Low Temperature Co-fired Ceramics Tapes Research Articles

Inkjet-printed low temperature co-fired ceramics: process development for customized LTCC

This paper investigates the utilization of digital printing technologies for the fabrication of low temperature co-fired ceramics (LTCC). LTCC offer great opportunities for applications such as antennas, sensors or actuators due to their outstanding properties like low dielectric loss, low permittivity, low coefficient of thermal expansion and at the same time high reliability in harsh environments (heat, humidity, and radiation). LTCC are multilayer circuits that are typically functionalized by screen-printing. This publication investigates the replacement of screen-printing by digital printing processes, such as inkjet and Aerosol Jet printing, to facilitate a more resource-friendly and customizable manufacturing of LTCC. The use of digital printing technologies not only streamlines small-scale productions and development processes but also offers the advantage of achieving miniaturization down to single-digit microns. In this publication, digital printing processes, filling of vias, lamination processes, co-firing at 850 °C and printing on fired LTCC were investigated. Three layers of nanoparticle silver ink were printed on green LTCC tape and 100% of the embedded printed structures were conductive after co-firing. Filling of vias with inkjet printing was investigated and the most important process parameters were found to be the clustering of vias, the amount of active nozzles and the substrate temperature. Printing on fired LTCC demonstrated high precision, and sintering at 600 °C achieved strong adhesion of printed structures to LTCC. These successful findings culminate in presenting a process chain for fully maskless structured, multilayer LTCC.

Low insertion loss interposer approach for RF applications based on commercial LTCC tape, alkaline-free glass and printed metallization

Materials with high RF performance are in increasing demand due to the needs of modern telecommunications. Glass and low-temperature co-fired ceramics (LTCCs) are both interesting candidates for the design of complex signal transmission systems. Glass can be processed in large panels, and has suitable structure dimensions for silicon processing, but its multilayer capability is limited. LTCC is a mature technology for complex multilayer assemblies, but the structure dimensions and conductor line resolution are restricted by the need to use screen printing technology. The approach presented here combines the advantages of both technological domains: a thin glass sheet is bonded with no additional material to a LTCC multilayer ceramic and sintered to form a tight joint. Metallization of the glass is created using printable pastes and electroplating. Two fabrication routes are compared: etching of printed thick film metal layers, and semi-additive structuring. The results of RF measurements show a low attenuation per unit length for both types of metallization, indicating that our approach is a promising one for the integration of heterogeneous systems of RF transmission modules.

Innovative Silicon-Ceramic (SiCer) Technology for High-Strength Pressure Sensor Applications Using Different Manufacturing Methods

A variety of manufacturing methods can be used to assemble silicon-based piezoresistive pressure sensors, such as anodic bonding or silicon direct bonding. To achieve highstrength pressure sensors, a high quality interface connection is required. The combination of silicon and ceramic creates a new innovative composite system known as Silicon-on-Ceramics, short SiCer. By using a special developed bondable Low Temperature Co-fired Ceramic tape, which corresponds to the thermal expansion coefficient of Si, the combination of both materials is possible through a sintering process. Advantages of the SiCer technology are high temperature stability, manufacturing at wafer-level and a high bond strength at the interface. Different manufactured SiCer-based pressure sensors were fabricated, electrically and mechanically characterized and compared with anodic bonded and silicon direct bonded pressure sensors.

High‐resolution patterning on LTCC by transfer of photolithography‐based metallic microstructures

AbstractThe growing applications and constant miniaturization of electronic devices and of low‐temperature co‐fired ceramics (LTCC) in various fields, such as aviation, telecommunications, automotive, satellite communications, and military, have led to an increase in the demand for LTCC. Such prospects arise due to the continuous scaling down of components and high‐density interconnection in electronics packaging. This paper reports a technique for the transfer of high‐resolution microstructures from silicon substrates to LTCC. In this method, gold and copper patterns were formed by photolithography, electrodeposition, and residual layer stripping on silicon substrate. Lithography provides the opportunity to create and transfer complex patterns for use in several different applications and electroplating enables the use of pure metal for excellent electrical properties. The developed structures were transferred onto a top layer of LTCC tape using hot embossing. Then, the subsequent layers were stacked, laminated, and sintered. A resolution of 1.5 μm after free sintering and 4.5 μm after pressure‐assisted sintering was achieved. This distinctive method can be useful for several applications requiring high‐resolution and superior electrical properties.

