This paper focuses on the electrochemical joining of additively manufactured components using simulation-based and experimental methods. The study investigates the influence of cover screens on the filling behavior of the joining zone. Experimental methods involving additive manufacturing and electroplating are combined with simulation models to provide a realistic representation of the joining process. The results show a good agreement between the simulated and experimental findings, indicating the applicability of the simulation model. The parameter study reveals that higher cover factors result in a decrease in the excess material ratio, indicating reduced material deposition outside the joining zone. The filling time required to completely fill the joining zone is influenced by both the cover size and the opening angle of the joining zone. The optimal parameter combinations depend on whether the filling time or the excess material volume is to be minimized. Cavity formation within the joining zone was identified as a critical factor affecting the completeness of the filling. The study provides insights into the influence of cover screens on the electrochemical joining process and offers guidance for optimizing the design of the joining zone.