78273, which is the highest value reported up to date. Moreover, oscillations in temperature (mild) and pressure drop (large) are observed in the MMCHS-TOMS when violent boiling occurs; the system stability caused by those oscillations can be suppressed via increasing the volumetric flow rate, although the COP would thus be reduced.

Study on single-phase and two-phase flow and heat transfer characteristics of HFE-7100 in manifold microchannel heat sink with corrugated bottom

To solve the problem of high heat flux heat dissipation in microelectronic devices, a manifold micro-channel heat sink with corrugated bottom (CB-MMC) is pro-posed on the basis of the manifold microchannel heat sink (MMC). The flow and heat transfer characteristics of HFE-7100 in MMC and CB-MMC are investigated numerically. The results show that CB-MMC reduces the pressure loss and enhances the heat transfer performance in single-phase flow. The orthogonal test method is used to obtain structural design solutions with optimal thermal performance. It is observed that the temperature reduction is always at the expense of the increase of the pressure drop. In addition, the optimization parameters combination obtained through comprehensive evaluation of temperature and pressure drop through weight matrix ? optimized solution 19 (wavelength A = 800 ?m, am-plitude B = 40 ?m, channel depth C = 180 ?m, outlet width D = 300 ?m, channel width E = 25 ?m). Its Tave has decreased by 6.89?C, ?P decreased by 10.27 kPa. Moreover, the subcooled boiling flow and heat transfer performance in MMC and CB-MMC are comparatively studied. The results demonstrate that the dynamic behavior of vapor bubbles causes large pressure fluctuations, which further leads to small temperature fluctuations, and thus reduces the stability of the flow and boiling heat transfer. Compared with MMC, CB-MMC exhibits more stable two-phase flow and better boiling heat transfer.

Experimental study on the flow and heat transfer characteristics of pin-fin manifold microchannel heat sink

A manifold microchannel radiator with a cylindrical pin-rib microchannel is designed and fabricated to enhance the heat dissipation capability of the manifold microchannel radiator, and its flow and heat dissipation capability are investigated by experiments. The fabrication and experiment of the manifold pin-rib microchannel radiators are introduced in detail. The heat dissipation capability of manifold pin-rib microchannel radiators at different flow rates is compared. The result shows that the manifold pin-rib microchannel radiator has excellent heat dissipation performance. When HFE7100 is used as the working medium, the average heated surface temperature of the manifold pin-rib microchannel radiator is about 100°C at the thermal flux density of 1000 W/cm2.

Thermal-hydraulic characterization of manifold microchannel heat sink with diverging channels and uniform heating

This study presents the design and experimentation of a manifold microchannel heat sink with diverging channels, employing ammonia as the working fluid to evaluate its thermal–hydraulic performance under uniform heating conditions. The impact of heat flux, inlet subcooling, saturation temperature, and outlet thermodynamic quality were investigated. Under single-phase conditions, the heat sink exhibited low sensitivity to variations in heat flux with constant thermal resistance and pressure drop. However, with the onset of boiling, the heat transfer capability and pressure drop rapidly increased. A lower inlet subcooling boosted boiling inside the heat sink, leading to decreased thermal resistance and increased pressure drop. Under near-saturated inlet conditions, a higher saturation temperature enhanced heat transfer owing to smaller bubble nucleation and detachment size. The outlet thermodynamic quality for engineering applications should be moderately low because it provides a balance between high heat transfer capability and low pressure drop. Moreover, the results demonstrated excellent thermal–hydraulic performance, with a heat flux of up to 636.9 W/cm2 efficiently dissipated under uniform heating conditions while maintaining the heating surface temperature and pressure drop below 79.3 °C and 150.3 kPa, respectively.

A numerical investigation of the thermal–hydraulic performance during subcooled flow boiling in MMCs with different manifolds

