This study investigates the wetting characteristics, interface microstructure evolution of equiatomic GaInSnBiZn HEA on Cu under high vacuum with sessile drop method to extend its electronic packaging applications. Optimal conditions involve a 350 °C temperature maintained for ∼20 min to prevent Bi loss, resulting in a contact angle inversely proportional to temperature and reaching a minimum of ∼15.6°. A dual-layer of Cu9Ga4 and CuGa2 forms at the HEA/Cu interface, consistent with thermodynamic predictions, featuring lower activation energy and growth driven by bulk alloy diffusion. Base on the interface microstructures, Cu9Ga4 and CuGa2 act as diffusion barriers, restricting the movement of other elements while promoting the accumulation of Zn at the interface. The wetting mechanism may be determined by the oxide (Cu2O) removal reaction (i.e., reaction between Ga and Cu2O).
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