Design, Fabrication and Characterization of Inter-Layer Microheaters Using LTCC Technology

This paper presents design, fabrication and characterization of novel inter-layer microheaters based on low temperature co-fired ceramics (LTCC) technology. LTCC microheater structures (S1 to S3) with three different heater configurations has been presented. Microheater structure S1 has a heater pattern generated only on the top LTCC layer while S2 and S3 structures have inter-layer heater patterns. These structures have been simulated using COMSOL software to depict the temperature distribution over the active area. LTCC being a multilayer technology, heater patterns are generated in two different layers of LTCC tapes and connected through vias (3D interconnections) to fabricate inter-layer microheaters. By distributing the heater pattern of S1 equally in two LTCC tape layers (as in S3), this method allows possibility to develop miniature LTCC microheaters using conventional screen-printing process. The developed microheaters are characterized and the results are compared. At an input power of ∼1 W, structure S3 reaches a peak temperature of 316 °C as compared to 272 °C achieved with S1 configuration. Thermal imaging results shows better temperature uniformity in the active area for inter-layer microheaters as compared to microheater having heater pattern only on the top LTCC layer.

Meshed Stacked LTCC Antenna for Space Application

Meshed conductors have been used to realize antenna systems. Previous studies have concentrated on single layer patch designs. In this paper, different mesh configurations of stacked meshed patch antennas are studied; when both patches are meshed, when only the top patch is meshed, when only the bottom patch is meshed and when both patches are continuous solid metal. In addition, the effect of conventional slot loading on stacked meshed patches is also investigated through parametric studies. The designs are fed by coaxial feed probe in the lower patch. The results showed that the stacked mesh performance in terms of the resonant frequency, return loss, gain and radiation efficiency can be comparable to that of a typical, continuous metal stacked design. Both patches are 20.86 mm <inline-formula> <tex-math notation="LaTeX">$\times21.46$ </tex-math></inline-formula> mm. The maximum absolute gain and radiation efficiency of the solid stacked patch were 5.05 dBi and 91.6&#x0025; while those of the meshed stacked patch were 5.22 dBi and 91.8&#x0025; respectively. The measurements of stacked meshed design showed that the antenna was resonant at 2.52 GHz with a reflection coefficient in dB of &#x2212;23.69 dB. It has a 40 MHz &#x2212;10 dB impedance bandwidth (1.5&#x0025;) from 2.50 GHz to 2.54 GHz. The antenna exhibited a maximum measured gain of &#x2212;0.12 dBi and cross polarization of 10 dB at boresight. An equivalent circuit model for the design was also proposed. The antenna was intended for space application, and therefore it was implemented using Low Temperature Co-fired Ceramic (LTCC) technology as the LTCC properties can withstand the harsh environment of space. Although the meshed lines increase the line impedance and therefore can result in increased losses, this can be mitigated by careful mesh selection. Lastly, the meshed design allows for better bonding between the LTCC tape layers.

Wet chemical porosification with phosphate buffer solutions for permittivity reduction of LTCC substrates

The wireless high-frequency technology requires a robust, cost-effective, and highly integrated substrate technology offering the capability for areas of tailored permittivity. The wet-chemical porosification of low temperature co-fired ceramics (LTCC) substrates offers such an approach by locally embedding air. Porosification of LTCC in both extremely acidic and alkaline media has been investigated in previous works. However, for improving the available knowledge on the porosification of LTCC with H3PO4 as a standard and a widely used etching solution, the impact of solution concentration was systematically investigated and a substantial improvement in the etching performance was achieved. Moreover, in the present study, for the first time, the intermediate pH values, and the impact of pH as a key parameter on the etching process have been investigated. For this purpose, the applicability of phosphate buffer solution (PBS) as a prospective novel etchant mixture for the porosification of a commercially available LTCC tape (Ceramtape GC) was explored. Valuable information about surface morphology, crystalline composition, and the pore structure of the etched LTCCs was gathered employing scanning electron microscopy, transmission electron microscopy, X-ray diffraction analysis, and mercury porosimetry measurements. Based on these findings, the performance of PBS-based etchant systems towards the generation of porous LTCCs combining high depths of porosification with acceptable surface characteristics for subsequent metallization is demonstrated. Based on the obtained results, by application of a 0.2 mol L−1 solution of PBS, the effective relative permittivity of test samples with a thickness of approximately 600 µm and a porosification depth of 186 µm from each side, could be reduced up to 10% of its initial “as fired” value. Also, based on the measurement results and by measuring the depth of porosification, the permittivity of the etched layer was estimated to show a reduction of up to 22% compared to the initial “as fired” value.

