Lateral Diode Research Articles

Optimizing Forward Drop and Reverse Leakage Trade‐Off in AlGaN/GaN Lateral Diode with Schottky‐Metal‐Insulator‐Semiconductor Cascode Anode

Herein, AlGaN/GaN lateral diode with the Schottky‐Metal‐Insulator‐Semiconductor (MIS) cascode anode (CALD) to optimize forward voltage drop (VF) and reverse leakage current (ILEAK) trade‐off is proposed. In the CALD device, a normally‐on Ni/HfO2/AlGaN MIS‐controlled channel as well as a lateral Ni/GaN Schottky contact are cascoded at the anode. The designed normally‐on MIS‐controlled channel has high electron concentration at forward bias and prevents high electric‐field at reverse bias, which ensure both low VF and low ILEAK. Meanwhile, the Ni/GaN Schottky contact with a high Schottky barrier height further suppresses the ILEAK. As a result, the fabricated CALD demonstrates an optimized VF–ILEAK trade‐off relationship, including a low VF of 1.6 V and a low ILEAK of 5.2 × 10−8 A mm−1 (at reverse voltage of 400 V), together with a high breakdown voltage (BV) >700 V. These high performances suggest that the CALD can be a promising candidate for GaN power diode applications requiring a better VF–ILEAK trade‐off.

High Single-Event Burnout Resistance 1.2 kV 4H-SiC Schottky Barrier Diode

A 1.2 kV lateral RESURF Schottky diode (TZ-SBD) have been designed from SZ-SBD that can recover from a single-event effect (SEE) in which a heavy ion traverses the device at a linear energy transfer (LET) of 60 MeV·cm²/mg, ESA’s standard. Compared to SZ-SBD, TZ-SBD has an additional split in the N-drift region which is usually used to improve the electric field distribution so its breakdown voltage is improved by 9%. During the single events simulations, the maximum temperature is 919 K with reverse voltage (VR) = 1200 V and LET = 60 MeV·cm²/mg, which is much lower then the SiC melting temperature (3100 K) and the chemically unstable temperature of SiC in the presence of metal (1073 K).

Lateral 1200V SiC schottky barrier diode with single event burnout tolerance

For a power device to be used in space, it must be able to recover from a single event effect caused by heavy ion radiation. Conventional vertical silicon carbide (SiC) power devices such as automotive diodes and MOSFETs, can only meet this requirement if they are heavily derated, a 1200 V device typically unusable above 200 V. In this paper, a lateral RESURF Schottky diode has been designed in TCAD simulation using a radiation-hard (rad-hard) by design methodology. By preventing anode-to-cathode shorting that occurs in a vertical drift region, the lateral design is shown to recover after a heavy ion traverses the device with a linear energy transfer (LET) of 60 MeV·cm2/mg, while the device is blocking 1200 V. The design splits the drift region into a higher doping zone closer to the cathode (Zone 2) of 1.5×1017 cm−3 and a lower doping zone closer to the anode (Zone 1) of 1×1016 cm−3. The electric field spikes were reduced while the device was recovering. This design keeps the local temperature in the device to under 1000 K if the heavy ion penetrates the device in a direction perpendicular to the surface. Other entry positions and directions are also simulated and a maximum temperature of 1733 K occurs when the ion path is horizontal, entering at 1 μm below the surface. However, this temperature peak occurs at the cathode, which is not expected to lead to lasting leakage damage. A deep P+ pillar embedded into the anode acts as a collector for holes generated during the single event. Simulations show that a deeper P+ pillar, to a depth of up to 5 μm, reduces the hole density in the N-drift region and P-epi layer during recovery. This also allows the Zone 1 doping to be increased to as much as 5×1016 cm−3, thereby reducing on-state losses.