Thermal management of high-heat-flux electronics has been a critical bottleneck for integrated circuit miniaturization and increased power density, and manifold microchannel (MMC) heat sinks are expected to be an efficient near-junction thermal solution. A numerical investigation based a self-developed solver has been conducted to explore the effects of manifold geometries on the thermal–hydraulic performance of MMC heat sinks during subcooled flow boiling, and phase, pressure, and mass distribution among microchannels are analyzed combined with temperature distribution. Heat flux makes little difference on the mass maldistribution among microchannels of MMCs regardless of single-phase and flow boiling, and flow patterns in the outlet manifolds of Z-type MMCs changes from bubbly flow, slug flow to vapor columns with segmented bubbles with increasing heat fluxes. As for the effect of manifold numbers, both the maximum temperature and the pressure drop decrease with increasing manifold numbers, and a relatively uniform distribution of mass and void fraction has been found for all cases of HU-type MMCs regardless of heat fluxes with the best thermal–hydraulic performance at N = 10. However, the thermal performance of Z-type MMCs would improve firstly and then flatten out with increasing manifold number, while the pressure drop presents an opposite trend. The differences in thermal–hydraulic performance are attributed to the longer flow path in Z-type manifolds, and the increasing manifold number presents a higher manifold pressure drop and thus would worsen the mass maldistribution. As for tapered manifolds, a tapered ratio of 0.33 could provide a slightly lower base temperature than the original case with a pressure drop decreased by over 25 %, and the pressure drop fluctuation at high heat fluxes could be suppressed by 70 % with significantly improved flow boiling stability. This work can serve as a basis for the further optimization of subcooled flow boiling in MMC heat sinks, and the results indicate that both an even mass distribution among microchannels and a desirable inlet/outlet port ratio for improved flow field are of great importance for the manifold design applied in MMC heat sinks for two-phase heat dissipation.

Influence of restrictor on the thermal-hydraulic performance in manifold microchannel heat sink

Manifold microchannel heat sinks (MMCHSs) are essential in thermal management. Conventional Z-type MMCHS encounter flow maldistribution and large temperature gradients on the heating surface. This work proposes an innovative MMCHS with restrictors to reduce flow maldistribution and compared with other optimization schemes. Through the numerical simulation, we optimize three dimensionless parameters (the width ratio α and length ratio β of the restrictor and inlet-to-outlet width ratio of manifold γ). Introducing the restrictor into the MMCHS can reduce flow maldistribution. In the research scope, the maximum mass flux discrepancy of MMCHS with α = 0.3 decreased from 327.17% to 64.51% compared to MMCHS with α = 1 when the volumetric flow rate is 8.51 mL/min. The reason is that restrictors increase the ratio between pressure drop in microchannels and total pressure drop(Δpc/Δp). Additionally, the coupling effect of the restrictor and γ on thermal-hydraulic in MMCHS are complicated. Therefore, the thermal resistance ratio (Rt/Rt,0), the pumping power ratio (Pp/Pp,0) and performance evaluation criteria (PEC) are taken as references to consider the thermal-hydraulic performance of MMCHS comprehensively. The results display that the MMCHS with α = 0.5– 0.6, β = 0.4 and γ = 0.8– 1 can further control the synchronization of Rt/Rt,0 and Pp/Pp,0 at about 0.75. The PEC values are all greater than 1.59.

Numerical study on temperature distribution uniformity and cooling performance of manifold microchannel heat sink

The manifold microchannel heat sink (MMCHS) is a promising design for cooling electronic devices due to its ability to effectively dissipate high heat flux. The structural changes of the heat sink play a crucial role in achieving uniform heat dissipation and optimal cooling performance. In order to enhance temperature distribution uniformity and cooling performance, this study conducted numerical simulations by introducing flow-regulating baffles between the manifold channels and microchannels. Additionally, two different types of diverging/converging manifold channels, namely horizontal (z direction) and vertical (y direction) diverging/converging manifold channels, were examined. The simulations were performed under single-phase conditions with varying coolant mass flow rates, and various parameters such as flow distribution, pressure drop, thermal resistance, temperature uniformity, and overall heat transfer performance were analyzed. The findings indicate that the modified MMCHS with baffles exhibited improved temperature distribution uniformity at the base of the heat sink and reduced average thermal resistance. However, it was observed that the pressure drop increased in all cases. The MMCHS with baffles demonstrated an average increase of 70.68% in microchannel flow distribution uniformity, an average increase of 44.55% in temperature distribution uniformity at the base of the heat sink, and an average increase of 7.67% in cooling coefficient of performance (COP). On the other hand, the MMCHS with diverging/converging manifold channels in the z and y directions showed an average increase of 81.44% and 83.65% in microchannel flow distribution uniformity, and an average increase of 57.71% and 62.13% in temperature distribution uniformity. However, it was noted that the COP decreased by an average of 14.58% and 29.81% for these cases.

Thermal-hydraulic performance of ammonia in manifold microchannel heat sink

With the increasing miniaturisation of electronic devices, the demand for cooling technologies with high efficiency has increased. Therefore, in this study, a manifold microchannel heat sink was designed and fabricated to enhance the dissipating capability of high-heat-flux hotspots. Owing to its excellent thermophysical properties, ammonia was selected as the working fluid, and its thermal–hydraulic characteristics were evaluated. In addition, the effects of flow rate, heat flux, saturation temperature, and inlet conditions were investigated through experiments. High-subcooled inlet experiments revealed that the thermal resistance decreased and pressure drop increased with increasing flow rate. Moreover, localised subcooled boiling was observed near the heated region. In near-saturated inlet experiments, jet impingement and microchannel cooling were identified as the dominant heat transfer mechanisms over different flow ranges. Notably, the higher heat flux, lower saturation temperature, and two-phase inlet condition reduced the thermal resistance under the operating conditions of the study. The proposed heat sink dissipated the heat flux (up to 1542 W/cm2) from the heat source (1 mm × 6 mm) with a pressure drop of 10.6 kPa, and the corresponding heating surface temperature and thermal resistance were 68.05 ℃ and 0.450 K/W, respectively.

