On closer analysis, the apparently simple act of sliding two contacting substrates relative to one another reveals a myriad of fundamental physical questions that have a broad technical application. Present semiconductor manufacturing imperatives require that planarization uniformity be maintained over length scales spanning 8 orders of magnitude, 1 from gate lengths of 32 nm to wafer diameters of 300 mm. Economic realities continue to drive yield targets ever higher. In this environment, process engineers seek to improve all manufacturing techniques, including chemical mechanical planarization CMP. Stick-slip behavior, and the large lateral forces associated with it, is an indication of reduced polish quality. 2,3 Stick-Slip As two surfaces slide past one another, their relative motion can be categorized into two regimes. The smooth polishing regime exhibits a stable, unchanging relative velocity, whereas stick-slip is identified by a relative velocity that alternates between near zero and some nonzero value at a high frequency. Hence, the stick-slip name, the surface alternates between sticking to the substrate and sliding past the substrate. 4 In many applications, to avoid stick-slip, a thin layer of fluid is introduced between the two surfaces, eliminating contact. This relative motion in which one surface is supported by a thin fluid layer is often characterized as hydrodynamic lubrication. 5 However, material removal during CMP requires some degree of contact; thus, process engineers must walk a fine line between acceptable contact and removal rates vs unacceptably high contact and the resultant stick-slip. 6,7 Intuitively, it is easy to postulate an increase in defectivity and reduction in polish quality resulting from stick-slip. Nevertheless, literature is sparse in this regard, indicating a possible avenue for investigation. CoF