A third generation industrial high current ion implanter, Series III, has been produced for the uniform implantation of milliampere-beams with total acceleration voltages up to 200 kV. Magnetic analysis of the beam with initial acceleration voltages variable up to 40 kV is carried out in the accelerator terminal followed by post-acceleration across a single gap up to a maximum total acceleration voltage of 200 kV into a grounded processor chamber. The ion source is a Freeman type capable of delivering milliampere beams of most elements. The source feed materials for the three main ion species required by the semiconductor industry, i.e. B, P and As, can all be pumped by surfaces with temperatures down to liquid nitrogen temperature. Consequently large liquid nitrogen cryopump/traps are used as the primary pumping system with diffusion pumps having a secondary role for non-cryopumpable gases. Three stages of differential pumping are provided in the accelerator together with a 12″ pumping system for the processor. The large processor takes a maximum load of 108 2″ silicon wafers or 54 3″ silicon wafers. Mechanical scanning is used because of the need to maintain space charge neutralisation in the beam which rules out electrostatic scanning and also because of the need to distribute the heat dissipation over a large number of wafers in order to prevent an excessive temperature rise in the wafers during high dose implants (>10 15 ions/ cm 2). The carousel which carries the wafers is shaped so that the wafers pass through the beam in a straight line and at a constant speed. A stepper motor driven vane unit in the terminal controls the ion beam current. In order to achieve high implantation uniformities the processor dose control system controls the ratio ion current/carousel speed and therefore any small non-uniformities in the carousel rotation speed can be compensated by the vane unit. The various functions in the terminal are controlled from ground potential using fibre optics. The system is highly automated and unskilled operators can be used.
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