On the porosification of LTCC substrates with sodium hydroxide

Outstanding material properties of low temperature co-fired ceramics (LTCC) make them the technology of choice when targeting the realization of robust, highly integrated substrates or packaging solutions for micromachined devices. However, the relatively high permittivity limits their utilization in high-frequency applications, as in addition defined areas with reduced permittivity in one single LTCC layer would be most beneficial. The wet-chemical porosification method under alkaline conditions is a novel and most advantageous approach which can be applied for permittivity reduction through locally embedding air into the LTCC surface in its as-fired state with low impact on the surface characteristics. The resulting porosity of the LTCC substrates after the etching process is strongly affected by the LTCC tape composition as well as the etch parameters. Since the chemical composition of the tape is desired to be unaltered, optimizing the etching parameters, namely etchant concentration, etching time, and bath temperature is a reasonable procedure which allows tailoring the porosification process for the LTCC tapes in their as-fired state.In this work the etching behavior and surface morphology of the LTCC substrates have been studied, both qualitatively and quantitatively, and detailed gravimetric and roughness measurements, as well as porosification depth investigations, were carried out. The conducted analyses suggest a dominating reaction-controlled mechanism for the etching process. In addition to generating a tailored porosity in the surface-near region, overall thickness reduction of the LTCC through the overall dissolution of the LTCC surface under a defined etching condition was also possible. The experimental results were finally fitted into a nonlinear polynomial model for providing an experimental basis in order to identify the most crucial parameters to achieve a tailored porosity.

High voltage applications of low temperature co-fired ceramics

PurposeThe purpose of this study was to design, fabricate and test devices based on transformers integrated with low-temperature co-fired ceramic (LTCC) modules with isolation between primary and secondary windings at the level between 6 and 12 kV.Design/methodology/approachInsulating properties of the LTCC were examined. Dielectric strength and volume resistivity were determined for common LTCC tapes: 951 (DuPont), 41020, 41060 (ESL), A6M (Ferro) and SK47 (KEKO). According to the determined properties, three different devices were designed, fabricated and tested: a compact DC/DC converter, a galvanic separator for serial digital bus and a transformer for high-voltage generator.FindingsBreakdown field intensity higher than 40 kV/mm was obtained for the test samples set, whereas the best breakdown field intensity of about 90 kV/mm was obtained for 951 tape. The materials 41020 and 951 exhibited the highest volume resistivity. Fabricated devices exhibited safe operation up to a potential difference of 10 kV, limited by minimum clearance. Long-term stability was assured by over 20 kV strength of inner dielectric.Practical implicationsThis paper contains description of three devices made in the LTCC technology for application in systems with high-voltage isolation requirement, for example, for power or railway power networks.Originality/valueThe results show that LTCC is a suitable material for fabrication of high-voltage devices with integrated passives. Technology and properties of three examples of such devices are described, demonstrating the ability of the LTCC technology for application in reliable high-voltage devices and systems.

Preparation, characterization and properties of alumina-lithium aluminium borosilicate glass based LTCC tapes

A new low temperature cofired ceramic (LTCC) tape based on 40 wt% Al2O3–60 wt% LABS glass (40Li2CO3:10Al2O3:30B2O3:20SiO2) has been developed. The dielectric properties of the LABS glass are studied. The structural, dielectric, thermal as well as the chemical compatibility with Ag electrode of the bulk Al2O3–LABS sintered at 800 °C are investigated .The room temperature thermal conductivity and CTE of the bulk are 3.80 Wm−1 K−1 and 5.1 ppm/°C respectively. The Al2O3–LABS slurry which has a pseudoplastic nature is made into thin sheets using tape casting technique. The green tape has a surface roughness of 293 nm and tensile strength 0.2 MPa. The Al2O3–LABS based LTCC tapes are sintered at 775 °C has er of 4.70 with tanδ 0.005 and τe of +412 ppm/°C at 5 GHz. The results suggest that the Al2O3–LABS based LTCC tapes is a possible candidate for LTCC device applications.

