Low-loss Coupling Research Articles

Miniaturized thin-film filters to connect multiple self-written waveguides

Self-written waveguides (SWWs) have been well investigated within the last decades. In most cases, they are used as low-loss coupling structures, i.e., to connect buried optical structures in photonic integrated circuits. In this work, we extend the field of possible applications for SWWs by embedding a novel thin-film filter to split the beam and connect multiple output ports simultaneously. The multilayer design of the dielectric filter can be customized to enable its application as a dichroic beamsplitter for photonic networks. The embedded thin-film filter was characterized in detail and used to connect an additional optical sensing element, which is also based on SWWs, to demonstrate its usability for measurement of physical quantities.

High-Efficiency and Compact Polarization-Insensitive Multi-Segment Linear Silicon Nitride Edge Coupler

Edge couplers are widely utilized in photonic integrated circuits and are vital for ensuring efficient chip-to-fiber coupling. In this paper, we present a high-efficiency and compact polarization-insensitive multi-segment linear silicon nitride edge coupler for coupling to high numerical aperture fibers. By optimizing the thickness of the up cladding and introducing air slots in the transverse direction, we have further modified the limiting effect of the mode field. This innovative edge coupler scheme boasts a compact structure and is compatible with existing mature standard processes, with a total length of only 38 μm. We numerically demonstrate that the proposed edge coupler exhibits a low coupling loss of 0.22 dB/0.31 dB for TE/TM modes at λ = 1550 nm. Furthermore, the proposed coupler displays high wavelength insensitivity within the range of 1400–1850 nm and maintains a coupling loss of less than 0.2 dB with a manufacturing deviation of ±20 nm.

Gap design to enable functionalities into nested antiresonant nodeless fiber based systems.

By modifying the interconnection design between standard single-mode fiber (SSMF) and nested antiresonant nodeless type hollow-core fiber (NANF), we create an air gap between SSMF and NANF. This air gap enables the insertion of optical elements, thus providing additional functions. We show low-loss coupling using various graded-index multimode fibers acting as mode-field adapters resulting in different air-gap distances. Finally, we test the gap functionality by inserting a thin glass sheet in the air gap, which forms a Fabry-Perot interferometer and works as a filter with an overall insertion loss of only 0.31 dB.

1310 nm TM grating couplers to operate silicon nitride ring resonator biosensors

Photonic integrated circuits (PICs) fabricated on silicon nitride (SiN) wafers are witnessing a massive implementation because they can provide low-loss waveguides in a broad wavelength range (from the visible to the near infrared) whilst being fabricated in large volumes using standard silicon fabrication processes. One of the most relevant application fields of this technology is biosensing since SiN PICs enable label-free lab-on-a-chip systems for fast and sensitive detection of minute amounts of different biological entities. To this end, resonant structures such as ring resonators (RR) are highly appropriate, but they need suitable interfaces with optical fiber to be tested on-wafer and used in real applications. The interface that satisfies the two previous requirements is the grating coupler (GC). However, experimental evidence of GCs operating at 1310 nm wavelengths for the transverse magnetic (TM) mode, for which RR-based sensors perform better than for the widely employed transverse electric (TE) mode, has not been reported so far. In this work, the operation of fully-etched focusing GCs at 1310 nm wavelengths for the TM mode in a SiN PIC is demonstrated. Experiments show that the fabricated GCs display an ≈40 nm bandwidth and coupling losses around 13 dB per interface. In addition, we show successful biosensing experiments using bovine serum albumin and anti-bovine serum albumin as biological agents in a microfluidic environment. Further engineering for the interface should lead to lower coupling losses, which would pave the way to practical applications of SiN PICs based on RRs operated for the TM mode and at 1310 nm wavelengths.

