Journal Of Solid-State Circuits Research Articles

Guest Editorial 2022 Custom Integrated Circuits Conference

This Special Issue of the IEEE Journal of Solid-State Circuits (JSSC) features expanded versions of key articles presented at the 2022 Custom Integrated Circuits Conference (CICC), which was a hybrid event, with in-person and virtual sessions. This was the first IEEE Solid-State Circuits Society (SSCS) conference to come back from the COVID-19 pandemic as an in-person and virtual event.

Guest Editorial Introduction to the Special Issue on the 2022 IEEE International Solid-State Circuits Conference (ISSCC)

The International Technical Program Committee (ITPC) of the IEEE International Solid-State Circuits Conference (ISSCC) selects outstanding articles from the papers presented at the conference and invites the authors to submit an extended manuscript to the special issue of IEEE Journal of Solid- State Circuits (JSSC). This January issue contains the selected papers from the Digital Architectures and Systems, Digital Circuits, Machine Learning, Memory, and Wireline subcommittees.

Guest Editorial Introduction to the Special Issue on the 2022 IEEE International Solid-State Circuits Conference (ISSCC)

The International Technical Program Committee (ITPC) of the IEEE International Solid-State Circuits Conference (ISSCC) selects outstanding articles from the papers presented at the conference and invites the authors to submit an extended manuscript to the Special Issue of IEEE Journal of Solid-State Circuits (JSSC). This November issue contains the selected papers from the Imagers, microelectromechanical systems (MEMS), and Displays (IMMD) and the Technology Directions (TD) sub-committees. Papers from Analog, Data Converters, Power Management, RF, and Wireless subcommittees are included in the December issue. Finally, the January issue will contain papers from Digital Architectures and Systems, Digital Circuits, Machine Learning, Memory, and Wireline subcommittees.

Guest Editorial Introduction to the Special Section on the 2021 Asian Solid-State Circuits Conference (A-SSCC)

The Special Issue of the IEEE Journal of Solid- State Circuits (JSSC) includes some of the highlights of the best papers presented at the 2021 Asian Solid-State Circuits Conference (A-SSCC). This year, the A-SSCC 2021 is held as a hybrid conference on November 7–10, 2021 with attendees having the option to join the in-person meeting in Busan, Korea, or participate virtually through on-line platform. As one of the five conferences fully sponsored by the IEEE Solid-State Circuits Society, the A-SSCC was in its 17th appearance in 2021 since its inauguration in 2005 in Taiwan. Rotating among Asian countries, the A-SSCC is quickly becoming one of the leading global forums for the presentation of advances in solid-state circuits and system-on-a-chip (SoC). From 2021, only two-page format articles are allowed for submission and publication.

Guest Editorial Message From the Outgoing Editor-in-Chief

My three-year term as the Editor-in-Chief of the IEEE JOURNAL OF SOLID- STATE CIRCUITS (JSSC) has ended. Serving the Journal’s readers and authors has been a great privilege and honor. Outstanding Associate Editors, Guest Editors, and reviewers who helped the Journal with great diligence and remarkable commitment to excellence have played a unique role in fulfilling the tremendous responsibility the Solid-State Circuits Society (SSCS) bestowed upon me. Thanks to their efforts, the Journal continues to be one of the most widely read and cited among all the IEEE publications. I feel a deep sense of gratitude to them for their efforts.

Message From the Incoming Editor-in-Chief

I Would like to thank the Solid-State Circuits Society (SSCS) leadership and Administrative Committee for appointing me as the new Editor-in-Chief (EiC) of the IEEE Journal of Solid- State Circuits (JSSC). It is both a great honor and opportunity to lead the flagship SSCS journal. I want to additionally thank the outgoing EiC Prof. Pavan Hanumolu of University of Illinois at Urbana–Champaign, who has been very helpful in the transition this year.

Special Section on the 47th IEEE European Solid-State Circuits Conference (ESSCIRC)

This Special Section of the IEEE Journal of Solid-State Circuits (JSSC) features extended versions of articles invited to be submitted from those presented at the 47th European Solid-State Circuits Conference (ESSCIRC) which is held fully virtually due to the COVID-19 pandemic. ESSCIRC 2021 consisted of three main parts: a preamble week providing access to the virtual content from September 6 to November 30, 2021, an interactive conference week for the live broadcast of joint plenary and keynote presentations and live Q&A sessions between September 13–17, 2021, and lastly, an educational week for live Q&A sessions for all educational events during September 20–22, 2021.

