In manufacturing electronic devices embedded in flexible substrates, persistent technical challenges include process complexity, substrate damage, high surface roughness, and low mechanical flexibility. To address these challenges, this study proposes a method that involves simultaneously sintering silver nanoparticles (Ag NPs) and embedding them in polyethylene terephthalate (PET) substrates to fabricate flexible embedded electrodes. The proposed technique uses laser-generated high-intensity shock waves to compress Ag NPs coated on a PET substrate heated to its glass-transition temperature. The mechanical impact of the shock wave embeds the Ag NPs into the substrate while simultaneously sintering the particles. The thin-film Ag electrode fabricated using the proposed method exhibited outstanding electrical and mechanical properties. The electrical resistivity measured as low as 7.8 μΩ·cm, with a minimal increase of approximately 5 % after 2000 bending cycles at a bending radius of 1 mm. Furthermore, the fracture strength of the fully embedded electrode, as assessed through adhesive tape-peel tests, significantly surpassed that produced through conventional sintering methods. The proposed method has the potential to revolutionize conventional sintering methods in flexible substrate applications, offering a more efficient and reliable method for fabricating flexible embedded electrodes.