Free‐Form Micro‐Optics Enabling Ultra‐Broadband Low‐Loss Off‐Chip Coupling

AbstractEfficient fiber‐to‐chip coupling has been a major hurdle to cost‐effective packaging and scalable interconnections of photonic integrated circuits. Conventional photonic packaging methods relying on edge or grating coupling are constrained by high insertion losses, limited bandwidth density, narrow band operation, and sensitivity to misalignment. This work presents a new fiber‐to‐chip coupling scheme based on free‐form reflective micro‐optics. A design approach which simplifies the high‐dimensional free‐form optimization problem to as few as two full‐wave simulations is implemented to empower computationally efficient design of high‐performance free‐form reflectors while capitalizing on the expanded geometric degrees of freedom. This work demonstrates fiber array coupling to waveguides taped out through a standard foundry shuttle run and backend integrated with 3‐D printed micro‐optics. A low coupling loss down to 0.5 dB is experimentally measured at 1550 nm wavelength with a record 1‐dB bandwidth of 300 nm spanning O to U bands. The coupling scheme further affords large alignment tolerance, high bandwidth density, and solder reflow compatibility, qualifying it as a promising optical packaging solution for applications such as wavelength division multiplexing communications, broadband spectroscopic sensing, and nonlinear optical signal processing.

A Theoretical Sub-0.1 dB Loss Single Mode Fiber-To-Chip Edge Coupler for Silicon Nitride Waveguides

A low loss optical interconnection between optical fibers and photonic integrated circuits is critical for high performance photonic systems. In the past decade, spot size converters, subwavelength waveguide grating (SWG) structures, and different refractive index materials have been applied to allow efficient coupling between the fiber and the photonic chips. However, it is still challenging to achieve low-loss coupling when interfacing high index contrast waveguides such as SiN with SMF-28 fibers. In this work, we report a multilayer edge-coupler using SiOxN materials with different indices to allow for efficient edge coupling between SMF-28 fiber and SiN single mode waveguides. A coupling loss of 0.068 dB for the TM mode was achieved theoretically at a 1550 nm wavelength, with a 1 dB alignment tolerance offset of 2.4 μm.

Planar fiber-chip-coupling using angle-polished polarization maintaining fibers

We report on our latest developments of a planar fiber-chip-coupling scheme, using angle polished, polarization maintaining (PM) fibers. Most integrated photonic chip components are polarization sensitive and a suitable way to launch several wavelength channels with the same polarization to the chip is the use of PM fibers. Those impose several challenges at processing and handling to achieve a stable, permanent, and low-loss coupling. We present the processing of the fibers in detail and experimental results for our planar and compact fiber-chip-coupling technique.

3D-printed facet-attached optical elements for connecting VCSEL and photodiodes to fiber arrays and multi-core fibers.

Multicore optical fibers and ribbons based on fiber arrays allow for massively parallel transmission of signals via spatially separated channels, thereby offering attractive bandwidth scaling with linearly increasing technical effort. However, low-loss coupling of light between fiber arrays or multicore fibers and standard linear arrays of vertical-cavity surface-emitting lasers (VCSEL) or photodiodes (PD) still represents a challenge. In this paper, we demonstrate that 3D-printed facet-attached microlenses (FaML) offer an attractive path for connecting multimode fiber arrays as well as individual cores of multimode multicore fibers to standard arrays of VCSEL or PD. The freeform coupling elements are printed in situ with high precision on the device and fiber facets by high-resolution multi-photon lithography. We demonstrate coupling losses down to 0.35 dB along with lateral 1 dB alignment tolerances in excess of 10 μm, allowing to leverage fast passive assembly techniques that rely on industry-standard machine vision. To the best of our knowledge, our experiments represent the first demonstration of a coupling interface that connects individual cores of a multicore fiber to VCSEL or PD arranged in a standard linear array without the need for additional fiber-based or waveguide-based fan-out structures. Using this approach, we build a 3 × 25 Gbit/s transceiver assembly which fits into a small form-factor pluggable module and which fulfills many performance metrics specified in the IEEE 802.3 standard.