The LTCC device for miniature plasma generators characterization

Purpose The purpose of this paper is a presentation of a miniature vertical dielectric barrier discharge (DBD) plasma generators. The presented devices, with sub- and superstrate, were made using low temperature co-fired ceramics (LTCC). Such construction allowed to measure discharge spectra and device temperature easily. Design/methodology/approach The generators were made in the Du Pont 951 system with silver vertical metallizations and PdAg contacts. The devices had electrodes with different width and height. Also, the distance between them could be established. They were placed on substrate with buried temperature sensor and covered with a ceramic lid. The lid had opening to measure emitted light. Different configurations of vertical DBD were tested. Findings Geometry of vertical metallizations influences on spectra, as well as distance between them. Signal-to-noise ratio had a maximum for certain generators and can be measured by the intensity of highest peak. Research limitations/implications Height of vertical metallizations is limited by the difference in shrinkage of LTCC tape and via paste. Parameters of temperature sensors vary between measurements, according to rapid changes of temperature and presence of strong electric field. Practical implications The generators can be used for creating discharge for optical emission spectrometry. It is a convenient method to determine the amount of selected gas compounds. Originality/value This paper shows fabrication and performance of the novel vertical DBD generators with ceramic additions for convenient spectra measurement and monitoring temperature of the device during work.

A Multilayer LTCC Solution for Integrating 5G Access Point Antenna Modules

An integrated solution for the development of multilayer antenna modules for fifth-generation (5G) communications, based on low temperature cofired ceramic (LTCC), is presented. The design exploits the 3-D integration capabilities of the LTCC process, enabling the realization of a full-corporate feed network (CFN) in vertical configuration. A novel implementation of the CFN employing dielectric-embedded parallel plate waveguides (PPWs) is proposed. The PPW lines are delimited by via-rows. As opposed to standard substrate-integrated waveguide feed networks, guided fields are orthogonal to the via-rows and propagate along the vertical axis of the structure. The CFN feeds four long slots, without any coupling structure, and provides broadband operation. The final prototype comprises 18 LTCC tapes, with a total thickness of 3.4 mm. The measured −10-dB impedance bandwidth spans from 51.2 to 66 GHz (>25.2%). The module generates a fixed broadside beam, but multibeam operation in $H$ -plane can be easily achieved. In the 50–66-GHz band, the peak gain is 14.25 dBi and the average first side-lobe level in $H$ -plane is −20.6 dB. The proposed technology and the design concept are suited for highly integrated millimeter-wave systems, such as access points in the future $V$ -band high data-rate wireless networks.

Multilayer Ferrite Inductor Substrate for Ceramic-Based High Current Point-of-Load (POL) Converter

Abstract High power-density and high efficiency are the two driving forces for point-of-load (POL) converters used in portable electronics and other applications where system miniaturization is required. Discrete passive components, especially bulky inductors, have become the bottleneck for downsizing POL converters. Low-temperature sintered Ni-Cu-Zn ferrite tapes for multilayer chip inductors have been widely studied and used in high-frequency power electronics applications. In our previous study, a low-profile, planar inductor substrate with lateral flux pattern was fabricated using mixed commercial low-fire Ni-Cu-Zn ferrite tapes and compatible low temperature co-fired ceramic (LTCC) processing. However, thermal interface material was used between active circuit board and passive layer (ferrite substrate), which increases the total volume of the converter and becomes a potential threat for reliability due to the mismatch of coefficient of thermal expansion among different layers. Additionally, this hybrid integration method requires labor-intensive manual steps which are not compatible with cost-sensitive power electronics market. A fully ceramic-based POL module with integrated multilayer ferrite inductor has been proposed. The circuit and other components are designed to be directly built on top of the multilayer ferrite inductor substrate. This presented work focuses on the development of the multilayer ceramic substrate with embedded planar, lateral-flux inductor by co-firing of ferrite and dielectric tapes with conductor paste. Commercial dielectric LTCC and ferrite tapes were chosen for the fabrication of multilayer ferrite inductor substrate. Different silver pastes were co-fired with ceramic tapes to form the inductor winding. The sintering behavior and compatibility of dielectric, magnetic, and conductive components in one co-firing process was studied in order to realize a cohesive multilayer ceramic substrate. The embedded inductors present lower inductance than pure ferrite inductors sintered alone using the same profile when the output current is smaller than 10 A. The inductance of both types of inductors are very similar when output current is above 15 A. The inductor embedded in dielectric tapes exhibits higher core loss density than its counterpart. Future work will focus on the integration of high current POL module using this developed multilayer ferrite inductor substrate.