Over 600 V Lateral AlN-on-AlN Schottky Barrier Diodes with Ultra-Low Ideality Factor

This letter reports the demonstration of lateral AlN Schottky barrier diodes (SBDs) on single-crystal AlN substrates by metalorganic CVD (MOCVD) with an ultra-low ideality factor (η) of 1.65, a high Schottky barrier height of 1.94 eV, a breakdown voltage (BV) of 640 V, and a record high normalized BV by the anode-to-cathode distance. The device current was dominated by thermionic emission, while most previously reported AlN SBDs suffered from defect-induced current with higher η (>4). This work represents a significant step towards high-performance ultra-wide bandgap AlN-based high-voltage and high-power devices.

Quantum Graphene Asymmetric Devices for Harvesting Electromagnetic Energy.

We present here the fabrication at the wafer level and the electrical performance of two types of graphene diodes: ballistic trapezoidal-shaped graphene diodes and lateral tunneling graphene diodes. In the case of the ballistic trapezoidal-shaped graphene diode, we observe a large DC current of 200 µA at a DC bias voltage of ±2 V and a large voltage responsivity of 2000 v/w, while in the case of the lateral tunneling graphene diodes, we obtain a DC current of 1.5 mA at a DC bias voltage of ±2 V, with a voltage responsivity of 3000 v/w. An extended analysis of the defects produced during the fabrication process and their influences on the graphene diode performance is also presented.

Electrical manipulation of telecom color centers in silicon

Silicon color centers have recently emerged as promising candidates for commercial quantum technology, yet their interaction with electric fields has yet to be investigated. In this paper, we demonstrate electrical manipulation of telecom silicon color centers by implementing novel lateral electrical diodes with an integrated G center ensemble in a commercial silicon on insulator wafer. The ensemble optical response is characterized under application of a reverse-biased DC electric field, observing both 100% modulation of fluorescence signal, and wavelength redshift of approximately 1.24 ± 0.08 GHz/V above a threshold voltage. Finally, we use G center fluorescence to directly image the electric field distribution within the devices, obtaining insight into the spatial and voltage-dependent variation of the junction depletion region and the associated mediating effects on the ensemble. Strong correlation between emitter-field coupling and generated photocurrent is observed. Our demonstration enables electrical control and stabilization of semiconductor quantum emitters.

2.5 kV/1.95 GW/cm² AlGaN/GaN-Based Lateral Schottky Barrier Diodes With a High-k Field Plate to Reduce Reverse Current

2.5 kV/1.95 GW/cm² AlGaN/GaN-Based Lateral Schottky Barrier Diodes With a High-<i>k</i> Field Plate to Reduce Reverse Current

Heteroepitaxially grown homojunction gallium oxide PN diodes using ion implantation technologies

Although advancements in n- and p-doping of gallium oxide (Ga2O3) are underway, the realization of functional pn diodes remains elusive. Here, we present the successful fabrication of a Ga2O3 pn diode utilizing ion implantation technology. The Ga2O3 epilayers were grown on c-plane sapphire substrates by metalorganic chemical vapor deposition (MOCVD). P-type conductivity Ga2O3 epilayer, confirmed by Hall effect analysis, was achieved by phosphorus (P) ion implantation followed with a rapid thermal annealing (RTA) process. This p-Ga2O3 epilayer reveals a significant reduction in resistivity (<106) compared to undoped Ga2O3, demonstrating the successful inclusion and activation of P within the crystal lattice. X-ray diffraction analysis shows that the Ga2O3 epilayers were grown in high crystal quality. Although the crystallinity of Ga2O3 was slightly degraded after P ion implantation, the structure was recovered to high-quality crystal after RTA treatment. For the device structure, p-type Ga2O3 was formed first, followed n-type Ga2O3 regrowth to create a pn junction diode. The obtained results demonstrate a built-in voltage of 4.8 V, 4.2 V, and 4.308 V from simulation, fabricated pn diodes measured by I–V and C–V, respectively. A high breakdown voltage of 900 V was also obtained for the lateral pn diode grown on sapphire substrate. As concerning temperature stability, I–V curves of Ga2O3 pn diode were measured from 25oC to 150oC in steps of 25 °C. At elevated temperatures, for both forward and reverse biases, consecutive increasing currents were measured. These could be resulted from dominant diffusion and drift currents over recombination current at a given bias. In addition, the reverse current saturated (@V > 3kT/q) and remained very low at 2✕10−8 A, as the diode operated at 150oC. The behavior could be due to Ga2O3 being a wide bandgap material.

