The technology for fabrication of submicron bulk platelet transducers has been developed. Lithium niobate (LiNbO3) transducers with thicknesses as low as 0.25 μm have been achieved. This technology employs a novel bonding technique, the room-temperature vacuum bond, and a carefully controlled process of ion-beam milling. Bulk wave acoustic delay lines consisting of LiNbO3 transducers on spinel (MgAl2O4) substrate have yielded very wide-band and low-loss operation in S-, C-, and X-band frequencies.