Self-driven manifold microchannel heat sink for cooling electronics

Abstract

The advancement of passive, compact, and lightweight thermal management technology for high-power chips is essential for the stable and efficient operation of the next generation of electronic devices. A novel self-driven heat sink based on embedded manifold microchannel heat dissipation technology is proposed, which uses capillary force as the driving force to replace the pump, and minimize pressure drop and thermal resistance between the heat sink and heat source. This design of the embedded self-driven manifold microchannel heat sink allows for the integration and miniaturization of the heat sink and the chip heat source. Through Micro Electromechanical Systems technology, an experimental sink with microchannels with a high aspect ratio was fabricated. A theoretical model is constructed to analyze the influence of the width and depth of the microchannel on the limit heat flux, and the correctness of the model is verified by experiments. The results indicate that the width has a more significant impact on the limit heat flux compared to the depth. An optimal width of 6.5 μm is identified. As the depth increases, the influence of depth on the limit heat flux diminishes. By conducting theoretical calculations on the embedded self-driven manifold microchannel heat sink, it was determined that the device using HFE7100 as the working fluid demonstrates a wider heat load range than ethanol and acetone, and the limit heat flux can reach 41.5W/cm2.