Efficient and scalable edge coupler based on silica planar lightwave circuits and lithium niobate thin films

Recently, lithium niobate on insulator (LNOI) has emerged as a promising photonic integration platform for optical communication due to its outstanding material properties. However, an optical coupler that features high-efficiency is essential to improve the practicability of LN devices. In this work, we proposed a high coupling efficiency and scalable edge coupler, which consists of silica-based planar lightwave circuit (PLC) and LN bilayer taper. The silica-based PLC is positioned on the bottom of LN bilayer taper, which serves as the optical interface connecting the LNOI waveguide to the fiber. The silica-based PLC is interfaced to optical fibers through butt-coupling. Then, LN bilayer taper transfers the light form silica PLC to LN ridge waveguide through adiabatic coupling and converts it gradually into the fundamental mode. When coupled to an ultra-high numerical aperture fiber (UHNA), the simulation results show a low coupling loss of 0.11 dB and 0.128 dB per facet for TE and TM mode, respectively. The scalability of the coupler for large numbers of channels has been proven, which meets the performance requirements of LN devices employed in high-bandwidth, multi-channel systems. These results open a path for lithium niobate photonic integration circuit (PIC) and low-cost optical packaging.

The Design, Fabrication and Characterization of Grating Couplers for SiGe Photonic Integration Employing a Reflective Back Mirror.

We propose and demonstrate an efficient grating coupler for integrated SiGe photonic devices. A bottom metal layer is adopted to enhance the coupling efficiency on the wafer backside. A low coupling loss of -1.34 dB and -0.79 dB can be theoretically obtained with optimal parameters for uniform and apodized grating couplers, respectively. The fabrication process is CMOS compatible without need of wafer bonding. The influence of fabrication errors on the coupling efficiency is analyzed in terms of substrate thickness, grating dimension and material refractive index. The results indicate a large tolerance for the deviations in practical fabrication. The measured coupling loss of the uniform grating is -2.7 dB at approximately 1465 nm with a 3 dB bandwidth of more than 40 nm. The proposed grating coupler provides a promising approach to realize efficient chip-fiber coupling for the SiGe photonic integration.

Wafer-Scale Fabrication of Silicon Film on Lithium Niobate on Insulator (LNOI)

Hybrid integration of silicon photonics with lithium niobate (LN) devices provides a promising route to enable an excellent modulation performance in silicon photonic integrated circuits. To realize this purpose, a substrate containing a Si film on an LNOI substrate, called Si on the LNOI structure, was analyzed and fabricated. The mode propagation properties in the Si-on-LNOI structure were simulated in detail and a vertical adiabatic coupler (VAC) between the Si waveguide and LN waveguide was simulated to help in the determination of the dimension of this structure. A 4-inch wafer-scale Si on an LNOI hybrid structure was fabricated through the ion-cut process. This structure has a single-crystalline quality, high thickness uniformity, smooth surface, and sharp bonding interface, which are practical for realizing low loss and high coupling efficiency.

Low loss and broadband low back-reflection interconnection between a hollow-core and standard single-mode fiber.

We report simultaneous low coupling loss (below 0.2 dB at 1550 nm) and low back-reflection (below -60 dB in the 1200-1600 nm range) between a hollow core fiber and standard single mode optical fiber obtained through the combination of an angled interface and an anti-reflective coating. We perform experimental optimization of the interface angle to achieve the best combination of performance in terms of the coupling loss and back-reflection suppression. Furthermore, we examine parasitic cross-coupling to the higher-order modes and show that it does not degrade compared to the case of a flat interface, keeping it below -30 dB and below -20 dB for LP11 and LP02 modes, respectively.

High-current-density Rutherford MgB2 cable sheathed by CuNi30 alloy

A Rutherford-type MgB2 cable has been fabricated from 12 six-core strands prepared by an internal magnesium diffusion (IMD) process with a resistive CuNi30 outer sheath. The uniformity of individual strands of diameter 0.448 mm prior to and after additional densification by rolling was studied by x-ray micro-tomography. The engineering current densities of the cable samples were measured at 4.2 K and external magnetic fields between 4.0 T and 8.0 T and compared with available published data. The presented Rutherford cable has the highest engineering current density with J e = 104 A cm2 measured in an external magnetic field of 5.73 T. The bending tolerance of the cable shows a critical diameter of 60 mm and less gradual critical current degradation in comparison to similar cables fabricated from single-core strands. The AC loss measurements of the present cable show lower coupling losses in comparison to monolithic multicore IMD conductors. The obtained results are promising for high-current-density and low-AC-loss MgB2 superconducting cables that are suitable especially for motors and generators.