Field emission characteristics of AlGaN/GaN nanoscale lateral vacuum diodes

We report the design, fabrication, and measurement of the field emission (FE) characteristics of AlGaN/GaN nanoscale lateral vacuum diodes with triangular cathodes and cathode to anode spacings from 50 to 600 nm. The FE characteristics of the AlGaN/GaN diodes with metallic or AlGaN/GaN anodes show successful rectification with forward bias FE current in the range of microamperes or milliamperes, respectively, when biased within a maximum range varying from 10 to 30 V. In the forward bias mode, the measured current Im vs applied anode to cathode bias Vm are well fitted to Murphy–Good profiles associated with FE at higher biases, and an Ohmic leakage profile below the threshold for FE. Our results are the first successful demonstration of FE of electrons between the two two-dimensional electron gases (2DEGs) present on both sides of a nanogap formed by electron lithography through an AlGaN/GaN heterojunction. A qualitative explanation of the loop-type FE characteristics of both AlGaN/GaN vacuum diodes, with either metallic or AlGaN/GaN anodes, is presented.

Study of optical float-zone grown gallium oxide Schottky barrier diode

β−Ga2O3 based lateral Schottky barrier diodes are fabricated using Ni/Au as Schottky contact and Ti/Au as Ohmic contact. The Sn-doped β−Ga2O3 sample is grown by the optical float-zone technique. The effect of trenches, which are used for mesa isolation, on breakdown voltage is investigated. The device shows near-ideal characteristics in terms of built-in potential. The parasitic series and shunt resistances are extracted, and their dependency on temperature is established. Modeling of temperature-dependent reverse leakage current is demonstrated using the thermionic emission model, Poole–Frenkel emission model, and Fowler-Nordheim tunneling mechanism. The procedure to extract relevant parameters is explained in terms of bias and temperature dependency. The combined model shows excellent agreement with experimental data over a wide range of bias and temperature. The maximum electric field of 2.3 MV cm−1 is achieved.

Buried InGaAs/InP quantum wells selectively grown on SOI for lateral membrane laser diodes

The monolithic integration of energy-efficient and high-speed III–V lasers on silicon-on-insulator (SOI) platform in a cost-effective and scalable manner is the crux for the ubiquitous application of Si photonics in various applications. Here, aiming for lateral p-i-n membrane laser diodes, we report the growth of InGaAs/InP multi-quantum wells (MQWs) buried inside InP membranes on (001) SOI wafers using the lateral aspect ratio trapping method. We first obtain uniform InP membranes through careful tuning of a low-temperature nucleation layer, effectively trapping crystalline defects at the InP/Si heterogeneous interface and obtaining dislocation-free InP crystals away from the interface. We then construct buried (110)-oriented InGaAs/InP MQWs emitting in the telecom wavelengths by engineering the faceting of the InP membrane to enable the epitaxy of InGaAs alloy on (110) planes. These as-grown InGaAs/InP MQWs are fully embedded inside the InP membrane and provide effective confinement of both light and charged carriers. Our results demonstrate an elegant solution for future lateral membrane laser diodes directly grown on SOI wafers.

