Low temperature solder (LTS) dopped with low melting temperature metals on basis of the commonly used Sn category solder, has generated a low eutectic point and dropped its peak reflow temperature to the range of 130 °C to 200 °C. This lower operating temperature peculiarity has already made LTS shined in many next-generation markets, such as high warpage caused by larger package size, heterogeneous integrated packages with more complicated stack-ups, temperature sensitive photonics packages and so on. Among all the newly-developing LTS systems in microelectronic packaging, Sn-Bi alloys obtains the most widely application, because the melting point is lower than Sn-Ag-Cu (SAC) systems but higher than its In-type competitors, which harmoniously balanced the manufacturability and thermomechanical properties to acquired high performance devices. In this paper, two types of low temperature solder balls (Sn-Bi-Ag/Sn-Bi-Cu-Ni) were selected to study the microstructure and reliability on the most common Cu pad and Au pad. The test vehicle was designed as a large size chip to chip (C2C) structure, in order to observe the soldering behavior on large size packages, but extremely suppressed the interference of package warpage. Then the investigation can be focused on the intermetallic compounds (IMC) formation at different solder/pad interfaces during both the flip chip process and the TC/HTSL reliability tests. Through evaluating the corresponding microstructures, it further revealed the essential conditions how LTS can achieve high-reliable solder joints.
Read full abstract