A 6T SRAM design at a sub-10-nm node calls for carefully designed transistors so that new leakage mechanisms, such as direct source-to-drain tunneling (DSDT) and short channel effects that lead to $I_{\mathrm{\scriptscriptstyle ON}}/I_{\mathrm{\scriptscriptstyle OFF}}$ degradation, are kept under control. In this paper, we explore asymmetric underlap for mitigating DSDT, thermionic leakage, and for improving $I_{\mathrm{\scriptscriptstyle ON}}/I_{\mathrm{\scriptscriptstyle OFF}}$ of double-gate FinFETs. We demonstrate that for 6T SRAMs, asymmetric underlapped n-FinFETs are superior to symmetric underlap/overlap in improving access time and leakage power. We model the atomistic nature of sub-10-nm FinFET channels, quantum confinement, subband nonparabolicity, and anisotropy latent at such length scales using quantum physics-based simulators instead of the conventional semiclassical, drift-diffusion-based Technology Computer Aided Design tools. Using a device/circuit/system-level codesign approach consisting of NEMO5 quantum mechanical device simulations, HSPICE circuit simulations of a 6T SRAM bit cell, and a system-level analysis of a 8-kB L1 and 4-MB L2 cache, we show that the adoption of optimized asymmetric underlapped n-FinFETs can offer up to 6.5% improvement in L1 cache access times and a 2.3-mW reduction in L2 cache leakage power, while delivering noise margins close to symmetric underlapped n-FinFET-based caches.