Impact of processing parameters on the LTCC channels geometry

AbstractA great advantage of Low Temperature Co-fired Ceramics (LTCC) yields the possibility of channel and air cavity fabrication. Such empty spaces have numerous applications, for example, in microfluidics, microwave techniques and integrated packaging. However, improper geometry of these structures can degrade the performance of the final device. The processing parameters recommended by the LTCC tape supplier are relevant for the production of multilayer circuits but not surface embedded channels and/or cavities. Thus, it is important to examine which factors of the fabrication process are the most significant. In our study, special attention has been paid to the geometric performance of the channel structure resulting from the applied processing parameters. Laser cutting parameters were checked to obtain the structures with great fidelity. The impact of an isostatic lamination on the quality of the final structure was analyzed. The influence of pressure and temperature of the lamination process on the channel geometry and tape shrinkage were examined. The performed experiments showed that some improvements in channel/cavity geometry may be achieved by optimizing the processing procedures. The microscopic observations combined with the Analysis of Variance (ANOVA) showed which combinations of the processing parameters are the best for achieving a channel/cavity structure with the desired geometry.

Integration of Silver Heat Spreaders in LTCC utilizing Thick Silver Tape in the Co-fire Process

The integration density in semiconductor devices is significantly increased in the last years. This trend is already described by Moore's law what forecasts a doubling of the integration density every two years. This evolution makes greater demands on the substrate technology which is used for the first level interconnect between the semiconductor and the device package. Higher pattern resolution is required to connect more functions on a smaller chip. Also the thermal performance of the substrate is a crucial issue. The increased integration density leads to an increased power density, what means that more heat has to dissipate on a smaller area. Thus, substrates with a high thermal conductivity (e. g. direct bonded copper (DBC)) are utilized which spread the heat over a large area. However, the reduced pattern resolution caused by thick metal layers is disadvantageous for this substrate technology. Alternatively, low temperature co-fired ceramic (LTCC) can be used. This multilayer technology provides a high pattern resolution in combination with a high integration grade. The poor thermal conductivity of LTCC (3 … 5 W*m−1*K−1) requires thermal vias made of silver paste which are placed between the power chip and the heat sink and reduce the thermal resistance of the substrate. The via-pitch and diameter is limited by the LTCC technology, what allows a maximum filling grade of approx. 20 to 25 %. Alternatively, an opening in the ceramic is created, to bond the chip directly to the heat sink. This leads to technological challenges like the CTE mismatch between the chip and the heat sink material. Expensive materials like copper molybdenum composites with matched CTE have to be used. In the presented investigation, a thick silver tape is used to form a thick silver heat spreader through the LTCC substrate. An opening is structured by laser cutting in the LTCC tape and filled with a laser cut silver tape. After lamination, the substrate is fired using a constraint sintering process. The bond strength of the silver to LTCC interface is approx. 5.6 MPa. The thermal resistance of the silver structure is measured by a thermal test chip (Delphi PST1, 2.5 mm × 2.5 mm) glued with a high thermal conducting epoxy to the silver structure. The chip contains a resistor and diodes to generate heat and to determine the junction temperature respectively. The backside of the test structure is temperature stabilized by a temperature controlled heat sink. The resulting thermal resistance is in the range of 1.1 K/W to 1.5 K/W depending on the length of silver structure (5 mm to 7 mm). Advantages of the presented heat spreader are the low thermal resistance and the good embedding capability in the co-fire LTCC process.

Laser Ablation of Thin Films on Low Temperature Cofired Ceramic

Direct digital manufacturing techniques such as laser ablation are proposed for the fabrication of lower cost, miniaturized, and lightweight integrated assemblies with high performance requirements. This paper investigates the laser ablation of a Ti/Cu/Pt/Au thin-film metal stack on fired low temperature cofired ceramic (LTCC) surfaces using a 355-nm Nd:YAG diode-pumped laser ablation system. It further investigates laser ablation applications using unfired, or “green,” LTCC materials in the following ways: (1) through one layer of a laminated stack of unfired LTCC tape to a buried thick-film-conductor ground plane, and (2) in unfired Au thick films. The UV-laser power profile and part fixturing were optimized to address defects such as LTCC microcracking, thin-film adhesion failures, and redeposition of Cu and Pt. An alternate design approach to minimize ablation time was tested for efficiency in manufacture. Multichip modules were tested for solderability, solder leach resistance, and wire bondability. Scanning electron microscopy, as well as cross sections and microanalytical techniques, were used in this study.

