Abstract
The emerging multichip packaging technology offers significant advantages in miniaturization, electrical performance, thermal performance, lower cost, and improved reliability. Newly available materials and processes have stimulated multichip applications ranging from low cost consumer electronics and automotive modules to advanced aerospace and supercomputers. Avionics multichip modules share the same systems integration issues as other applications: optimum partitioning, seamless CAD/CIM tools, testability and repairability strategies, cost-effective manufacturing, availability of vendor support technologies, and reliable packaging for long life in environmental stresses. State-of-the-art avionics multichip modules are detailed. Industry developments required to enable wider utilization are discussed. Evolutionary extensions into next generation technologies are discussed. >
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