Gold electroplating, now over two centuries old(1), remains a mainstay of the electronic industry, where the good electrical and mechanical properties of hard gold in particular make for excellent contacts. Electrodeposited gold is hardened by the incorporation of minute amounts of inclusions, both metallic and non-metallic, which affect the microstructure of the growing film as well as its final surface(2). As previously demonstrated(3), the main contributor to hardening is the inclusions’ effect on decreasing grain size. In addition to the metal inclusions, carbon-containing by-products of the electroplating bath, particularly AuCN and CN-complexed cobalt have been found, affecting both hardness and wear resistance(4). In our work, we aim to better understand the inclusion mechanism in cobalt-hardened gold in particular, and by extension that of other additions such as nickel, and the resulting microstructure and properties. We will electrodeposit gold with systematically varying bath compositions under several deposition conditions, while measuring the nucleation rate using Tafel plots, and characterize the resulting films in terms of microstructure, hardness and wear resistance. The effect of thermal aging on the inclusion profile will be studied by Auger electron spectroscopy. Sandia National Laboratories is a multi-program laboratory managed and operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Corporation, for the U.S. Department of Energy’s National Nuclear Security Administration under contract DE-AC04-94AL85000. 1. Kohl PA. Electrodeposition of gold. In: Schlesinger M, Paunovic M, editors. Modern Electroplating, Fifth Edition. New York, NY, USA: Wiley; 2000. p. 201-25. 2. Okinaka Y. Significance of inclusions in electroplated gold films for electronics applications. Gold bulletin. 2000;33(4):117-27. 3. Lo CC, Augis JA, Pinnel MR. Hardening mechanisms of hard gold. Journal of Applied Physics. 1979;50(11):6887-91. 4. DeDonker R, Vanhumbeeck J. Cobalt in gold electrodeposits. Transactions of the Institute of Metal Finishing. 1985;63:59.
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