Low-cost Consumer Electronics Research Articles

Three-Axis Interferometric Fiber Optic Gyroscope With Silica Integrated Coupler Chip

Chip-scale interferometric fiber optic gyroscope (IFOG) has caught growing attention for its huge application potential in the low-cost consumer electronics market. In this paper, a novel three-axis IFOG is proposed and assembled with an integrated coupler chip (ICC) fabricated on the silica platform. The ICC realizes bidirectionally multichannel optical interconnection without waveguide crossings. The test results indicate the weak wavelength dependence and comparatively low insertion loss at 0.85μm of the ICC. With ~900m polarization-maintaining fiber coils, the three-axis IFOG exhibits a long-term stability of <0.16 °/h, which satisfies the requirements of the tactical grade systems. The novel IFOG scheme with ICC paves the way for the research on chip-scale multi-axis IFOGs.

An ultra-compact particle size analyser using a CMOS image sensor and machine learning

Light scattering is a fundamental property that can be exploited to create essential devices such as particle analysers. The most common particle size analyser relies on measuring the angle-dependent diffracted light from a sample illuminated by a laser beam. Compared to other non-light-based counterparts, such a laser diffraction scheme offers precision, but it does so at the expense of size, complexity and cost. In this paper, we introduce the concept of a new particle size analyser in a collimated beam configuration using a consumer electronic camera and machine learning. The key novelty is a small form factor angular spatial filter that allows for the collection of light scattered by the particles up to predefined discrete angles. The filter is combined with a light-emitting diode and a complementary metal-oxide-semiconductor image sensor array to acquire angularly resolved scattering images. From these images, a machine learning model predicts the volume median diameter of the particles. To validate the proposed device, glass beads with diameters ranging from 13 to 125 µm were measured in suspension at several concentrations. We were able to correct for multiple scattering effects and predict the particle size with mean absolute percentage errors of 5.09% and 2.5% for the cases without and with concentration as an input parameter, respectively. When only spherical particles were analysed, the former error was significantly reduced (0.72%). Given that it is compact (on the order of ten cm) and built with low-cost consumer electronics, the newly designed particle size analyser has significant potential for use outside a standard laboratory, for example, in online and in-line industrial process monitoring.

Customizable embedded processor array for multimedia applications

We are proposing a Customizable Embedded Processor Array for Multimedia Applications (CPAMA). This architecture can be used as a standalone image/video processing chip in consumer electronics. Its building blocks are all designed to achieve low power and low area, thus it is a good candidate for low cost consumer electronics. Our contribution is, designing a configurable embedded multimedia processor array considering the nature of image/video processing applications. This approach is considered in all the basic blocks of the architecture. Because of its configurable architecture and ability to connect with other devices, it may be used in a large domain of applications. Our architecture is purely implemented with VHDL. It is not dependent on any technology or design software. We have implemented our architecture for different applications on a Xilinx Virtex-5 device and as a number of Application Specific Integrated Circuits (ASIC) by using 90nm CMOS technology. Experimental case studies show that CPAMA has better or comparable results to the existing similar architectures in terms of performance and energy consumption. Our studies show that throughput of CPAMA is 0.3x–2.4x times better than ADRES. Energy consumption of CPAMA is 31–50% less than ADRES. On the other hand, in one configuration of IDCT application, CPAMA provides 56% less throughput and consumes 55% more energy than ADRES.

LED Backlight Adjustment for Backward-Compatible Stereoscopic Display

It was recently shown that a high-speed optoelectronic display, via a novel signal processing technique called temporal psychovisual modulation (TPVM), can exhibit stereoscopic images to viewers wearing 3-D glasses and clean 2-D images to those without glasses all at the same time. This research aims to improve the above backward-compatible stereoscopy method by adjusting the backlight of today's common LED-lit liquid crystal display systems. Visual quality of the system can be enhanced by jointly optimizing the backlight intensity and the image signal at a negligible extra computational cost. For real-time applications of low-cost consumer electronics, this work also provides a low-complexity solution of backward-compatible stereoscopic display, in which highest 3-D quality is ensured with a small compromise of the 2-D quality.

Acceptance of the wireless microphone as a hearing aid accessory for adults

SUMMARY We are on the cusp of a wireless revolu-tion. When the technology meets theexpectation, we will have reached a tippingpoint and change will occur quickly. Thecombination of generation effects, systemicchanges, component miniaturization, anddevelopments in low-cost consumer elec-tronics will all contribute to furtheringadult acceptance of the wireless micro-phone as a hearing aid accessory. As discussed in this ar ticle, the primar ysub-goals to be met in order to improveACCESS to sound via wireless micro-phones include: ❖ Awareness by hearing aid users, the dis-pensing community, and the public atlarge that this technology exists and ishighly effective ❖ Candidacy requirements that are clearlyestablished ❖ Cost reduction ❖ Ease of use in both private applicationsand public places ❖ Smart design to improve cosmetics,reduce intrusiveness, and simplify oper-ation ❖ Support and counseling before, dur-ing, and after the fitting/purchase. David Fabry , PhD, was formerly Vice-President of Professional Relations and Education at Phonak HearingSystems,Warrenville,IL.Drs

Chip-package codesign for high-frequency circuits and systems

When the need for high frequency combines with the demand for low-cost consumer electronics, the challenge of ensuring correctly functioning components becomes paramount. Focusing on chip-package codesign offers a solution.

State-of-the-art multichip modules for avionics

The emerging multichip packaging technology offers significant advantages in miniaturization, electrical performance, thermal performance, lower cost, and improved reliability. Newly available materials and processes have stimulated multichip applications ranging from low cost consumer electronics and automotive modules to advanced aerospace and supercomputers. Avionics multichip modules share the same systems integration issues as other applications: optimum partitioning, seamless CAD/CIM tools, testability and repairability strategies, cost-effective manufacturing, availability of vendor support technologies, and reliable packaging for long life in environmental stresses. State-of-the-art avionics multichip modules are detailed. Industry developments required to enable wider utilization are discussed. Evolutionary extensions into next generation technologies are discussed. >