Multimode Strong Coupling in Cavity Optomechanics

Optomechanical systems show great potential as quantum transducers and information storage devices for use in future hybrid quantum networks. In this context, optomechanical strong coupling can enable efficient, high-bandwidth, and deterministic transfer of quantum states. While optomechanical strong coupling has been realized at optical frequencies, it has proven difficult to identify a robust optomechanical system that features the low loss and high coupling rates required for more sophisticated control of mechanical motion. In this paper, we demonstrate strong coupling in a Brillouin-based bulk cavity optomechanical system in both the single-mode and the multimode strong-coupling regime, which leads to a useful device both for applications in quantum information and for investigating decoherence phenomena in bulk acoustic wave resonators. Using nontrivial mode hybridizations in the strong-coupling regime, we create hybridized photonic-phononic modes with lifetimes that are significantly longer than those of the uncoupled system. This surprising lifetime enhancement, which results from the interference of decay channels, showcases the use of multimode strong coupling as a general strategy to control extrinsic decoherence mechanisms. Moreover, phonons supported by such bulk-acoustic-wave resonators have a collection of properties, including high frequencies, long coherence times, and robustness against thermal decoherence, that make this optomechanical system particularly enticing for applications such as quantum transduction and memories. Hence, this system provides access to phenomena in a previously unexplored regime of optomechanical interactions and could serve as an important building block for future quantum devices.

Spacing-Tailored Multicore Fiber Interface for Efficient FIFO Devices

Multicore fibers (MCFs) have attracted intense attention to overcome the capacity limit of single-core optical fiber communication system. However, as indispensable connection devices between the MCF and the individual single mode fiber (SMF), fan-in and fan-out (FIFO) devices are challenging to achieve overall performance in terms of coupling efficiency, crosstalk, return loss, and device compactness. Here we develop an MCF reverse-tapering technique to increase the core-to-core spacing of the MCF and construct a spacing-tailored interface between the MCF and the normal SMF bundle. The fabricated FIFO device for the small-core MCF with narrow core-to-core spacing of 35 μm features a low average coupling loss (∼0.6 dB), extraordinarily low crosstalk (<−65 dB) and a return loss (<−60 dB) without using any bridge elements, where the remarkably low crosstalk is about 20 dB lower than using special bridge fibers for the same type of MCF. The flexibility of reverse tapering of MCFs can overcome its intrinsic integration challenge and provide a powerful approach to constructing all-fiber FIFO devices with compact construction and excellent overall performance.

High-Performance Grating Coupler Array on Silicon for a Perfectly-Vertically Mounted Multicore Fiber

High performance grating coupler array for coupling of a silicon photonic chip to a multi-core fiber mounted perfectly vertical to the chip surface is proposed and demonstrated. Experimental results show a low coupling loss of −0.8 dB with 1-dB bandwidth of 47 nm, a low back reflection of <−15.8 dB in about 40 nm wavelength range, a channel non-uniformity of 0.9 dB, and crosstalk of <−40 dB. These improved results attribute to the design of embedding the diffractive grating in a one-port cavity formed by partially and perfectly reflecting Bragg gratings on the silicon chip and a metal mirror on the chip surface.

Optical time domain backscattering of antiresonant hollow core fibers.

Today's lowest-loss hollow core fibers are based on antiresonance guidance. They have been shown both theoretically and experimentally to have very low levels of backscattering arising from the fiber structure - 45 dB below that of traditional optical fibers with a solid silica glass core. This makes their longitudinal characterization using conventional reflectometric techniques very challenging. However, it was recently estimated that when filled with air, their backscattering coefficient increases to about 30 dB below that of standard solid core fibers. This level should be measurable with commercially available high performance optical time domain reflectometers (OTDR). Here we demonstrate - for the first time to the best of our knowledge - the measurement of backscattering from the air inside a hollow core fiber. We show that the characterization of multi-km long hollow core fibers with 15 m spatial resolution is possible using a commercial OTDR instrument. To benefit from its full dynamic range, we strongly suppress the 4% back-reflections that ordinarily occur at the OTDR's standard fiber output when directly-connected to a hollow core fiber. Furthermore, low coupling loss into the hollow core fiber (0.3 dB in our experiment) also helps to maximize the achievable OTDR signal-to-noise ratio. This approach enables distributed characterization and fault-finding in low-loss hollow core fibers, a topic of increasing importance as these fibers are now starting to be installed in commercial optical communication networks.