Rutile-type Ge x Sn1−x O2 alloy layers lattice-matched to TiO2 substrates for device applications

We report the characterization and application of mist-CVD-grown rutile-structured Ge x Sn1−x O2 (x = ∼0.53) films lattice-matched to isostructural TiO2(001) substrates. The grown surface was flat throughout the growth owing to the lattice-matching epitaxy. Additionally, the film was single-crystalline without misoriented domains and TEM-detectable threading dislocations due to the coherent heterointerface. Using the Ge0.49Sn0.51O2 film with a carrier density of 7.8 × 1018 cm−3 and a mobility of 24 cm2V−1s−1, lateral Schottky barrier diodes were fabricated with Pt anodes and Ti/Au cathodes. The diodes exhibited rectifying properties with a rectification ratio of 8.2 × 104 at ±5 V, showing the potential of Ge x Sn1-x O2 as a practical semiconductor.

Test concept for a direct correlation between dislocations and the intrinsic degradation of lateral PIN diodes in GaN-on-Si under reverse bias

Although often discussed, the role of threading dislocations (TDs) in the degradation of lateral GaN-on-Si p-GaN HEMTs under reverse bias stress test (RBST) has never been clearly shown in experiment until today. Here we present a novel test concept to establish a direct correlation between dislocations and degradation sites in RBST and demonstrate it on lateral p-GaN/AlGaN/GaN PIN diodes. By scaling down structures down to ~500 nm width, the point of degradation is always forced to be located at a defined position, independent of the local position of TDs. Furthermore, an integrated serial p-GaN resistor has been implemented with the PIN diode, which effectively limits the current and protects the device from a large meltdown due to parasitic capacitances and enables TEM analysis of structural degradation. A large quantity of lateral PIN devices exhibit a similar time-to-breakdown under RBST, indicating the intrinsic nature of this failure mode. Planar TEM analysis of a degraded and failed device clearly reveals structural damages and a breakdown of the AlGaN barrier as the failure signature. A combined planar and cross-sectional TEM lamella analysis approach of the expected failure site was introduced and applied. The results unambiguously show, that the observed degradation in the AlGaN barrier, which is attributed to the intrinsic failure mode, is not directly linked to the position of a dislocation.

Doping-modulated lateral asymmetric Schottky diode as a high-performance self-powered synaptic device.

In the post-Moore era, the gradually saturated computational capability of conventional digital computers showing the opposite trend as the exponentially increasing data volumes imperatively required a platform or technology to break this bottleneck. Brain-inspired neuromorphic computing promises to inherently improve the efficiency of information processing and computation by means of the highly parallel hardware architecture to reduce global data transmission. Here, we demonstrate a compact device technology based on the barrier asymmetry to achieve zero-consumption self-powered synaptic devices. In order to tune the device behaviors, the typical chemical doping is used to tailor the asymmetry for energy harvesting. Finally, in our demonstrated devices, the open-circuit voltage (VOC) and power-conversion efficiency (PCE) can be modulated up to 0.77 V and 6%, respectively. Optimized photovoltaic features affords synaptic devices with an outstanding programming weight states, involving training facilitation, stimulus reinforce and consolidation. Based on self-powered system, this work further presents a highly available modulation scheme, which achieves excellent device behaviors while ensuring the zero-energy consumption.

Lead halide perovskite sensitized WSe2 photodiodes with ultrahigh open circuit voltages

Two-dimensional semiconductors (2DSCs) have attracted considerable interests for optoelectronic devices, but are often plagued by the difficulties in tailoring the charge doping type and poor optical absorption due to their atomically thin geometry. Herein, we report a methylammonium lead iodide perovskite (CH3NH3PbI3)/2DSC heterojunction device, in which the electric-field controllable ion migration in the perovskite layer is exploited to induce reversible electron- and hole-doping effects in the underlying monolayer tungsten diselenide (WSe2) to form a programmable p–n photodiode. At the same time, the CH3NH3PbI3 layer functions as a highly efficient sensitization layer to greatly boost the optical absorption and external quantum efficiency (EQE) of the resulting photodiode. By asymmetrically poling the perovskite layer, gold-contacted CH3NH3PbI3/WSe2 devices show a switchable open circuit voltage up to 0.78 V, along with a high EQE of 84.3%. The integration of tunable graphene-contacts further improves the photodiode performance to achieve a highest open circuit voltage of 1.08 V and a maximum EQE of 91.3%, greatly exceeding those achieved previously in 2DSC lateral diodes. Our studies establish a non-invasive approach to switch optoelectronic functions and open up a new avenue toward high-performance reconfigurable optoelectronic devices from 2DSCs.