LTCC tapes based on Al2O3–BBSZ glass with improved thermal conductivity

A novel low temperature co-fired ceramic (LTCC) composition consisting of 40wt% Al2O3–60wt% BBSZ (35Bi2O3:32ZnO:27B2O3:6SiO2) fireable at 850°C has been developed. The XRD study of the sintered composite shows the presence of Bi24Si2O40 and ZnAl2O4 secondary phases. The bulk samples sintered at 900°C has dielectric constant (εr) of 11.3 and loss tangent (tanδ) of 0.001 at 1MHz. Tapes of the composite have been casted on Mylar® film and the green tape has a surface roughness of 299nm and tensile strength of 0.1MPa. Upon sintering the tapes showed an εr of 10.9, tanδ of 0.009 and temperature coefficient of dielectric constant (τε) of 487ppm/°C at 5GHz, which are suitable for practical hybrid device applications.

A Two-Stage Process for Laser Prototyping of Microwave Circuits in LTCC Technology

An improved technique for laser prototyping of microwave circuits in low-temperature cofired ceramic (LTCC) technology is presented. This builds on the method of laser machining of conductor layers in unfired LTCC tapes. The proposed process presents the hybrid approach of circuit fabrication by employing both unfired and post fired laser machining of LTCC substrate, hence giving more flexibility of realizing multilayer components. This allows the low-tolerance microwave structures like couplers and filters to be fabricated on the outer layers because shrinkage uncertainty is no longer a problem. Track widths and gaps of 30 μm are demonstrated with an edge definition of ±2 μm. A stripline coupler and a four-layer spiral inductor is successfully fabricated using this technique to demonstrate the process. The improved process can produce high-precision microwave and millimeter-wave components on the outer layers and provides rapid system-in-package prototyping for research and development.

Radio Frequency Microelectromechanical System-Platform Based on Silicon-Ceramic Composite Substrates

In the last few years, several low-temperature coefficient of expansion of low temperature cofired ceramic (LTCC) materials have been developed for direct wafer bonding to silicon. BGK, a sodium-containing LTCC, was originally developed for anodic bonding of the sintered LTCC, whereas BCT (bondable ceramic tape) was tailored for direct silicon bonding of green LTCC tapes to fabricate a quasi-monolithic, silicon ceramic compound substrate. This so-called silicon-on-ceramic (SiCer) technique is based on homogeneous nanostructuring of a silicon substrate, a lamination step of BCT and Si, and a subsequent pressure-assisted sintering. We present a new approach for an integrated radio frequency (RF)-platform setup combining passive, active, and mechanical elements on one SiCer substrate. In this context, RF parameters of the Si-adapted LTCC tapes and the use of commercial metal pastes on BCT with respect to bondability and solderability are investigated. We show first technological results of creating cavities at the SiCer interface for SiCer-specific contacting options (e.g., exposed contact pads at the interface), as well as windows in the ceramic layer of the SiCer substrate for additional Si processing (e.g., Si backside thin-film wiring, plasma etching). A further investigated platform technology is deep reactive-ion etching of the SiCer composite substrate. The etching behavior of Si and BCT is demonstrated and discussed. With the SiCer technique, it is possible to reduce the Si content at the setup of RF microelectromechanical system to a minimum (low signal damping).

Direct Write Electronics – Thick Films on LTCC

For low volume, high value microelectronic applications reducing cost and time to initial production parts in Low Temperature Cofired Ceramics (LTCC) play a big part in customer satisfaction. Using Direct Write Electronics (DWE) for conductor printing and other structures has the potential to reduce time to production through elimination of intermediate tooling and to reduce waste by applying expensive materials only where they are needed. Additional benefits may be realized by using DWE: wire bonds may be replaced by dispensed conductors; individual layers and parts may be uniquely labeled at the time of printing to improve traceability of product throughout the line and reducing manufacturing errors. This paper investigates using engineered fluid dispensing to print interior and exterior conductors on a demonstration Multi-Chip Module (MCM). Industry standard materials and processes are used to form individual layers of unfired LTCC tape, as well as the forming and filling of interlayer connecting vias with conductive thick film paste. Conductor patterns on each layer are created by dispensing modified Au conductor paste with a commercial three-axis machine with a fine-tipped dispensing pump. Standard processes for collation, lamination, and sintering were followed by aerosol jet printing of Ag ink with a commercial print head mounted on a custom, 6-axis positioning gantry to form wire bond replacements, part identification and individualized markings. Resultant parts are tested for electrical functionality and cross sections are compared to in-progress build photos and line measurements to study the effect of the new printing method vs. structures produced with standard conductor printing processes.