On-chip beam rotators, adiabatic mode converters, and waveplates through low-loss waveguides with variable cross-sections

Photonics integrated circuitry would benefit considerably from the ability to arbitrarily control waveguide cross-sections with high precision and low loss, in order to provide more degrees of freedom in manipulating propagating light. Here, we report a new method for femtosecond laser writing of optical-fiber-compatible glass waveguides, namely spherical phase-induced multicore waveguide (SPIM-WG), which addresses this challenging task with three-dimensional on-chip light control. Fabricating in the heating regime with high scanning speed, precise deformation of cross-sections is still achievable along the waveguide, with shapes and sizes finely controllable of high resolution in both horizontal and vertical transversal directions. We observed that these waveguides have high refractive index contrast of 0.017, low propagation loss of 0.14 dB/cm, and very low coupling loss of 0.19 dB coupled from a single-mode fiber. SPIM-WG devices were easily fabricated that were able to perform on-chip beam rotation through varying angles, or manipulate the polarization state of propagating light for target wavelengths. We also demonstrated SPIM-WG mode converters that provide arbitrary adiabatic mode conversion with high efficiency between symmetric and asymmetric nonuniform modes; examples include circular, elliptical modes, and asymmetric modes from ppKTP (periodically poled potassium titanyl phosphate) waveguides which are generally applied in frequency conversion and quantum light sources. Created inside optical glass, these waveguides and devices have the capability to operate across ultra-broad bands from visible to infrared wavelengths. The compatibility with optical fiber also paves the way toward packaged photonic integrated circuitry, which usually needs input and output fiber connections.

Hybrid silicon photonics DBR laser based on flip-chip integration of GaSb amplifiers and µm-scale SOI waveguides.

The development of integrated photonics experiences an unprecedented growth dynamic, owing to accelerated penetration to new applications. This leads to new requirements in terms of functionality, with the most obvious feature being the increased need for wavelength versatility. To this end, we demonstrate for the first time the flip-chip integration of a GaSb semiconductor optical amplifier with a silicon photonic circuit, addressing the transition of photonic integration technology towards mid-IR wavelengths. In particular, an on-chip hybrid DBR laser emitting in the 2 µm region with an output power of 6 mW at room temperature is demonstrated. Wavelength locking was achieved employing a grating realized using 3 µm thick silicon-on-insulator (SOI) technology. The SOI waveguides exhibit strong mode confinement and low losses, as well as excellent mode matching with GaSb optoelectronic chips ensuring low loss coupling. These narrow line-width laser diodes with an on-chip extended cavity can generate a continuous-wave output power of more than 1 mW even when operated at an elevated temperature of 45°C. The demonstration opens an attractive perspective for the on-chip silicon photonics integration of GaSb gain chips, enabling the development of PICs in a broad spectral range extending from 1.8 µm to beyond 3 µm.

Densely packed 1.1 μm band vertical cavity surface emitting laser array for co-packaged optics

We demonstrated the 1.1 μm band 16-channel vertical cavity surface emitting laser (VCSEL) array for multi-core fiber (MCF) transmission towards co-packaged optics. Single-mode 16-ch top and bottom emitting VCSEL arrays were fabricated by either 3 inch or 6 inch wafer foundry process. The thermal crosstalk is estimated by wavelength shift. When the distance between adjacent VCSELs is 40 μm, the total thermal crosstalk is as low as 7 K. Bottom emitting metal-aperture VCSEL array were also fabricated via a full 3 inch wafer process. It shows low resistance and good single mode characteristic with an oxidation aperture of 7 μm thanks to an intra-cavity metal aperture. A large mode field diameter of 6 μm enables low coupling loss between bottom VCSEL array and MCF through a GaAs substrate for a flip-chip bonding process.