Numerical investigation of novel manifold microchannel heat sinks with countercurrent regions

Manifold microchannel (MMC) heat sink is a potential method to dissipate high heat fluxes of electronic devices. Traditional Z-type MMC is a simple configuration but usually encounters high temperature difference and pressure drop. In this work, we introduced countercurrent flows to alleviate these problems by revising the design of manifold configurations. Six cases with different manifold arrangements are numerically investigated using single-phase deionized water at mass flow rates ranging from 0.04 - 0.12 g/s. The results show that the maximum temperature, average temperature, and temperature difference of the revised arrangements are all lower than these of the traditional Z-type manifold arrangement. The cases with countercurrent regions can reduce the maximum temperature around 5 K compared with the original cases with parallel regions. The temperature difference of the ZU-type MMC with double-layer countercurrent flow configuration is lower than 4 K, which is about 25% of the original Z-type MMC. For the revised manifold configuration with countercurrent flows, the pressure drops also decrease due to the split of inlets and outlets of the manifold. The pressure drops of single-layer and double-layer countercurrent manifolds are respectively 27.13% and 33.36% lower than that of the case with traditional Z-type manifold. This leads to a higher comprehensive performance of revised cases with countercurrent flows. Besides the better temperature uniformity, the fluid flow becomes more uniform in the microchannels for the revised case. The improved ZU-type MMC with double-layer countercurrent flow can dissipate 1100 W/cm2 for single-phase flow with a temperature increase of 80 K and a pressure drop of 22 kPa at mass flow rate of 1.2 g/s.

Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module

Abstract Better thermal management is a key enabler of higher power density in traction inverter power modules. For the first time, we successfully fabricated and tested a microchannel with a three-dimensional (3D) manifold cooler (MMC) using aluminum nitride (AlN)-based directed bonded copper (DBC) substrates. The microchannels (width ∼300 μm and height ∼450 μm) and 3D manifold fluidic passages (width ∼300 μm and height ∼600 μm) were fabricated in two DBC substrates using the femtosecond laser and subsequently bonded using transition liquid phase (TLP) bonding. In this study, the hydraulic and thermal performance of the 3D MMC is measured and validated with numerical simulation. The proposed 3D MMC is capable of removing heat at 600 W/cm2 with a 10 kPa pressured drop at the thermal thermal resistance of 0.2 cm2 K/W. The optimized designs via geometric and layout rearrangement were conducted, which indicates the pressure drop can be further reduced by 10× while maintaining the same thermal performance.

Thermal and hydrodynamic characteristics of single-phase flow in manifold microchannels with countercurrent regions

Manifold microchannel heat sink is promising to dissipate high heat fluxes for electronic devices due to its high surface to volume ratio. Traditional Z-type manifold encounters fluid flow maldistribution and a high temperature difference. In this work, two inlets and countercurrent flows are introduced into the manifold arrangement to alleviate these problems in the Z-type manifold microchannels. Six cases with different manifold arrangements are numerically investigated using single-phase HFE-7100 at mass flow rates ranging from 56.8 to 117.78 mg/s. The results show that the maximum temperature, average temperature, and temperature difference of the revised arrangements are all lower than these of the traditional Z-type manifold arrangement. The minimum temperature difference for an ideal multi inlet manifold arrangement can be less than 0.2 K, while the value is about 5.3 K for the traditional Z-type manifold arrangement. The revised arrangement can also improve the uniformity of mass flux distributions. The ratio of the maximum to the minimum mass flux within microchannels is 12.83 for the traditional Z-type manifold, while this value is about 5.82 for cases with two inlets and countercurrent zones. A longer flow path and a higher local pressure drop in the revised arrangements results in higher pressure drops than the traditional Z-type manifold microchannels. Compared with the traditional Z-type arrangement, heat transfer coefficients and performance evaluation criterion are higher for the improved cases. The presence of a countercurrent zone can improve the comprehensive performance of the manifold microchannel. New criterion based on the thermal resistance calculated at the maximum temperature is proposed to evaluate the cooling performance of electronics.