Lateral p-type GaN Schottky barrier diode with annealed Mg ohmic contact layer demonstrating ideal current–voltage characteristic

We have demonstrated the fabrication process for a lateral p-type Schottky barrier diode (SBD) with the annealed Mg ohmic contact layer on a MOVPE-grown p-GaN wafer and measured the electrical characteristic of the diode. Because of the selective-area ohmic contact, the interface between the Schottky electrode and p-type GaN is well protected from any damage introduced by dry-etching or regrowth. The ideality factor of the forward current–voltage characteristic is as low as 1.09 at room temperature and an on–off ratio above 109 is also achieved. Various metals are deposited as the Schottky electrode and the work function dependence of the Schottky barrier height is confirmed with a pinning factor of 0.58. The temperature dependence of the current–voltage characteristic indicates that the GaN p-type SBD still fits the thermionic emission mode at 600 K with an ideality factor of 1.1. The reverse current of the p-SBD is also studied with the Poole–Frenkel emission model, and the trap energy level in the p-GaN is confirmed.

Ultrathin All-2D Lateral Diodes Using Top and Bottom Contacted Laterally Spaced Graphene Electrodes to WS2 Semiconductor Monolayers

The ultrathin nature of two-dimensional (2D) materials opens up opportunities for creating devices that are substantially thinner than using traditional bulk materials. In this article, monolayer 2D materials grown by the chemical vapor deposition method are used to fabricate ultrathin all-2D lateral diodes. We show that placing graphene electrodes below and above the WS2 monolayer, instead of the same side, results in a lateral device with two different Schottky barrier heights. Due to the natural dielectric environment, the bottom graphene layer is wedged between the WS2 and the SiO2 substrate, which has a different doping level than the top graphene layer that is in contact with WS2 and air. The lateral separation of these two graphene electrodes results in a lateral metal-semiconductor-metal junction with two asymmetric barriers but yet retains its ultrathin form of two-layer thickness. The rectification and diode behavior can be exploited in transistors, photodiodes, and light-emitting devices. We show that the device exhibits a rectification ratio up to 90 under a laser power of 1.37 μW at a bias voltage of ±3 V. We demonstrate that both the back-gate voltage and laser illumination can tune the rectification behavior of the device. Furthermore, the device can generate strong red electroluminescence in the WS2 area across the two graphene electrodes under an average flowing current of 2.16 × 10-5 A. This work contributes to the current understanding of the 2D metal-semiconductor heterojunction and offers an idea to obtain all-2D Schottky diodes by retaining the ultrathin device concept.

A controllable conduction-type photovoltaic effect in MoTe2

In this study, we unveiled that a conduction type can be controlled from the 2H-MoTe2 ambipolar semiconducting phase to the selective opposite n-type or p-type FETs. The polarity inversion has been achieved through the trapped interface states that exist between h-BN and SiO2 upon illumination with an external gate voltage. For the n-type doping effect, we found that it has a positive coefficient with the thickness of h-BN but the p-type doping was not achieved with a thickness of 50 nm or beyond. For the n-type MoTe2 FET, the carrier concentration n(n−MoTe2) and mobility μ(n−MoTe2) were calculated to be ∼2.07 × 1012 cm−2 and ∼20.17 cm2/V/s, respectively, while for the p-type FET n(p−MoTe2) and μ(p−MoTe2) are ∼2.16 × 1012 cm−2 and ∼24.04 cm2/V/s, respectively. Moreover, we also develop a lateral PIN diode with an intrinsic region that was in-between n- and p-type FETs. An electrical performance was also monitored, and an ideal rectifying behavior was reached with a rectification ratio (IfIr) of almost >106. The PIN diode also exhibits a self-biased photovoltaic behavior with an open-circuit voltage (Voc = 440.9 mV). This research work may pave the way for fabricating photodiodes with low power consumption using transition metal dichalcogenides materials.