Guest Editorial Introduction to the Special Section on the 2021 RFIC Symposium

This Special Issue of the IEEE Journal of Solid-State Circuits (JSSC) features a Special Section on key invited papers presented at the 2021 Radio Frequency Integrated Circuits Symposium (RFIC Symposium), held in hybrid mode on June 6–8 (in-person) and June 21–July 20, 2021 (online). The RFIC Symposium is the world’s premier conference focused on RF and millimeter-wave (mm-wave)-integrated circuits and systems technology. It shares the venue with the IEEE MTT-S International Microwave Symposium (IMS) as part of the Microwave Week and is co-sponsored by the IEEE Solid-State Circuits Society.

Guest Editorial 2021 Custom Integrated Circuits Conference

This Special Section of the IEEE Journal of Solid-State Circuits (JSSC) features expanded versions of key articles presented at the 2021 Custom Integrated Circuits Conference (CICC), which for the second time in a row was fully virtual due to the coronavirus pandemic. Originally planned to be held in Austin, TX, USA, the unpredictability of COVID-19 quickly lead the conference organization to decide to (again) go for a fully virtual format from April 25 to 30, 2021. With all the experience of the previous year, where CICC was the first IEEE Solid-State Circuits Society (SSCS) conference to go virtual, and that of subsequent SSCS and other conferences, it was comparatively smooth sailing.

Guest Editorial Introduction to the Special Issue on the 2021 IEEE International Solid-State Circuits Conference (ISSCC)

The International Technical Program Committee (ITPC) of the IEEE International Solid-State Circuits Conference (ISSCC) selects outstanding articles from the papers presented at the conference and invites the authors to submit a manuscript to the special issue of IEEE Journal of Solid-State Circuits (JSSC). The manuscripts offer extended materials such as in-depth circuit descriptions, more experimental results, and benchmarking data. The manuscripts subsequently undergo a rigorous review process. This November issue contains the selected papers from the Imagers, MEMS, and Displays (IMMD) and the Technology Directions (TD) subcommittees. Papers from Analog, Data Converters, Power Management, RF, and Wireless subcommittees are included in the December issue. Finally, the January issue will contain papers from Digital Architectures and Systems, Digital Circuits, Machine Learning, Memory, and Wireline subcommittees.

Introduction to the Special Section on the 2020 Asian Solid-State Circuits Conference (A-SSCC)

This Special Issue of the IEEE Journal of Solid-State Circuits (JSSC) includes some of the highlights of the best papers presented at the 2020 Asian Solid-State Circuits Conference (A-SSCC), which was held on November 9–11, 2020. A-SSCC 2020 was originally planned to be held in Hiroshima, Japan. However, due to COVID-19, A-SSCC 2020 had to become a virtual conference. As one of the five conferences fully sponsored by the IEEE Solid-State Circuits Society, the A-SSCC was in its 16th appearance in 2020 since its inauguration in 2005 in Taiwan. Rotating among Asian countries, the A-SSCC is quickly becoming one of the leading global forums for the presentation of advances in solid-state circuits and system-on-a-chip (SoC). From 2018, this conference accepts field-programmable gate array (FPGA) papers for presentation and demo and allows two-page format papers for submission and publication.

Guest Editorial Introduction to the Special Section on the 2020 IEEE BCICTS Conference

This Special Section of the IEEE JOURNAL OF SOLID- STATE CIRCUITS (JSSC) features expanded versions of key invited papers that were presented at the 2020 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), which was held virtually on November 16–19, 2020.

Guest Editorial Introduction to the Special Section on the 2020 RFIC Symposium

This Special Issue of the IEEE Journal of Solid-State Circuits (JSSC) features a Special Section on key invited papers presented at the 2020 Radio Frequency Integrated Circuits Symposium (RFIC Symposium), held virtually on August 4–6, 2020.