Numerical investigation of heat transfer and pressure drop characteristics of flow boiling in manifold microchannels with a simple multiphase model

The Manifold Microchannel (MMC) heat sink is an emerging micro-scale electronic cooling technology with high heat dissipation potential and application prospects. This paper numerically studied the subcooled flow boiling in MMC heat sinks. The feasibility of using the Mixture multiphase flow model to simulate the subcooled flow boiling in the MMC heat sink is validated. As the vapor-liquid interfaces are not reconstructed in this model, less computational resources are needed compared with other multiphase models. The results show that at constant channel width, the maximum and average temperatures of the MMC decrease with the increase of the microchannel aspect ratio. For cases with an inlet velocity of 0.35 m/s, the average wall temperature decreases from 388.53 K to 374.26 K when the aspect ratio increases from 6.67 to 16.67. The difference between the maximum and the minimum temperature on the heated surface increases with the increase of channel aspect ratio, resulting in an uneven temperature distribution. The thickness of temperature boundary layer near the divider is thicker than that near the heated base at low aspect ratio. Low pressure drops are obtained for cases with high aspect ratios due to the increase in cross-sectional area. The pressure drop of MMC with aspect ratio of 6.67 is nearly twice of the case with aspect ratio of 16.67. Although the Mixture model could not characterize the bubble shapes, the numerical results are similar to those obtained by the VOF model and the experimental visual results. A complex case of subcooled flow boiling in Z-type MMC with a hotspot heat flux of 800 W/cm2 is also conducted using the whole computational domain. Mal-distributions of mass flux, wall temperature and vapor void fraction are observed for this complicated problem. The difference between the maximum and the minimum temperatures is about 12 K. The Mixture model is more suitable to obtain reasonable numerical results of flow boiling in complex MMC with much less computational resource.

Hydrodynamic and thermal performance of in-line strip-fin manifold microchannel heat sink

In this work, an in-line strip-fin manifold microchannel heat sink is proposed to improve the hydrodynamic and thermal performance of the conventional manifold microchannel. The hydrodynamic and thermal performance of varying strip-fin arrangements with approximately the same heat transfer area are numerically investigated. The results show that the in-line strip-fin manifold microchannel has lower pressure drop and better thermal performance than that of the conventional manifold microchannel at the same inlet mass flux. For varying strip-fin arrangements studied in this work, the pressure drop decreases by 15% to 25.5% at the inlet mass fluxes between 600kg/(m2s) and 1800kg/(m2s), compared with the conventional manifold microchannel. The effective overall thermal resistance of the in-line strip-fin manifold microchannel heat sink reaches the minimum value at one specific strip-fin arrangement, which is characterized by the optimal longitudinal number of strip-fins NL,opt. A minimum effective overall thermal resistance of 5.7×10−6m2K/W at an inlet mass flux of 1800kg/(m2s) is achieved. The average temperature of the optimal strip-fin arrangement is about 6.8K lower than that of the conventional manifold microchannel, when the heat flux is 300W/cm2. Heat transfer correlation considering microchannel geometrical parameters is proposed, which can be used to predict the thermal performance of the in-line strip-fin manifold microchannel. Based on the correlation, the effect of the in-line strip-fin array on the thermal performance is qualitatively revealed by thermal resistance analysis.

Sobol sensitivity analysis and multi-objective optimization of manifold microchannel heat sink considering entropy generation minimization

Manifold microchannel (MMC) heat sink has been widely employed as an efficient scheme for high heat flux cooling of electronic devices. The parametric optimization design of the MMC heat sink is the key factor that directly determines the thermal management performance. In this study, Sobol global sensitivity analysis is firstly applied to quantitatively evaluate the effects of four geometric design parameters and inlet volume flow rate on the MMC heat sink performance. A multi-objective optimization method combining space filling method, Back-Propagation Neural Network and NSGA-II is then established to minimum the thermal resistance, total pumping power and total entropy generation of MMC heat sink, in which TOPSIS method based on entropy weight is developed to select the best compromise solution from the Pareto-optimal solutions. Finally, the overall performance among different optimal solutions is compared to identify the effectiveness of the optimization results. The results show that the obtained optimum design parameters can provide more than 67% reduction in power consumption without scarifying thermal performance compared with the MMC heat sink published in the journal “Nature” by Erp et al. in 2020. In addition, the best compromise solution can be recommended as selectable for designer because it shows the best performance, which can boost the heat flux beyond 1000 W/cm2 with pumping power consumption 0.236 W. These results are of great significance to the design of advanced MMC heat sink for cooling electronic devices.

Coupling CFD and RSM to optimize the flow and heat transfer performance of a manifold microchannel heat sink

Coupling CFD and RSM to optimize the flow and heat transfer performance of a manifold microchannel heat sink