Theoretical Prediction of Semiconductor-Free Negative Differential Resistance Tunnel Diodes with High Peak-to-Valley Current Ratios Based on Two-Dimensional Cold Metals

The negative differential resistance (NDR) tunnel diodes are promising alternative devices for beyond-CMOS (complementary metal oxide semiconductor) computing because they offer several potential applications when integrated with transistors. We propose a semiconductor-free NDR tunnel diode concept that exhibits an ultrahigh peak-to-valley current ratio (PVCR) value. Our proposed NDR diode consists of two cold metal electrodes separated by a thin insulating tunnel barrier. The NDR effect stems from the unique electronic band structure of the cold metal electrodes; i.e., the width of the isolated metallic bands around the Fermi level as well as the energy gaps separating higher- and lower-lying bands determine the current–voltage (I–V) characteristics and the PVCR value of the tunnel diode. By proper choice of the cold metal electrode materials, either a conventional N-type or Λ-type NDR effect can be obtained. Two-dimensional (2D) nanomaterials offer a unique platform for the realization of proposed NDR tunnel diodes. To demonstrate the proof of concept, we employ the nonequilibrium Green function method combined with density functional theory to calculate the I–V characteristic of the lateral (AlI2/MgI2/AlI2) and vertical (NbS2/h-BN/NbS2) heterojunction tunnel diodes based on 2D cold metals. For the lateral tunnel diode, we obtain a Λ-type NDR effect with an ultrahigh PVCR value of 1016 at room temperature, while the vertical tunnel diode exhibits a conventional N-type NDR effect with a smaller PVCR value of about 104. The proposed concept provides a semiconductor-free solution for NDR devices to achieve the desired I–V characteristics with ultrahigh PVCR values for memory and logic applications.

Interface engineering in epitaxial growth of sputtered β-Ga2O3 films on Si substrates via TiN (111) buffer layer for Schottky barrier diodes

The native amorphous silicon oxide (SiO2) layer formed on the Si substrate leads to the (100) preferred orientation for β-phase gallium oxide (β-Ga2O3), which encounters various defects in β-Ga2O3, such as twin boundaries and stacking faults etc. The (111) preferred orientation of titanium nitride (TiN) hetero-buffer layer can be used in the interface between β-Ga2O3 and Si substrates to reduce the lattice mismatch between them and increase the (˗201) preferred orientation for β-Ga2O3. The lattice mismatch between TiN (111) and β-Ga2O3 (˗201) is 0.76%, which is less than the β-Ga2O3 (˗201)/Si (111) about ˗6.3%. The β-Ga2O3 and TiN films were grown using radio-frequency magnetron sputtering on Si substrates, which possess polycrystalline nature as revealed using X-ray diffraction patterns and high-resolution transmission electron micrographs. The optimal parameters are found as, process atmosphere: Ar = 10 sccm, RTA: 800 °C for β-Ga2O3/TiN (300 nm)/Si. This work highlights the effect of the TiN hetero-buffer layer, the process atmosphere, and annealing temperatures on the microstructural and surface morphology of β-Ga2O3 films. The lateral Schottky barrier diode (SBD) were fabricated using the optimized β-Ga2O3/TiN (300 nm)/Si film. The Baliga's Figure of Merit (BFOM) of the lateral SBD is 7.60 × 10−2 kW/cm2, which exhibits 4 order of BFOM higher than that of β-Ga2O3/Si SBD due to interface engineering. The β-Ga2O3/TiN (300 nm)/Si hetero-structure demonstrates a promising material to be employed in the next generation β-Ga2O3 based power devices.