Introduction to the Special Issue on the 2020 IEEE International Solid-State Circuits Conference (ISSCC)

It is an annual tradition ever from the start of the IEEE Journal of Solid-State Circuits (JSSC) in 1966 to publish extended manuscripts of a selected set of papers presented at the annual International Solid-State Circuits Conference (ISSCC). In this November issue, you will find selected papers from the Imagers, Medical, MEMS, and Displays (IMMD) and the Technology Directions (TD) sessions. Most of the bio-related papers are covered in these topics. Next month, the sessions of Analog, Power Management, Data Converters, RF, and Wireless will be covered, and in January, you will find the selected papers from the Wireline, Digital Circuits, Digital Architectures and Systems, Memory, and Machine Learning subcommittees.

Introduction to the Special Section on the 2019 Asian Solid-State Circuits Conference (A-SSCC)

This Issue of the IEEE Journal of Solid-State Circuits (JSSC) includes some of the highlights of the best papers from the 2019 Asian Solid-State Circuits Conference (A-SSCC), which was held at The Parisian Macao, Macao, China, on November 4–6, 2019. As one of the five conferences fully sponsored by the IEEE Solid-State Circuits Society, the A-SSCC was in its 15th appearance in 2019 since its inauguration in 2005 in Taiwan. Rotating among Asian countries, the A-SSCC is quickly becoming one of the leading global forums for the presentation of advances in solid-state circuits and system-on-a-chip (SOC). From 2018, this conference accepts field-programmable gate array (FPGA) papers for presentation and demo and allows two-page format papers for submission and publication.

Guest Editorial Special Section on the 45th IEEE European Solid-State Circuits Conference (ESSCIRC)

This Special Section of the IEEE JOURNAL OF SOLID- STATE Circuits (JSSC) features expanded versions of articles selected from those presented at the 45th ESSCIRC Conference, held in Krakow, Poland, during September 23–26, 2019.

Introduction to the Special Section on the 2019 RFIC Symposium

This Special Section of the IEEE Journal of Solid-State Circuits (JSSC) covers expanded articles from the 2019 Radio Frequency Integrated Circuits Symposium (RFIC Symposium), which was held on June 2–4, 2019, in Boston, MA, USA.

Introduction to the Special Section on the 2019 IEEE International Solid-State Circuits Conference (ISSCC)

It has been an annual tradition ever since the start of the IEEE journal of solid-state circuits (JSSC) in 1966 to publish extended manuscripts of a selected set of articles presented at the annual International Solid-State Circuits Conference (ISSCC). In this November issue, you will find selected articles from the Imagers, Medical, MEMS, and Displays (IMMD) and the Technology Directions (TD) sessions. Most of the bio-related articles are covered in these topics. Next month, the sessions of Analog, Power Management, Data Converters, RF, and Wireless will be covered, and in January, you will find the selected articles from the Wireline, Digital Circuits, Digital Architectures and Systems, and Memory subcommittees.

Introduction to the Special Section on the 2018 Asian Solid-State Circuits Conference (A-SSCC)

This issue of the IEEE Journal of Solid-State Circuits (JSSC) includes some of the highlights of the best papers from the 2018 Asian Solid-State Circuits Conference (A-SSCC), which was held at the Shangri-La’s Far Eastern Plaza Hotel, Tainan, Taiwan, on November 5–7, 2018. As one of the five conferences fully sponsored by the IEEE Solid-State Circuits Society, the A-SSCC was in its 14th appearance in 2018 since its inauguration in 2005 in Taiwan. Rotating among Asian countries, the A-SSCC is quickly becoming one of the leading global forums for the presentation of advances in solid-state circuits and system-on-a-chip (SOC). From 2018, this conference accepts field-programmable gate array (FPGA) papers for presentation and demo and allows two-page format papers for submission and publication.

Message From the Incoming Editor-in-Chief

It is a great honor to follow Dr. Jan Craninckx, the Editor-in-Chief of the IEEE Journal of Solid-State Circuits (JSSC). I have had the privilege of serving on the JSSC Editorial Board for his entire tenure as the Editor-in-Chief and witnessed firsthand the outstanding job he has done managing the journal. His commitment to excellence, fairness, and efficacy was self-evident and was crucial not only in maintaining the high quality that is expected in the journal but also in taking it to new heights. Dr. Craninckx, like his illustrious predecessors, worked very hard to make sure JSSC not only remained the top journal in its field but also one of the best-managed ones. For that, we owe a great debt of gratitude to Dr. Craninckx and all the other past editors.